2025年
Zhao LB, Dai YW*, Qin F. (2025). Deep learning assisted prediction on main factors influencing shear strength of sintered nano Ag-Al joints under high temperature aging. Engineering Failure Analysis, 167, 109028.
2024年
Chen ZY, Dai YW*, Liu YH*. Structural fatigue crack propagation simulation and life prediction based on improved XFEM-VCCT., Engineering Fracture Mechanics, 2024, 310(8), 110519
于鹏举，代岩伟*，秦飞. 基于SVR数据驱动模型的SiC功率器件关键互连结构热疲劳寿命预测研究，电子与封装，2024，12（已录用）
Kong WC, Dai YW*,Liu YH*.A higher-order asymptotic solution for 3D sharp V-notch front tip fields in creeping solids, Engineering Fracture Mechanics, 2024, 306, 110256.
Chen ZY, Dai YW*, Liu YH*. Crack propagation simulation and overload fatigue life prediction via enhanced physics-informed neural networks. International Journal of Fatigue, 2024, 186, 108382.
Dai YW, Wei JH, Qin F, Recurrent neural network (RNN) and long short-term memory neural network (LSTM) based data-driven methods for identifying cohesive zone law parameters of nickel-modified carbon nanotube reinforced sintered nano-silver adhesives, Materials Today Communications, 2024, 6(39), 108991.
Dai YW, Wang JF, Yu JR, Liu ME, F Qin. Pre-notch and pre-crack size effects on T-peel fracture behaviors of SAC305 solder joints, Theoretical and Applied Fracture Mechanics, 131 (2024) 104397.
Dai YW, Zhao LB, Qin F, Chen S. Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters, Soldering & Surface Mount Technology, 2024, DOI: 10.1108/SSMT-12-2023-0076
代岩伟，隗嘉慧，秦飞. 基于数据驱动的纳米烧结银内聚力模型参数反演与预测. 电子与封装, 2024, 24(1): 010601 .
Dai YW, Zan, Z., Zhao, L. Qin F. Nanoindentation elastoplastic and creep behaviors of sintered nano-silver doped with nickel-modified multiwall carbon nanotube filler. J. Electron. Mater. 53, 1035–1057 (2024).
Dai YW, Zhao LB, Zan Z, Qin F. Mode I fracture of sintered nano-silver doped with nickel-coated multiwall carbon nanotube. Materials Science in Semiconductor Processing (2024) 174, 108171.
LB Zhao, YW Dai*, JH Wei, F Qin*. Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging, Fatigue & Fracture of Engineering Materials & Structures, 2024;47(3):766‐780.
2023年
代岩伟*，秦飞，于鹏举，李逵. 基于数据驱动的电子封装焊点疲劳寿命预测方法研究进展与挑战，微电子学与计算机，2023，40（11）：43-52.
代岩伟*，秦飞. ChatGPT在材料力学教学中的应用前景和风险因素探讨，中国教育技术装备，2024，12，37-39.
Jiahui Wei, YW Dai*, F Qin. Inverse identification of cohesive zone parameters for sintered nano-silver joints based on dynamic convolution neural network. Engineering Fracture Mechanics, 2023, 292, 109651.（JCR Q1）
YW Dai*, YN Li, Z Zan, F Qin*. Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests. Fatigue & Fracture of Engineering Materials & Structures, 2023, 46(6): 2062-2079.（JCR Q2）
YW Dai*#, S Zhao#, F Qin*, T An, YP Gong, P Chen. Shear fracture resistance enhancement through micropatterning on copper substrate for sintered nano silver joints, International Journal of Adhesion and Adhesives, 2023, 125, 103422.（JCR Q2）
Liu W, Dai YW*, Liu YH*, Kong W. Effects of nonproportional loading and residual stress on creep crack tip fields. Engineering Fracture Mechanics, 2023, 281, 109139.（JCR Q1）
Zhang M, Qin F*, Chen S, Dai YW*, Jin Y, Chen P, An T, Gong YP. Holding time effect on mechanical properties and protrusion behaviors of through silicon via copper under various annealing processes, Materials Science in Semiconductor Processing, 2023, 158, 10735.（JCR Q2）
Zhang M, Qin F*, Chen S, Dai YW*, Jin Y, Chen P, An T, Gong YP. Effect of capped Cu layer on protrusion behaviors of through Silicon Via Copper (TSV-Cu) under double annealing conditions: Comparative study, IEEE Transactions on Device and Materials Reliability, 2023, 23(1): 89-98.
Chen ZY, Dai YW, Liu YH*. Numerical study on high-cycle fatigue crack growth of sinusoidal interface based on cyclic cohesive zone model. International Journal of Fatigue, 2023, 174, 107748.（JCR Q1）
Chen ZY, Dai YW, Liu YH*. Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method. Engineering Fracture Mechanics, 2023, 289, 109445.（JCR Q1）
孙国立, 秦飞, 代岩伟, 李宝霞. 基于层级多尺度方法的 TSV 晶圆翘曲预测模型研究. 微电子学与计算机, 2023，40(1), 130-137.
张谋, 秦飞, 代岩伟. 包镍多壁碳纳米管增强 SAC305 焊料的 I 型断裂机理研究. 微电子学与计算机, 2023，40(1), 124-129.
代岩伟，昝智，赵帅，李妍凝，秦飞. 一种可控温的SiC芯片功率循环实验装置. 国家发明专利，授权号：ZL 2021 1 1178666.2
代岩伟，王剑锋，昝智，秦飞. 一种智能可控温的 GaN 功率循环实验装置. 国家发明专利，授权号：ZL 202111426713.0
2022年
Dai YW*, Zan Z, Zhao S, Li Y, Qin F*, Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive, Engineering Fracture Mechanics, 2022, 260, 108181.（JCR Q1）
Dai YW*, Qin F, Liu YH, Berto F, Chen HF. Characterizations of material constraint effect for creep crack in center weldment under biaxial loading. International Journal of Fracture 2022, 234, 177–193.（JCR Q2）
YW Dai, Zhi Zan, Shuai Zhao, F Qin. Mode II cohesive zone law of porous sintered silver joints with nickel coated multiwall carbon nanotube additive under ENF test, Theoretical and Applied Fracture Mechanics, 2022, 121, 103498.（JCR Q1）
YW Dai, F Qin, YH Liu, HF Chen, Influences of material mismatch on interface crack tip field in three layered creeping materials, Engineering Failure Analysis, 2022, 140, 106523.（JCR Q1）
WC Kong, YW Dai*, YH Liu*. Three-dimensional sharp V-notch stress intensity factor and strain energy rate density under creeping conditions. Engineering Fracture Mechanics, 2022, 272, 108700.（JCR Q1）
Kong WC, Dai YW*, Liu YH*, Out-of-plane effect on the sharp V-notch tip fields in power-law creeping solids: A three-dimensional asymptotic analysis, International Journal of Solids and Structures, 2022, 236–237, 111352（JCR Q2）
Zhao S, Dai YW*, Qin F*, Li YN, An T, Gong YP, Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints, Engineering Fracture Mechanics, 2022, 264: 108355.（JCR Q1）
Kong WC, Ma SF, Dai YW*, Liu YH*. Plane stress sharp V-notch tip field in pow-er-law creeping solids. Engineering Fracture Mechanics, 2022, 273, 108755.（JCR Q1）
Qin F, Zhao S, Dai YW*, Hu Y, An T, Gong Y. Mud-cracking effect of sintered silver layer on quantifying heat transfer behavior of SiC devices under power cycling: Voronoi tessellation model, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2022, 12(6), 964-972.
Qin F, Zhao S, Dai YW*, Liu L, An T, Chen P, Gong Y. Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling. Journal of Electronic Packaging-Transactions of the ASME, 2022, 144(3), 031012.
Zhang M, Qin F*, Chen S*, Dai YW*, Chen P, An T, Protrusion of through silicon via (TSV) copper with double annealing processes, Journal of Electronic Materials, 2022, 51, 2433–244
Chen Z, Bao H, Dai YW, Liu Y*. Numerical prediction based on XFEM for mixed-mode crack growth path and fatigue life under cyclic overload. International Journal of Fatigue, 2022, 162, 106943.
代岩伟, 昝智, 秦飞. 包镍碳纳米管提高烧结银的断裂韧性. 电子与封装, 2022, 22(11): 88
李逵, 吴婷, 赵帅, 郭雁蓉, 杨宇军, 代岩伟, 秦飞. 2.5D封装结构回流焊过程热应力分析. 半导体技术, 2022，47(2), 152-158.
2021年
Dai YW, Qin F, Liu YH, Chao YJ. On the second order term asymptotic solution for sharp V-notch tip field in elasto-viscoplastic solids. International Journal of Solids and Structures, 2021, 217–218, 106-122.
Dai YW, Qin F, Liu YH, Berto F, Chen HF. Characteristics and implications of material mismatch on mode II creep crack tip field: Theoretical analysis and numerical inves-tigation. Theoretical and Applied Fracture Mechanics, 2021, 114, 103035.
Dai YW, Luca Susmel, Qin F. Sharp V-notches in viscoplastic solids: Strain energy rate density rule and fracture toughness. Fatigue & Fracture of Engineering Materials & Structures, 2021; 44:28–42.
Zhao S, Dai YW*, Qin F*, Li Y, Liu L, Zan Z, An T, Chen P, Gong Y, Wang Y, On mode II fracture toughness of sintered silver based on end-notch flexure (ENF) test considering various sintering parameters, Materials Science and Engineering A，2021, 823, 141729.
Qin F, Zhao S, Liu L, Dai YW*, An T, Chen P, Gong Y. Thickness and met-allization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation. Microelectronics Reliability, 2021, 124, 114290
Li Y, Chen P, Qin F, An T, Dai YW, Zhang M, Jin Y. Constitutive modelling of annealing behavior in through silicon vias-copper. Materials Characterization, 2021, 179, 111359.
Qin F, Zhang L, Chen P, An T, Dai YW, Gong Y., ... & Wang H. In situ wireless measurement of grinding force in silicon wafer self-rotating grinding process. Mechanical Systems and Signal Processing, 2021, 154, 107550.
2020年
Dai YW, Liu YH, Qin F, Chao YJ, Chen HF. Constraint modified time dependent failure assessment diagram (TDFAD) based on C(t)-A2(t) theory for creep crack. International Journal of Mechanical Sciences, 2020, 165, 105193.
Dai YW, Liu YH, Qin F, Chao YJ, Qian GA. C (t) dominance of the mixed I/II creep crack: Part II. Extensive creep. Theoretical and Applied Fracture Mechanics, 2020, 106, 102489.
Dai YW, Qin F, Liu YH, Feng WZ, Qian GA. Estimation of C*-integral for central cracked plate under biaxial loading, International Journal of Applied Mechanics, 2020, 12(07), 2050079.
Qin F, Zhang M, Dai YW*, Chen P, An T, He HW, Zhang H, Zheng JT. Optimization of TSV interconnects and BEOL layers under annealing process through fracture evaluation. Fatigue & Fracture of Engineering Materials & Structures, 2020, 43:1433–1445.
Qin F, Zhao S, Dai YW*, Yang MK, Xiang M, Yu DQ. Study of warpage evolution and control for six-side molded WLCSP in different packaging processes. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2020, 10(4): 730-738.
Qin F, Hu YK, Dai YW*, An T, Chen P, Gong YP, Yu HP. Crack effect on the equivalent thermal conductivity of porously sintered silver. Journal of Electronic Materials. 2020, 49, 5994–6008.
Qin F, Hu YK, Dai YW*, Chen P, An T. Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model. Microelectronics Reliability. 2020, 108:113633.
Feng WZ, Gao LF, Qu M, Zhou L, Dai YW, Yang K. (2020). An improved singular curved boundary integral evaluation method and its application in dual BEM analysis of two-and three-dimensional crack problems. European Journal of Mechanics-A/Solids, 2020, 84, 104071.
2019年
Dai YW*, Liu YH, Qin F, Chao YJ, Berto F. Estimation of stress field for sharp V-notch in power-law creeping solids: An asymptotic viewpoint. International Journal of Solids and Structures, 2019, 180-181, 189-204.
Dai YW*, Liu YH, Qin F, Chao YJ. Notch stress intensity factor and C-integral evalu-ation for sharp V-notch in power-law creeping solids. Engineering Fracture Mechanics, 2019, 222, 106709.
Dai YW*, Liu YH, Qin F, Chao YJ. A unified method to solve higher order asymptotic crack-tip fields of mode I, mode II and mixed mode I/II crack in power-law creeping solids. Engineering Fracture Mechanics, 2019, 218, 106610.
Dai YW*, Liu YH, Qin F, Qian GA, Chao YJ. C (t) dominance of the mixed I/II creep crack: Part I. Transient creep. Theoretical and Applied Fracture Mechanics, 2019, 103, 102314.
Dai YW*, Zhang M, Qin F, Chen P, An T. Effect of silicon anisotropy on interfacial fracture for three dimensional through-silicon-via (TSV) under thermal loading. Engineering Fracture Mechanics, 2019, 209, 274-300.
Dai YW, Liu YH*, Chen HF. Numerical investigations on the effects of T-stress in mode I creep crack, International Journal of Computational Methods, 2019, 16(08): 1841002.
2018年及以前
Dai YW, Liu YH*, Chao YJ. Higher order asymptotic analysis of crack tip fields under mode II creeping conditions. International Journal of Solids and Structures, 2017, 125, 89-107.
Dai YW, Liu DH, Liu YH*. Mismatch constraint effect of creep crack with modified boundary layer model. Journal of Applied Mechanics-Transactions of the ASME, 2016, 83(3), 031008.
Dai YW, Liu YH*, Chen HF, Liu DH. The interacting effect for collinear cracks near mismatching bimaterial interface under elastic creep. Journal of Pressure Vessel Technology-Transactions of the ASME, 2016, 138(4), 041404.
XL Huang, YH Liu*, YW Dai. Characteristics and effects of T-stresses in central cracked unstiffened and stiffened plates under mode I loading, Engineering Fracture Mechanics, 2018,188: 393-415.
QD Xiao, YH Liu*, YW Dai. Developments of strain-based failure assessment diagram applications: measuring reference strain by displacement and a modified assessment method, International Journal of Mechanical Sciences, 2018, 140: 27-36.
XL Huang, YH Liu*, XB Huang, YW Dai. Crack arrest behavior of central-cracked stiffened plates under uniform tensions, International Journal of Mechanical Sciences, 2017, 133, 704-719.