教育经历

2009-2013，本科：西安建筑科技大学，专业：交通土建工程

2013-2016，硕士：中南大学，专业：土木工程

2017-2022，博士：鲁汶大学，专业：生物医学工程

工作经历

2016-2017，香港理工大学，研究助理

2022-2023，鲁汶大学，博士后

代表性论文

1. Fei, G., Parra-Cabrera, C., Li, Y., Dmitry E. Kravchenko, Dochy, R., Looy, L. Van, and Ameloot, R. (2023). Stereolithographic 3D printing of graded porous materials via an integrated digital exposure and selective dissolution strategy. Cell Reports Phys. Sci. 4, 101504. 10.1016/j.xcrp.2023.101504. (Cell Press, IF=7.8)

2. Fei, G., Parra‐Cabrera, C., Xia, B., Zhong, K., Clays, K., and Ameloot, R. (2023). Digital halftoning for printer-independent stereolithography of functionally graded materials. Cell Reports Phys. Sci. 10.2139/ssrn.4398982. (Accepted, Cell Press, IF=7.8)

3. Fei, G., Parra-Cabrera, C., Zhong, K., Tietze, M.L., Clays, K., and Ameloot, R. (2021). Scattering Model for Composite Stereolithography to Enable Resin–Filler Selection and Cure Depth Control. ACS Appl. Polym. Mater. 3, 6705–6712. 10.1021/acsapm.1c01519. (ACS, IF=4.9)

4. Fei, G., Nie, L., Zhong, L., Shi, Q., Hu, K., Parra-Cabrera, C., Oprins, H., Ameloot, R., and Yang, S. (2022). Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards. Mater. Today Commun. 31, 103482. 10.1016/j.mtcomm.2022.103482. (Elsevier, IF=3.7)

5. Zhong, L., Liu, W., Xi, Y., Wang, F., Chen, S., Sun, Q., Sun, Y., and Fei, G. * (2022). An Integrated Structure–Material Optimization Strategy for the Packaging of High-Voltage Insulated Gate Bipolar Transistors. IEEE Trans. Dielectr. Electr. Insul. 29, 2163–2170. 10.1109/TDEI.2022.3211225. (IEEE, IF=2.5)