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直写技术在金属布线中的应用 王卫江 郁祖湛，Proceedings of International PCB Technology/Information Forum,189, 2006
Wang XC, Cai WB, Wang WJ, Liu HT, Yu ZZ Effects of ligands on electroless Ni-P alloy plating from alkaline citrate-ammonia solution SURFACE & COATINGS TECHNOLOGY 168 (2-3): 300-306 MAY 22 2003
Wang WJ, SeufertM, Jillek W, Lenhart A, et al.Laser Induced Writing of Conductive Copper Lines for Electronic Devices 2nd International Conference papers of Electronic Product Reliabilityand Liability and liability, Hk (2004)
Wang YZ, Li X, Li HX, Wang WJ*,High resistance of an amorphous NiB/SiO2 catalyst: TP-XRD, TPR and related investigations, JOURNAL OF CHEMICAL TECHNOLOGY AND BIOTECHNOLOGY 79 (6): 549-553 JUN 2004
Li HX, Wang WJ, Chen HY, et al.Surface morphology and electronic state characterization of Ni-P amorphous alloy films J NON-CRYST SOLIDS 281 (1-3): 31-38 MAR 2001
Li HX, Wang WJ, Li H, et al.Crystallization deactivation of Ni-P/SiO2 amorphous catalyst and the stabilizing effect of silica support on the Ni-P amorphous structure J CATAL 194 (2): 211-221 SEP 10 2000
Wang WJ, Li HX, Deng JF Boron role on sulfur resistance of amorphous NiB/SiO2 catalyst poisoned by carbon disulfide in cyclopentadiene hydrogenation APPL CATAL A-GEN 203 (2): 293-300 OCT 16 2000
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