研究领域
微细加工技术
主持项目：
1)捆绑式镀锡铜箔叠层微电极负极性混粉电火花加工及箔层接缝自焊接机理，国家自然科学基金面上项目（51975385），60万元(直接经费)，执行期：2020.01-2023.12，在研。
2)三维叠层微电极振动辅助电解加工及其台阶效应与质量控制，国家自然科学基金面上项目（51575360），63万元(直接经费)，执行期：2016.01-2019.12，在研。
3)微型腔叠层滑焊成形方法及其沉积效应机理研究，国家自然科学基金面上项目（51175348），60万元，执行期：2012.01-2015.12，已结题 代表专利：
[1] 伍晓宇, 雷建国, 吴稳, 伍博, 鲁艳军, 徐斌. 微沟槽电火花加工工具电极及其制备方法, 2019.02, 中国, ZL 2017 1 0348594.9
[2] 伍晓宇, 雷建国, 钟金明, 徐斌, 郭登极, 阮双琛. 微细电解加工工具电极制备方法及装置, 2019.01, 中国, ZL 2016 1 1072820.7
[3] 伍晓宇,陆建勋, 伍朝志, 罗烽, 阮双琛. 超声波辅助等径角挤压工艺及其装置, 2017.11，中国, ZL 2015 1 0848019.6
[4] 伍晓宇, 阮双琛, 程蓉, 梁雄, 郭小勤, 彭太江. 一种金属叠层实体制造快速成形方法, 2011.1, 中国, ZL 2009 1 0105056.2
[5] 伍晓宇, 徐平, 程蓉, 梁雄, 罗烽, 彭太江. 一种金属微零件成形模具及其成形方法, 2012.8, 中国, ZL 2010 1 0553958.5
[6] 伍晓宇, 罗峰, 钟金明, 彭太江, 梁雄, 程蓉. 一种微型钣金零件拉深成形方法, 2013.10, 中国，ZL 2012 1 0059399.1
[7] 伍晓宇, 黄桂坚, 柴金龙, 梁雄, 杨海彬. 一种通用注塑模架, 2009.11, 中国, ZL 2007 1 0077046.30
[8] 伍晓宇, 费跃农, 梁雄, 李伟荣, 丁磊. 一种选择性阻焊熔化粉末快速成形方法, 2009.11, 中国, ZL 2007 1 0124246.8
[9] 伍晓宇, 梁雄, 李积彬. 一种加固型快速粉末治金模具制造方法, 2009.7, 中国, ZL 2007 1 0075882.8
近期论文
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代表期刊论文：
[1] Zhaozhi Wu, Xiaoyu Wu*, Bin Xu*, Dengji Guo, Yong Tang, Dongfeng Diao. Reverse-polarity PMEDM using self-welding bundled 3D-laminated microelectrodes [J]. Journal of Materials Processing Technology, 2019,273:116261(8pp).
[2] Jianguo Lei, Xiaoyu Wu*, Zhenlong Wang*, Bin Xu, Likuan Zhu, Wen Wu. Electrical discharge machining of micro grooves using laminated disc electrodes made of Cu and Sn foils [J]. Journal of Materials Processing Technology, 2019,271:455-462.
[3] Wen Wu, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Kai Jiang, Zhaozhi Wu, Heming Yin, Wen Li. Fabrication of deep-narrow microgrooves by micro-EDM using rotary dentate disc foil electrodes in emulsion [J]. Journal of Micromechanics and Microengineering, 2019, 29:035014(10pp).
[4] Guoqing Zhang, Yuqi Dai, Suet To, Xiaoyu Wu*, Yan Lou. Tool interference at workpiece centre in single-point diamond turning [J]. International Journal of Mechanical Sciences, 2019,151:1-12.
[5] Hang Zhao, Yufeng Liu, Bin Xu, Yanjun Lu, Chaolan Zhou, Xiaoyu Wu*, Jianjun Li*. Fabrication and tribological properties of a self-lubricating wear-resistant coating based on structural coupling [J]. Ceramics International, 2019, 45:3910-3920.
[6] Chaolan Zhou, Xiaoyu Wu* , Yanjun Lu*, Wen Wu, Hang Zhao, Liejun Li. Fabrication of hydrophobic Ti3SiC2 surface with micro-grooved structures by wire electrical discharge machining [J]. Ceramics International, 2018,44:18227-18234.
[7] Zhaozhi Wu, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Kai Jiang, Jinming Zhong, Dongfeng Diao, Shuangchen Ruan. Vibration-assisted micro-ECM combined with polishing to machine 3D microcavities by using an electrolyte with suspended B4C particles [J]. Journal of Materials Processing Technology, 2018, 255:275-284.
[8] Bin Xu, Kang Guo, Xiaoyu Wu*, Jianguo Lei*, Xiong Liang, Dengji Guo , Jiang Ma, Rong Cheng. Applying foil queue micro-electrode in micro-EDM to fabricate 3D micro-structure [J]. Journal of Micromechanics and Microengineering, 2018, 28: 055008 (11pp).
[9] Bo Wu, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Shuangchen Ruan, Jinming Zhong. Study on machining 3D micro mould cavities using reciprocating micro ECM with queued foil microelectrodes [J]. Journal of Materials Processing Technology, 2017, 241:120-128.
[10] Xiong Liang, Jiang Ma*, Xiaoyu Wu*, Bin Xu, Feng Gong, Jianguo Lei, Taijiang Peng, Rong Cheng. Micro injection of metallic glasses parts under ultrasonic vibration [J]. Journal of Materials Science & Technology, 2017,33:703-707.
[11] Wenyan Luo, Xiaoyu Wu*, Jianguo Lei*, Bin Xu, Rong Cheng, Shuangchen Ruan. Micro resistance weld moulding to fabricate CuSn33 alloy parts [J]. Journal of Materials Processing Technology, 2016, 231:137-142.
[12] Bin Xu, Xiaoyu Wu*, Jiang Ma, Xiong Liang, Jian-guo Lei*, Bo Wu, Shuangchen Ruan, Zhenlong Wang. Micro-Electrical discharge machining of 3D micro-mold from Pd40Cu30P20Ni10 metallic glass by using laminated 3D micro-electrode [J]. Journal of Micromechanics and Microengineering, 2016,26: 035004(10pp).
[13] Xiong Liang, Xiaoyu Wu*, Bin Xu*, Jiang Ma, Zhiyuan Liu, Taijiang Peng, Lianyu Fu. Phase structure development as preheating UHMWPE powder temperature changes in the micro-UPM process [J]. Journal of Micromechanics and Microengineering, 2016,26:015014(9pp).
[14] Jianguo Lei, Xiaoyu Wu*, Bin Xu*, Zhentao Zhao, Shuangchen Ruan, Rong Cheng. Laminated fitting fabrication of Cu-Sn composite 3D microelectrodes and elimination of ridges on the machined surface of 3D micro-cavities [J]. Journal of Materials Processing Technology, 2015, 225:24-31.
[15] Wenyan Luo, Xiaoyu Wu*, Shiyun Wu, Bin Xu, Rong Cheng, Shuangchen Ruan. Micro-ultrasonic powder molding of Sn-Bi/Cu composite micro parts in semisolid form [J]. Journal of Materials Processing Technology, 2015, 223:313-318.
[16] Bin Xu, Xiaoyu Wu*, Jianguo Lei, Rong Cheng, Shuangchen Ruan, Zhenlong Wang. Laminated fabrication of 3D micro-electrode based on WEDM and thermal diffusion welding [J]. Journal of Materials Processing Technology, 2015,221:56-65.
[17] Shiyun Wu, Xiaoyu Wu*, Bin Xu, Rong Cheng, Feng Luo, Shuangchen Ruan. A micro-ultrasonic powder moulding method to fabricate Sn-Bi alloy micro parts [J]. Journal of Materials Processing Technology, 2014, 214: 2668-2675.
[18] Xiong Liang, Xiaoyu Wu*, Kun Zeng, Bin Xu, Shiyun Wu, Hang Zhao, Bing Li, Shuangchen Ruan. Micro ultrasonic powder molding for semi-crystalline polymers [J]. Journal of Micromechanics and Microengineering, 2014,24:045014(10pp).
[19] Bin Xu, Xiaoyu Wu*, Jianguo Lei, Feng Luo, Feng Gong, Chenlin Du, Xiuquan Sun, Shuangchen Ruan. Research on micro-electric resistance slip welding of copper electrode during the fabrication of 3D metal micro-mold [J]. Journal of Materials Processing Technology, 2013,213:2174-2183.
代表会议论文：
[1] Kai Jiang, Xiaoyu Wu*, Jianguo Lei, Zhaozhi Wu, Bin Xu*, Dengji Guo, Dongfeng Diao. Investigation of the Step Effect in Laminated 3D Microelectrodes for Electrochemical Micromachining [C]. Proceedings of the 13th Asia-Pacific Conference on Materials, 2018, 229-308.
[2] Zhaozhi Wu, Dengji Guo*, Xiaoyu Wu*, Bin Xu, Jianguo Lei, Kai Jiang, Dongfeng Diao. Vibration-assisted Micro-ECM by Laminated 3D Microelectrode Using a Low-concentration NaNO3 Electrolyte Containing Suspended B4C Particles [C]. Proceedings of the 13th Asia-Pacific Conference on Materials, 2018, 309-318.
[3] Jianguo Lei, Xiaoyu Wu*, Bo Wu, Bin Xu, Dengji Guo, Jinming Zhong. Fabrication of 3D microelectrodes by combining wire electrochemical micromachining and micro-electric resistance slip welding [C]. Procedia CIRP, 2016,42:825-830.
[4] Dengji Guo, Xiaoyu Wu*, Jianguo Lei, Bin Xu, Reo Kometani, Feng Luo. Fabrication of micro/nanoelectrode using focused-ion-beam chemical vapor deposition, and its application to micro-ECDM [C]. Procedia CIRP, 2016, 42:733-736.
代表著作：
伍晓宇, 王志勇. 模具网络协同制造, 北京:机械工业出版社, 2008.3, ISBN 978-7-111-23450-0
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