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金属-氧化物陶瓷的制备工艺及其性能研究;无铅焊料的润湿及界面性质研究稀土掺杂对无铅体系中CuNiSn金属间化合物影响

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Likun Zang , Zhangfu Yuan, Yuanqing Zhu, Bingsheng Xu , Hiroyuki Matsuura , Fumitaka Tsukihashi,Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523K to 673K,Colloids and Surfaces A: Physicochemical and Engineering Aspects. 414 (2012) 57– 65(IF 2.236)ISSN:0927-775; Likun Zang, Zhangfu Yuan, Zhanmin Cao, Hiroyuki Matsuura, Fumitaka Tsukihashi, Reactive Wetting Processes and Triple-line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures,Journal of Electronic Materials, 2012, 41, 8: 2051-2056.(IF 1.709); ZANG LiKun, YUAN ZhangFu, ZHAN YaPeng, WANG ChenYu,XU BingSheng, Spreading Kinetics of a Sn-30Bi-0.5Cu Alloy on a Cu Substrate, Chinese Science Bulletin. 57(6), (2012) 682-686.(IF 1.321); Likun Zang, Zhangfu Yuan, Hongxin Zhao,Xiaorui Zhang:Wettability of molten Sn-Bi–Cu solder on Cu substrate,Materials Letters,2009,63:2067–2069.(IF 2.307); Likun Zang, Zhangfu Yuan, Hongyan Xu, Bingsheng Xu, Wetting process and interfacial characteristic of Sn–3.0Ag–0.5Cu on different substrates at temperatures ranging from 503K to 673 K Applied Surface Science 257 (2011) 4877–4884(IF 2.103);

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