个人简介
教育经历：
2001年9月 — 2006年6月 哈尔滨工业大学 工学博士 专业：材料加工工程
1998年9月 — 2001年3月 江苏科技大学 工学硕士 专业：材料加工工程
1994年9月 — 1998年7月 江苏科技大学 工学学士 专业：焊接设备及工艺
出国经历：
2007年3月—2009年9月 Missouri University of Science & Technology 博士后 合作导师：Matthew O'Keefe
2009年10月—-2010年6月 Arizona State University博士后 合作导师：Nik Chawla
2015年12月—2016年7月 University of Texas at Arlington访问学者 合作导师：Kim Choong Un
近期论文
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Fengjiang Wang*, Guo Xu, Kai Qi, Di Feng. Interfacial behavior and shear strength of Al-25Si-4Cu-1Mg joints by transient liquid phase bonding with Cu as interlayer. Materials Science and Technology, 2019, submitted.
Qingfeng Wang, Hong Chen, Fengjiang Wang*. Effect of trace Zn addition on the interfacial evolution in Sn-10Bi/Cu solder joints during aging. Materials, 2019, (Major revision)
Qingfeng Wang, Yu Ding, Fengjiang Wang*. Effect of nano ZnO addition on wettability and interfacial structure of Sn-based Pb-free solders on Aluminum. Materiali in Tehnologije (Materials and Technology), 2019, accepted (IF = 0.84)
Kaipeng Wang, Fengjiang Wang*,Ying Huang, Kai Qi. Comprehensive properties of a novel quaternary Sn-Bi-Sb-Ag solder: wettability, interfacial structure and mechanical properties. Metals, 2019, 9(7): 791 (IF = 2.259)
Dandan Feng, Fengjiang Wang*, Dongyang Li, Bin Wu, Luting Liu, Mingfang Wu.Atomic migration in Sn-58Bi solder from the interaction between electromigration and thermomigration. Materials Research Express, 2019, 6: 046301 (IF = 1.220)
Fengjiang Wang*, Yu Ding, Luting Liu, Ying Huang, Mingfang Wu. Wettability, interfacial behavior and joint properties of Sn-15Bi solder. Journal of Electronic Materials, 2019, 48(10): 6835-6848 (IF = 1.64)
Fengjiang Wang*, Hong Chen, Ying Huang, Luting Liu, Zhijie Zhang. Recent progress on development of Sn-Bi based low-temperature Pb-free solders. Journal of Materials Science: Materials in Electronics, 2019, 30: 3222-3243 (IF = 2.324，ESI高被引)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behaviors in Cu/molten Sn–58Bi/Cu solder joints under coupling with thermal and current stressing. Electronic Materials Letters, 2019, 15: 36-48 (IF = 2.882)
Fengjiang Wang*, Luting Liu, Dongyang Li, Mingfang Wu. Electromigration behaviors in Sn-58Bi solder joints under different current densities and temperatures. Journal of Materials Science: Materials in Electronics, 2018, 29: 21157-21169 (IF = 2.324)
Shuang Tian, Jian Zhou, Feng Xue, RuiHua Cao, Fengjiang Wang. Microstructure, interfacial reactions and mechanical properties of Co/Sn/Co and Cu/Sn/Cu joints produced by transient liquid phase bonding. Journal of Materials Science: Materials in Electronics, 2018, 29: 13688-16400 (IF = 2.324)
Fengjiang Wang*, Hong Chen, Ying Huang, Chao Yan. Interfacial behavior and joint strength of Sn-Bi solder with solid solution compositions. Journal of Materials Science: Materials in Electronics, 2018, 29: 11409-11420 (IF = 2.324)
Fengjiang Wang*, Luting Liu, Mingfang Wu, Dongyang Li. Interfacial evolution in Sn–58Bi solder joints during liquid electromigration. Journal of Materials Science: Materials in Electronics, 2018, 29: 8895-8903 (IF = 2.324)
Fengjiang Wang*, Dongyang Li, Shuang Tian. Electromigration Reliability of Sn-Pb, Sn-Ag-Cu Pb-free and mixed Sn-Ag-Cu/Sn-Pb solder joints. Microelectronics Reliability, 2017, 73: 106-115 (IF = 1.236)
Fengjiang Wang*, Dongyang Li, Jiheng Wang, Xiaojing Wang, Comparative study on the wettability and interfacial structure in Sn–xZn/Cu and Sn/Cu–xZn system, Journal of Materials Science: Materials in Electronics, 2017, 28: 1631-1643 (IF = 2.324)
Fengjiang Wang*, Lili Zhou. Effect of Sn-Ag-Cu on the Improvement of Electromigration Behavior in Sn-58Bi Solder Joint. Journal of Electronic Materials, 2017, 46: 6204-6213 (IF = 1.566)
Fengjiang Wang*, Ying Huang, Zhijie Zhang, Chao Yan. Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints. Materials, 2017, 10: 920 (IF = 2.467)
Fengjiang Wang*, Luting Liu, Lili Zhou, Jiheng Wang, Mingfang Wu, Xiaojing Wang. Microstructural Evolution of Sn-58Bi/Cu Joints through Minor Zn Alloying Substrate during Electromigration. Materials Transactions, 2017, 58: 1593-1600 (IF = 0.675)
Fengjiang Wang*, Dongyang Li, Zhijie Zhang, Mingfang Wu, Chao Yan. Improvement on interfacial structure and properties of Sn-58Bi/Cu joint using Sn-3.0Ag-0.5Cu solder as barrier. Journal of Materials Science: Materials in Electronics, 2017, 28: 19051-19060 (IF = 2.324)
Shuang Tian, Saiping Li, Jiang Zhou, Feng Xue, Ruihua Cao and Fengjiang Wang. Effect of indium addition on interfacial IMC growth and bending properties of eutectic Sn-0.7Cu solder joints. Journal of Materials Science: Materials in Electronics, 2017, 28: 16120-16132 (IF = 2.324)
Fengjiang Wang*, Lili Zhou, Xiaojing Wang, Peng He, Microstructural evolution and joint strength of Sn-58Bi/Cu joints through minor Zn alloying substrate during isothermal aging, Journal of Alloys and Compounds, 2016, 688: 639-648 (IF = 3.779)
Fengjiang Wang*, Ying Huang. Mechanical properties of SnBi-SnAgCu composition mixed solder joints using bending test, Materials Science & Engineering A, 2016, 668: 224-233 (IF = 3.414)
Shuang Tian, Fengjiang Wang*, Xiaojing Wang, Dongyang Li, Rapid microstructure evolution of structural composite solder joints induced by low-density current stressing, Materials Letters, 2016, 172: 153-156 (IF = 2.687)
Fengjiang Wang, Matthew O’Keefe and Brandon Brinkmeyer. Microstructural evolution and tensile properties of SnAgCu mixed with Sn-Pb solder alloys. Journal of Alloys and Compounds, 2009, 477: 267-273
Fengjiang Wang, et al. Intermetallic compound formation at Sn-3.0Ag-0.5Cu- 1.0Zn lead-free solder alloy/Cu interface during as-soldered and as-aged conditions. Journal of Alloys and Compounds, 2007, 438: 110-115.
Wang, HQ; Wang, FJ; Gao, F, et al. Reactive wetting of Sn0.7Cu-xZn lead-free solders on Cu substrate. Journal of Alloys and Compounds, 2007, 433: 302-305.
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