张刚 - 吉林大学 - 超分子结构与材料国家重点实验室

个人简介

理学博士、超分子结构与材料国家重点实验室教授、博士生导师，吉林大学唐敖庆学者英才教授。主要从事纳微结构功能材料方面的研究工作，发表SCI论文100余篇，他引3000余次，授权中国发明专利20余项。

研究领域

胶体界面与纳微结构功能材料：有序纳微结构的制备、性质与其在光学、电磁学和化学、生物学等领域的功能应用；胶体与界面相互作用与组装及应用。

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

From 1D to 3D: Tunable Sub-10 nm Gaps in Large Area Devices , Ziwei Zhou, Zhiyuan Zhao, Ye Yu, Bin Ai, Helmuth Möhwald, Ryan C. Chiechi, Joel K.W. Yang, Gang Zhang* , Advanced Materials 2016, 28, 2956-2963. In Situ Chemical Patterning Technique , Yuduo Guan, Bin Ai, Zengyao Wang, Chong Chen, Wei Zhang, Yu Wang, Gang Zhang* , Advanced Functional Materials 2022, 32, 2107945. Plasmonic Chiral Metamaterials with Sub-10 nm Nanogaps , Wei Zhang, Bin Ai, Panpan Gu, Yuduo Guan, Zengyao Wang, Zifan Xiao, Gang Zhang* , ACS Nano 2021, 15, 17657-17667. Mass Fabrication of Hierarchical Nanostructures Based on Plasmonic Nanochemistry for Ultra-sensitive Optical Sensing , Zengyao Wang, Bin Ai, Yuduo Guan, Yu Wang, Gang Zhang* , Sensors and Actuators B-Chemical 2021, 329, 129220. Chiral Plasmonic Metamaterials with Tunable Chirality , Yuduo Guan, Zengyao Wang, Bin Ai, Chong Chen, Wei Zhang, Yu Wang, Gang Zhang* , ACS Applied Materials & Interfaces 2020, 12, 50192–50202. Hierarchical Control of Plasmonic Nanochemistry in Microreactor , Zengyao Wang,# Bin Ai,# Yu Wang, Yuduo Guan, Helmuth Möhwald, Gang Zhang* , ACS Applied Materials & Interfaces 2019, 11, 35429–35437. Free-Standing Plasmonic Chiral Metamaterials with 3D Resonance Cavities , Zengyao Wang, Bin Ai, Ziwei Zhou; Yuduo Guan, Helmuth Möhwald, Gang Zhang* , ACS Nano 2018, 12, 10914-10923. Plasmonic Nanochemistry Based on Nanohole Array , Bin Ai,# Zengyao Wang,# Helmuth Möhwald, Gang Zhang* , ACS Nano 2017, 11, 12094-12102. Resonant Optical Transmission through Topologically Continuous Films , Bin Ai, Ye Yu, Helmuth Möhwald, Limin Wang, Gang Zhang* , ACS Nano 2014, 8, 1566-1575. Responsive Monochromatic Color Display Based on Nanovolcano Arrays , Bin Ai, Ye Yu, Helmuth Möhwald, Gang Zhang* , Advanced Optical Materials 2013, 1, 724-731. (Cover)