近期论文
查看导师新发文章
(温馨提示:请注意重名现象,建议点开原文通过作者单位确认)
1)L. S. Wang,J. P. Xu*, L. Liu, H. H. Lu, P. T. Lai, and W. M. Tang,Interfacial and electrical properties of InGaAs metal-oxide- semiconductor capacitor with TiON/TaON multilayer composite gate dielectric, Appl. Phys. Lett., vol. 106, p. 123504, 2015. 2)L. S. Wang,J. P. Xu*, L. Liu, H. H. Lu, P. T. Lai, and W. M. Tang, Plasma-nitrided GaO(GdO) as interfacial passivation layer for InGaAs metal-oxide-semiconductor capacitor with HfTiON gate dielectric. IEEE Trans. on Electron Devices, vol. 62(4), pp. 1235-1240, 2015. 3)Li-Sheng Wang,Jing-Ping Xu*, Lu Liu, Wing-Man Tang, Pui-To Lai, Nitrided HfTiON/Ga2O3(Gd2O3) as stacked gate dielectric for GaAs MOS applications, Applied Physics Express, vol. 7(6), p. 061201, 2014. 4)Feng Ji,Jing-Ping Xu*, Yong Huang, Lu Liu,and P. T. Lai,Improved Interfacial and Electrical Properties of Ge-Based Metal-Oxide-Semiconductor Capacitor With LaTaON Passivation Layer,IEEE Trans. Electron Devices, vol. 61(11), pp. 3608-3612, 2014. 5) Li-Sheng Wang, Lu Liu,Jing-Ping Xu*, Shu-Yan Zhu, Yuan Huang, and Pui-To Lai, Electrical Properties of HfTiON Gate-Dielectric GaAs Metal-Oxide-Semiconductor Capacitor With AlON as Interlayer, IEEE Trans. Electron Devices, vol. 61(3), pp. 742-746, 2014. 6) J. X. Chen,J. P. Xu*, L. Liu, X. D. Huang, P. T. Lai,Improvements of Performance and Reliability for Metal–Oxide–Nitride–Oxide–Silicon Flash Memory With NO- or N2O-Grown Oxynitride as Tunnel Layer,IEEE Trans. Device and Materials Reliability, vol. 14(1), pp. 9-12, 2014. 7) J. X. Chen,J. P. Xu*, L. Liu, X. D. Huang, P. T. Lai, “Improved performance by using TaON/SiO2 as dual tunnel layer in Charge-Trapping nonvolatile memory”, Microelectronics Reliability, vol.54(2), pp. 393-396, 2014. 8) L. Liu,J. P. Xu*,J. X. Chen, P. T. Lai, Improved characteristics for MOHOS memory with oxygen-rich GdO as charge storage layer annealed by NH3, Applied Physics A. Materials Science & Processing, vol.115(4), pp. 1317-1321, 2014. 9) L. S. Wang,J. P. Xu*, S. Y. Zhu, Y. Huang, P. T. Lai, Improved interfacial and electrical properties of GaAs metal-oxide-semiconductor capacitors with HfTiON as gate dielectric and TaON as passivation interlayer, Appl. Phys. Lett. vol. 103, p. 092901, 2013. 10) J. X. Chen,J. P. Xu*, L. Liu, and P. T. Lai, Improved performances of metal-oxide- nitride-oxide-silicon memory with HfTiON as charge-trapping layer, Appl. Phys. Lett. vol. 103, p. 213507, 2013. 11)Jian-Xiong Chen,Jing-Ping Xu*, Lu Liu, and Pui-To Lai, Performance Improvements of Metal–Oxide–Nitride–Oxide–Silicon Nonvolatile Memory with ZrO2Charge-Trapping Layer by Using Nitrogen Incorporation, Appl. Phys. Express, vol. 6, p. 084202, 2013. 12) Zhu Shuyan,Xu Jingping*, Wang Lisheng and Huang Yuan,Improved Interface Properties of HfO2Gate Dielectric GaAs MOS Devices by Using SiNxas Interfacial Passivation Layer,Chin. Phys. B, vol. 22(9), pp. 097301-1-4, 2013. 13)L. Liu,J. P. Xu*, F. Ji, J. X. Chen, P. T. Lai, “Improved Charge-Trapping Properties of TiON/HfON Dual Charge Storage Layer by Tapered Band Structure, Applied Physics Letters, vol. 101(13), p. 133503, 2012. 14) L. Liu,J. P. Xu*, F. Ji, J. X. Chen, P. T. Lai, Improved Memory Characteristics by NH3-Nitrided GdO as Charge Storage Layer for Nonvolatile Memory Applications, Applied Physics Letters, vol. 101(3), p. 033501, 2012. 15) L. Liu,J. P. Xu*, J. X. Chen, X. D. Huang, P. T. Lai, Ultrathin HfON/SiO2Dual Tunneling Layer for Improving the Electrical Properties of Metal-Oxide-Nitride-Oxide- Silicon Memory, Thin Solid Films, vol. 524, pp. 263-267, 2012. 16)F. Ji,J. P. Xu*, J. G. Liu, C. X. Li, and P. T. Lai, Improved interface properties of Ge metal-oxide-semiconductor capacitor with TaTiO gate dielectric by using in situ TaON passivation interlayer, Applied Physics Letters, vol. 98, pp. 182901-1-3, 2011. 17) F. Ji,J. P. Xu*, P. T. Lai, C. Xi Li, and J. G. Liu, Improved Interfacial Properties of Ge MOS Capacitor With High-k Dielectric by Using TaON/GeON Dual Interlayer, IEEE Electron Device Letters, vol. 32, pp. 122~124, 2011. 18) L. Liu,J. P. Xu*, X. D. Huang, P. T. Lai, A Novel MONOS Memory with High-k HfLaON as Charge-Storage Layer, IEEE Transactions onDevice and Materials Reliability, vol. 11(2), pp. 244-247, 2011.