陈材 - 华中科技大学 - 电气与电子工程学院

个人简介

教育经历 2008.9 ~ 2014.3 华中科技大学 - 电力电子与电力传动 - 工学博士学位 - 博士 2004.9 ~ 2008.6 华中科技大学 - 电气工程及其自动化 - 学士学位 - 本科工作经历 2019.4-至今华中科技大学 - 副研究员 2017.11-2018.11 美国阿肯色大学阿肯色大学ENRC与HiDEC中心从事宽禁带半导体封装集成及其高功率密度变换技术研究 2016.10-2017.10 美国俄亥俄州立大学 - 博士后俄亥俄州立大学CHPPE中心从事宽禁带半导体封装集成及其高功率密度变换技术研究 2014.4-2016.10 华中科技大学 - 电气学院 - 博士后华中科技大学先进半导体与封装集成实验室从事宽禁带半导体封装集成及其高功率密度变换技术研究

研究领域

高功率密度电力电子变换技术宽禁带半导体的封装集成技术

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

[1] C. Chen, F. Luo, and Y. Kang, “A review of SiC power module packaging: Layout, material system and integration,” CPSS Trans. Power Electron. Appl, vol. 2, no. 3, pp. 170–186, 2017. [2] C. Chen, Y. Chen, Y. Tan, J. Fang, F. Luo, and Y. Kang, "On the Practical Design of a High Power Density SiC Single-Phase Uninterrupted Power Supply (UPS) System," IEEE Transactions on Industrial Informatics, 2017, 13(5): 2704-2716. [3] C. Chen, Y. Chen, Y. Li, Z. Huang, T. Liu, and Y. Kang, "A SiC-based Half-Bridge Module with Improved Hybrid Packaging Method for High Power Density Applications," IEEE Transactions on Industrial Electronics, 2017, 64(11): 8980-8991. [4] Chen C, Huang Z, Chen L, et al. A Flexible PCB based 3D Integrated SiC Half-Bridge Power Module with Three-Sided Cooling Using Ultra-Low Inductive Hybrid Packaging Structure[J]. IEEE Transactions on Power Electronics, 2018. [5] Y. Xie, C. Chen, Z.; Huang, F. Luo, Y. Kang, High Frequency Conducted EMI Investigation on Packaging and Modulation for a SiC-based High Frequency Converter[J]. IEEE Journal of Emerging and Selected Topics in Power Electronics, 2019. [6] [14] Zhizhao Huang, Cai Chen and Yong Kang, "A Novel Low Inductive 3D SiC Power Module Based on Hybrid Packaging and Integration Method", ECCE, 2017. [7] [13] Yue Xie, Cai Chen and Yong kang, "Using Ultra-low Parasitic Hybrid Packaging Method to Reduce High Frequency EMI Noise for SiC Power Module", the 5th IEEE Workshop on Wide Bandgap Power Devices and Applications (WiPDA), 2017. [8] [12] Zihan Gao, Dong Jiang, Wubin Kong, Cai Chen etc. A GaN-Based Integrated Modular Motor Drive for Open-Winding Permanent Magnet Synchronous Motor Application, WiPDA Asia 2018. [9] [11] Zhizhao Huang, Cai Chen, Yong Kang, Fang Luo, A high power density and high efficiency three phase inverter based on a hybrid 3D SiC packaging power module, ECCE, 2018. [10] [10] Li, Y., Huang, Z., Chen, L., Chen, C., Zou, K., Kang. A High Performance 1200 V/120 A SiC Power Module Based On a Novel Multi-DBCs Hybrid Packaging Structure. In CIPS 2018; 10th International Conference on Integrated Power Electronics Systems. VDE.