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[1] R. Wu, N. Liao, X. Fang, J. Cai, Q. Wang, and J.K.O. Sin, "A 3D assembled silicon-embedded transformer for 10 MHz, ultra-high-isolation, compact chip-to-chip power transfer," IEEE Electron Device Letters, vol. 38, no. 3, pp. 356-358, 2017. [2] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A novel double-side silicon-embedded transformer for 10-MHz, 1-kV-isolation, compact power transfer applications," IEEE Transactions on Electron Devices, vol. 63, no. 11, pp. 4542-4545, November 2016. [3] X. Fang, R. Wu, and J.K.O. Sin, "Analytical modeling of ac resistance in thick coil integrated spiral inductors," IEEE Transactions on Electron Devices, vol. 63, no. 2, pp. 760-766, February 2016. [4] R. Wu, N. Liao, X. Fang, and J.K.O. Sin, "A silicon-embedded transformer for high-efficiency, high-isolation, low-frequency on-chip power transfer," IEEE Transactions on Electron Devices, vol. 62, no. 1, pp. 220-223, January 2015. [5] X.Fang, R. Wu, L. Peng, and J.K.O. Sin, "A novel integrated power inductor with vertical laminated core for improved L/R ratios," IEEE Electron Device Letters, vol. 35, no. 12, pp. 1287-1289, December 2014. [6] R. Wu, W. Li, H. Luo, J.K.O. Sin,and C.P. Yue, "Design and characterization of wireless power links for brain-machine interface applications," IEEE Transactions on Power Electronics, vol. 29, no. 10, pp. 5462-5471, October 2014. [7] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "Optimization of monolithic 3D TSV transformers for high-voltage digital isolators," ECS Journal of Solid State Science and Technology, vol. 3, no. 10, pp. Q207-Q211, August 2014. [8] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "A simple low cost monolithic transformer for high-voltage gate driver applications," IEEE Electron Device Letters, vol. 35, no. 1, pp. 108-110, January 2014. [9] S. Raju, R. Wu, M. Chan, and C.P. Yue, "Modeling of mutual coupling between planar inductors in wireless power applications," IEEE Transactions on Power Electronics, vol. 29, no. 1, pp. 481-490, January 2014. (ESI工程学前1%高被引论文） [10] L. Peng, R. Wu, X. Fang, Y. Toyoda, M. Akahane, M. Yamaji, H. Sumida, and J.K.O. Sin, "A fully integrated 3D TSV transformer for high-voltage signal transfer applications," ECS Solid State Letters, vol. 2, no. 5, pp. Q29-Q31, February 2013. [11] X.Fang, R. Wu, L. Peng, and J.K.O. Sin, "A novel silicon-embedded toroidal power inductor with magnetic core," IEEE Electron Device Letters, vol. 34, no. 3, pp. 292-294, February 2013. [12] R. Wu, J.K.O. Sin, and C.P. Yue, "High-Q backside silicon–embedded inductor for power applications in μH and MHz range," IEEE Transactions on Electron Devices, vol. 60, no. 1, pp. 339-345, January 2013. [13] R. Wu, S. Raju, M. Chan, J.K.O. Sin and C.P. Yue, "Silicon-embedded coil for high-efficiency wireless power transfer to implantable biomedical ICs," IEEE Electron Device Letters, vol. 34, no. 1, pp. 9-11, January 2013. [14] R. Wu and J.K.O. Sin, "High efficiency silicon-embedded coreless coupled inductors for power supply on chip applications," IEEE Transactions on Power Electronics, vol. 27, no. 11, pp. 4781-4787, November 2012. [15] R. Wu, J.K.O. Sin, and S.Y. (R.) Hui, "Novel silicon-embedded coreless transformer for on-chip isolated signal transfer," IEEE Magnetics Letters, vol. 2, pp. 6500103, April 2011. [16] R. Wu and J.K.O. Sin, "A novel silicon-embedded coreless inductor for high frequency power management applications," IEEE Electron Device Letters, vol. 32, no.1, pp. 60-62, January 2011.
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