丁桂甫 - 上海交通大学 - 微纳电子学系

个人简介

1987年毕业于复旦大学化学系，理学硕士。长期从事MEMS/NEMS技术创新和应用研究，先后承担并完成了二十多项国家和省部级科研课题，包括国家863计划项目、自然科学基金课题，973子课题，预研，教育部重大培育和上海市科委发展基金课题等。先后在国内外专业期刊和学术会议上发表学术论文200多篇，其中SCI收录论文150篇，在MEMS领域主流期刊Journal of Micromechanics and Microengineering上发表研究论文23篇，是近十年中国大陆学者在该刊论文发表数最多的个人。先后申请专利一百多项，获得专利授权六十多项。先后培养研究生七十多位，其中，博士研究生20名，硕士研究生54名。 2004年获得上海市育才奖，2007年获上海市技术发明一等奖，2008年获得国家技术发明二等奖，2016年获得上海市技术发明一等奖。

研究领域

1、微纳集成制造创新工艺方法研究 a) 多元兼容集成制造技术 b) 适度集成UV-LIGA工艺 c) 基于TSV的3D集成技术 d) 一维纳米材料器件集成方法 2、高性能微纳器件与系统的设计制造 a) 高度集成的非硅MEMS惯性开关 b) 超高热流密度散热器 c) 高性能植入/介入式微器件 d) 航空发动机用高温传感器

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

“Patterning of CVD diamond film for MEMS applications”，Diamond and Related Materials，Vol. 14, No. 9, SEP 2005, p 1543-1548. “A MEMS inertia switch with bridge-type elastic fixed electrode for long duration contact”, IEEE Transactions on Electron Devices, SEP 2008, 55 (9): 2492-2497. “Fabrication of Ni-matrix carbon nanotube field emitters using composite electroplating and micromachining”Carbon, DEC 2009, 47(15): 3466-3471. Development of a novel MEMS inertial switch with a compliant stationary electrode, IEEE Sensors Journal. 2009, 9 (7): 801-808. “A novel meandered coplanar waveguide for RF microelectromechanical systems”, Journal of Micromechanics and Microengineering, AUG 2007, 17 (8): 1628-1631. “Design, simulation and characterization of an inertia micro-switch fabricated by non-silicon surface micromachining”, Journal of Micromechanics and Microengineering, AUG 2007, 17 (8): 1598-1640. “Preparing of a high speed bistable electromagnetic RF MEMS switch”, Sensors & Actuators: A. Physical. 2007,134:532-537. “A Micro-tensile method for measuring mechanicis properties of MEMS materials”, Journal of Micromechanics and Microengineering, AUG 2008, 18(6): 065002（7pp）. “Development of a shock acceleration microswitch with enhanced-contact and low off-axis sensitivity”, IEEE Proceedings, 15th Int. Conf. on Solid-State Sensors, Actuators and Microsystems (Transducers’09), Denver, Colorado, USA, 2009: 1940-1943. [10]“Design and contact dynamics simulation of an inertia micro-switch based on non-silicon substrate”, IEEE Proceedings, 3rd Int. Conf. on Nano/Micro Engineered and Molecular Systems, Sanya, CHINA, NEMS 2008: 19-22. “Micromechanical characterization of electroplated permalloy films for MEMS”, Microsystems Technologies, JUN 2006, 6: 065002（7pp）. “Fabrication of a MEMS inertia switch on quartz substrate and evaluation of its threshold acceleration”, Microelectronics Journal, 2008, 39 (9): 1112-1119. “New micromachined interdigital coplanar waveguide”, Microwave and Optical Technology Letters. 2007, 49(5):1007-1010. “Design and analysis of the micromechanical structure for an electromagnetic bi-stable RF MEMS switch”, Asia-Pacific Microwave Conference Proceedings, Suzhou, China. 2005:99-102. “Experimental investigation of heat transfer performance for a novel microchannel heat sink”, Journal of Micromechanics and Microengineering, AUG 2008, 18(3): 035021(8pp). “Highly efficient manifold microchannel heatsink”, Electronics Letters, 2007, 42(18): 978-980.