秦明 - 东南大学 - 电子科学与工程学院

个人简介

教育简历： 1991.3~1997.10：东南大学电子工程系硕士和博士研究生学习，获微电子与固体电子学硕士和博士学位；工作简历： 1998.4~2000.10: 香港科技大学电子与电机工程系，访问学者。 1997.11~：东南大学电子科学与工程学院教授，博士生导师。

研究领域

微电子机械系统（MEMS）流量、风速、气压等传感器；MEMS工艺、封装；MEMS器件的驱动与测量技术。 MEMS嵌入式微系统、片上集成与封装技术等。

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Piezoresistive temperature sensors fabricated by a surface micromachining CMOS MEMS process作者: Cai, Chunhua; Tan, Junyan; Hua, Di; 等.SCIENTIFIC REPORTS 卷: 8 文献号: 17065 出版年: NOV 20 2018 Octagon-Shaped 2-D Micromachined Thermal Wind Sensor for High-Accurate Applications作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 27 期: 4 页: 739-747 出版年: AUG 2018 A 2D Wind Sensor Using the Delta P Thermal Feedback Control作者: Wang, Shang; Yi, Zhenxiang; Qin, Ming; 等.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 27 期: 3 页: 377-379 出版年: JUN 2018 EIGHT-TRIGRAM-INSPIRED MEMS THERMAL WIND SENSOR WITH IMPROVED ACCURACY作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.会议: 31st IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Belfast, NORTH IRELAND 会议日期: JAN 21-25, 2018会议赞助商: IEEE2018 IEEE MICRO ELECTRO MECHANICAL SYSTEMS (MEMS) 丛书: Proceedings IEEE Micro Electro Mechanical Systems 页: 836-839 出版年: 2018 Effect of Insulation Trenches on Micromachined Silicon Thermal Wind Sensors作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.IEEE SENSORS JOURNAL 卷: 17 期: 24 页: 8324-8331 出版年: DEC 15 2017 Modelling and characterization of a robust, low-power and wide-range thermal wind sensor作者: Zhu, Yanqing; Qin, Ming; Ye, Yizhou; 等.MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 卷: 23 期: 12 页: 5571-5585 出版年: DEC 2017 DRIE Trenches and Full-Bridges for Improving Sensitivity of 2-D Micromachined Silicon Thermal Wind Sensor作者: Ye, Yizhou; Yi, Zhenxiang; Gao, Shixuan; 等.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 26 期: 5 页: 1073-1081 出版年: OCT 2017 Experiment of the MEMS Wind Sensor Based on Temperature-Balanced Mode作者: Yi, Zhenxiang; Qin, Ming; Huang, Qing-AnIEEE SENSORS JOURNAL 卷: 17 期: 8 页: 2316-2317 出版年: APR 15 2017 DRIE TRENCHES AND FULL-BRIDGES DESIGN FOR SENSITIVITY IMPROVEMENT OF MEMS SILICON THERMAL WIND SENSOR作者: Ye, Yizhou; Yi, Zhenxiang; Qin, Ming; 等.会议: 30th IEEE International Conference on Micro Electro Mechanical Systems (MEMS) 会议地点: Las Vegas, NV 会议日期: JAN 22-26, 2017会议赞助商: IEEE30TH IEEE INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS 2017) 丛书: Proceedings IEEE Micro Electro Mechanical Systems 页: 985-988 出版年: 2017 Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications作者: Zhu, Yanqing; Qin, Ming; Huang, Jianqiu; 等.IEEE SENSORS JOURNAL 卷: 16 期: 11 特刊: SI 页: 4300-4308 出版年: JUN 1 2016 Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors作者: Chen, Bei; Zhu, Yan-Qing; Yi, Zhenxiang; 等.SENSORS 卷: 15 期: 12 页: 29871-29881 出版年: DEC 2015 Modeling of Temperature Effects on Micromachined Silicon Thermal Wind Sensors作者: Huang, Qing-An; Chen, Bei; Zhu, Yan-Qing; 等.JOURNAL OF MICROELECTROMECHANICAL SYSTEMS 卷: 24 期: 6 页: 2033-2039 出版年: DEC 2015 Design and implementation of novel thin film position-sensitive detectors (TFPSDs) based on photoconductive effect作者: Zhu, Yan-qing; Shan, Yuan-yuan; Qin, MingMICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS 卷: 21 期: 9 特刊: SI 页: 1975-1986 出版年: SEP 2015 Development of a self-packaged 2D MEMS thermal wind sensor for low power applications作者: Zhu, Yan-qing; Chen, Bei; Qin, Ming; 等.JOURNAL OF MICROMECHANICS AND MICROENGINEERING 卷: 25 期: 8 文献号: 085011 出版年: AUG 2015