王彦 - 中南大学 - 机电工程学院

个人简介

2008.09 - 2011.06在浙江大学化工过程机械专业攻读硕士学位。2011.09 - 2015.10在德国弗莱贝格工业大学（TU-Freiberg）机械系，热加工工程、环境与天然产物加工工程所攻读过程工程专业博士学位。2016年至今教育背景 2011.09-2015.09 德国弗莱贝格工业大学（TU-Freiberg）机械系热加工工程、环境与天然产物加工工程所过程工程攻读博士学位 2008.09-2011.06 浙江大学 (211 985) 化工过程机械专业工学硕士 2004.09-2008.07 中国矿业大学 (211 985创新平台) 过程装备与控制工程专业工学学士

研究领域

微电子可靠性：封装互连，下填料流动分析，传热传质分析等微结构制造：微结构表征，微结构电化学沉积，微结构刻蚀等仿真和优化：多物理场计算，传热传质模型，过程及流体的模拟、CFD，计算流体动力学，参数估计，非线性优化等

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

(1) Wang, Y,*; Herdegen, V.; Repke, J.-U. A Model Approach for the Montan Wax Extraction: Model Development and Experimental Analysis. Separation Science and Technology 50: 2311-2326, 2015. SCI期刊, IF: 1.171 (2) Wang, Y.*, V. Herdegen and J.U. Repke, Identification and Analysis of Mass Transfer Coefficients and Effective Diffusion Coefficients for Models of Solvent Extraction of Montan Wax. Separation Science and Technology, 2016. DOI: 10.1080/01496395.2016.1202978, SCI期刊, IF: 1.171, (3) Wang, Y.*, V. Herdegen and J. Repke, Numerical study of different particle size distribution for modeling of solid-liquid extraction in randomly packed beds. Separation and Purification Technology, 2016. 171: p. 131-143.SCI期刊2区, IF: 3.299 (4) Yan Wang, Wenhui Zhu*, Xiang Li, Fuliang Wang*, Parameters Analysis of TSV Filling Models of Distinct Chemical Behaviours of Additives. Electrochimica Acta. DOI: 10.1016/j.electacta.2016.09.144, SCI期刊1区（Top）, IF: 4.803 (5) Chengdi Xiaoa, Hailong Liao, Yan Wang*, Junhui Li*, Wenhui Zhua. A novel automated heat-pipe cooling device for high-power LEDs. Applied Thermal Engineering. DOI: 10.1016/j.applthermaleng.2016.10.041. IF: 3.043 (6) F. Wang, X. Ren, P. Zeng, H. Xiao, Y. Wang*, and W. Zhu, Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution. Microelectronic Engineering, (2017). 180: p. 25-29. （IF=1.806） (7) F. Wang, P. Zeng, Y. Wang*, X. Ren, H. Xiao, and W. Zhu, High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition. Microelectronic Engineering, (2017). 180: p. 30-34.（IF=1.806） (8) F. Wang, X. Ren, Y. Wang*, P. Zeng, Z. Zhou, H. Xiao, and W. Zhu, Parameter analysis on the ultrasonic TSV-filling process and electrochemical characters. Journal of Micromechanics and Microengineering, Wang F, Ren X, Wang Y, et al. Parameter analysis on the ultrasonic TSV-filling process and electrochemical characters[J]. Journal of Micromechanics & Microengineering, 2017, 27(10) (IF= 1.794). (9) Zhu, Wenhui, K. Wang, and Y. Wang*. "A novel model for simulating the racing effect in capillary-driven underfill process in flip chip." Journal of Micromechanics and Microengineering (2017) (IF= 1.794). (10) H. Xiao, F. Wang, Y. Wang, H. He, and W. Zhu, Effect of Ultrasound on Copper Filling of High Aspect Ratio Through-Silicon Via (TSV). Journal of the Electrochemical Society, (2017). 164(4): p. D126 - D129. （IF=3.259） (11) F. Wang, J. Sun, D. Liu, Y. Wang, and W. Zhu, Effect of Voltage and Gap on Micro-Nickel-Column Growth Patterns in Localized Electrochemical Deposition. Journal of the Electrochemical Society, (2017). 164(6): p. D297-D301. （IF=3.259） (12) F. Wang, Y. Li, H. He, Y. Wang, W. Zhu, and J. Li, Effect of Bis- (3-sulfopropyl) Disulfide and Chloride ions on the Localized Electrochemical Deposition of Copper Microstructures, Journal of The Electrochemical Society, (2017). 164(6): p. D297-D301. （IF=3.259） (13) Wang, Feng; Wang, Fuliang; Zhao, Zhipeng; Wang, Yan; Nie, Nantian, A novel model for Through-Silicon Via (TSV) filling process simulation considering three additives and current density effect. Journal of Micromechanics and Microengineering,(2017).（IF=1.794）