个人简介
教育背景
2008年本科毕业于上海交通大学,获材料科学与工程专业学士学位
2015年研究生毕业于上海交通大学,获材料物理与化学专业博士学位
工作经历
2015至今,中南大学机电工程学院 微系统制造科学与工程系 讲师
研究领域
1) 微电子封装互连的制造及可靠性
2) 表面微纳结构的高效制造及功能应用
近期论文
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Ganglong Li, Guang Zheng, Zijun Ding, Lei Shi, Junhui Li, Zhuo Chen, Liancheng Wang, Andrew A. O. Tay, and Wenhui Zhu, High-performance ultra-low-k fluorine-doped nanoporous organosilica ?lms for interlayer dielectric, J Mater Sci, 2018
Junhui Li, Haoliang Zhang, Can Zhou, Zhuo Chen, Xinxin Chen, Zhili Long, Xiaohe Liu, Wenhui Zhu, A multi-parameter numerical modeling and simulation of the dipping process in microelectronics packaging, IEEE T Ind Inform, In Press
Wenhui Zhu, Hanjie Yang, and Zhuo Chen*, Superior electromigration resistance of a microsized solder interconnection containing a single-Sn grain, Appl Phys Lett, 2018
Bo Wu, Shuanghai Zhang, Fuliang Wang, and Zhuo Chen*, Micro Copper Pillar Interconnection Using Thermosonic Flip Chip Bonding, J Electron Pack, 2018
Zhuo Chen, Wenya Tian, Junhui Li, and Wenhui Zhu, Intermetallic Growth Induced Large-Scale Void Growth and Cracking Failure in Line-Type Cu/Solder/Cu Joints Under Current Stressing, J Electron Mater, 2018.
Ganglong Li, Houya Wu, Honglong Luo, Zhuo Chen*, Andrew A. O. Tay, and Wenhui Zhu, Diffusion behavior of Cu/Ta heterogeneous interface under high temperature and high strain: An atomistic investigation, AIP Adv, 2017, 7(9):095320.
Xinyao Yi, Zhixuan Lu, Yu Kong, and Zhuo Chen*, Label-Free Electrochemical Detection of MicroRNAs via Intercalation of Hemin into the DNA/RNA Hybridization, Int J Electrochem Sci, 2017, 12(4):2813-2821.
Zhuo Chen, Xianhe Zhang, Xian Fang, Hu He, and Wenhui Zhu, 2016 17th International Conference on Electronic Packaging Technology (ICEPT), 2016, pp. 1222-1225.
Zhuo Chen, Hu He, Anmin Hu, and Ming Li, Electronic Packaging Technology (ICEPT), 2015 16th International Conference on, 2015, pp. 1497-1500.
Shixin Gao, Zhuo Chen, Anmin Hu, Ming Li, and Kaiyou Qian, Electrodeposited Ni microcones with a thin Au film bonded with Au wire, J Mater Process Technol, 2014, 214(2):326-333.
Qin Lu, Zhuo Chen, Wenjing Zhang, Anmin Hu, and Ming Li, Low-temperature solid state bonding method based on surface Cu–Ni alloying microcones, Appl Surf Sci, 2013, 268:368-372.
Zhuo Chen, Tingbi Luo, Tao Hang, Ming Li, and Anmin Hu, Enhanced Ni3Sn4 nucleation and suppression of metastable NiSn3 in the solid state interfacial reactions between Sn and cone-structured Ni, CrystEngComm, 2013, 15(48):10490.
Zhuo Chen, Feifei Tian, Anmin Hu, and Ming Li, A facile process for preparing superhydrophobic nickel films with stearic acid, Surf Coat Tech, 2013, 231:88-92.