韩雷 - 中南大学 - 机电工程学院

个人简介

教育背景 1982，1984，1989年在中国科技大学获学士, 硕士, 博士学位。工作经历 1989-1991 中国科技大学讲师; 1991-1992 美国 Oregon State University， Research Scientist； 1992-1994 美国 Lehigh University ， Research Scientist; 1994-1995 美国 State University of New York， Research Scientist； 1995-2000 厦门大学副教授，教授； 2000-2001 美国 Case Western Reserve University， Research Associate； 2001-2003 美国 Lehigh University， Research Associate； 2003-今中南大学教授，博士生导师。

研究领域

微器件封装机理及可靠性微机电系统测试小波分析图像分析激光超声电流变材料光纤传感器非线性动力学光电检测实验力学

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Pulsed Holographic and Speckle Interferometry Using Hopkinson Loading Technique to Investigate the Dynamical Deformation on Plates, Proc. of SPIE, 1990, 1358:793-803 Vibration Sensing in Electrorheological Controllable Structure by Embedded Polarimetric Fiber Optic Sensors，Proc. of ASME Annual Meeting, American Society of Mechanical Engineers, Aerospace Division (Publication) AD, 1993, 297 Application of the Integrating Fiber Optic Sensor for Vibration Sensing, , 1995， 4（2）：100-105 Study of the multilayer PCB CTEs by moire interferometry, Optics and Lasers in Engineering , 42 (2004) :613–626 Statistical Analysis for Test Lands Positioning and PCB Deformation during Electrical Testing, Microelectronics Reliability, 44 (2004) 853–859 Bondability window and power input for wire bonding, Microelectronics Reliability, 2006, 46(2-4):610–615 Wire bonding dynamics monitoring by wavelet analysis, Sensors and Actuators A 137 (2007) 41–50 Effect of Tightening Torque on Transducer Dynamics and Bond Strength in Wire Bonding, Sensors and Actuators A，2008， 141（2）：695–702 Experimental Observations on Nonlinear Phenomena in Transducer Assembly for Thermosonic Flip-Chip Bonding, Microelectronic Engineering (2008) , Vol 85/7：1568-1576