个人简介
教育经历:
北京航空航天大学，学士；
北京航空航天大学，硕士；
香港科技大学，博士
研究领域
1、可见光通信及水下无线光通信
2、光场3D显示技术与系统
3、人工智能（计算机视觉等）、可靠性工程
近期论文
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（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）
1）"Over 700 MHz-3 dB Bandwidth UOWC System Based on Blue HV-LED With T-Bridge Pre-Equalizer”,IEEE Photonics Journal, Vol.11,No.3, 7903812, June 2019, DOI: 10.1109/JPHOT.2019.2910090.
2)“GaN-based mid-power flip-chip light-emitting diode with high-3 dB bandwidth for visible light communications”. Applied Optics(1559-128X). 2018, 57(11):2773-2779
3) “GaN-based generic bi-function LED for potential duplex free-space VLCs”, July 2017, IEEE Photonics Journal, 10.1109/JPHOT.2017.2733039;
4) “Improving the −3dB bandwidth of medium power GaN-based LEDs through periodic micro via-holes for visible light communications”, Optics Communications, vol. 392, pp.175-179, JUN 1 2017;
5) “Three-dimensional display on computer screen free from accommodation-convergence conflict”, Optics Communications, vol. 390, pp. 36-40, MAY 1 2017;
6) “A Power-Type Single GaN-Based Blue LED With Improved Linearity for 3 Gb/s Free-Space VLC Without Pre-equalization”, IEEE Photonics Journal, vol. 8(3), 7904308, JUN 2016
7) “A LTPS-TFT Pixel Circuit for Active Matrix Organic Light Emitting Diode Based on Improved Current Mirror”, Displays, vol. 44, pp.1-4, SEP 2016
8) “Super multi-view three-dimensional display technique for portable devices”, Optics Express, vol. 24(5), pp. 4421-4430, MAR 7 2016
(该期top download，并被OSA和AIP联合推荐至Phys. Org.进行了题为“Shrinking 3D technology for comfortable smart phone viewing”专访报道, https://phys.org/news/2016-02-3d-technology-comfortable-smart-viewing.html)
9) “Improved spatiotemporal-multiplexing super-multiview display based on planar aligned OLED microdisplays”, Optics Express, vol. 23(17), pp. 21549-21564, AUG 24, 2015
10) “An explanation for catastrophic failures of GaN-based vertical structure LEDs subjected to thermoelectric stressing”, Journal of Physics D: Applied Physics, vol. 48(30), 305102, AUG 5, 2015
11) “Simultaneously Enhancing the Angular-Color Uniformity, Luminous Efficiency, and Reliability of White Light-Emitting Diodes by ZnO@SiO2 Modified Silicones”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol.5 (5), pp.599-605, MAY 2015
12) “Size- and current-density-controlled tunable wavelength in gan-based leds for potential dense wavelength-division multiplexing application”, IEEE Wireless Communications, vol. 22(2), pp. 74-79, APR 2015 (注：2016年影响因子8.9)
13) “Multiview three-dimensional display with continuous motion parallax through planar aligned OLED microdisplays”, Optics Express，vol. 23(5), pp. 6007-6019, MAR 9, 2015
14) “Generation of 360° three-dimensional display using circular-aligned OLED microdisplays”, Optics Express, vol.23(3), pp.2058-2069, FEB 9, 2015
15) “Super multi-view three-dimensional display through spatial-spectrum time-multiplexing of planar aligned OLED microdisplays”, Optics Express, vol. 22(25), pp.31448-31457, DEC 15, 2014
16) “Reliability Concerns Related With the Usage of Inorganic Particles in White Light-Emitting Diodes”, IEEE Transactions on Device and Materials Reliability, vol.14 (4), pp. 968-971, DEC 2014
17) “An explanation for invalidity of working currents' derating on improving light-emitting diode devices' reliability”, Journal of Applied Physics, vol.114(2), 023102, JUL 14, 2013
18) “Aggravated efficiency droop in vertical-structured gallium nitride light-emitting diodes induced by high temperature aging”, Journal of Applied Physics, vol.113(8), 083105, FEB 28, 2013
19) “White LED devices with nearly uniform space-color distribution through nanoparticle usage”, 14th International Conference on Electronic Materials and Packaging(EMAP 2012), Dec 2012, Hong Kong, (Best student paper award)
20) “Efficiency degradation behaviors of current/thermal co-stressed GaN-based blue light emitting diodes with vertical-structure”, Journal of Applied Physics, vol.111(9), 093110, MAY 1 2012
21) “Mold-Free in Situ Formation of Encapsulating Lens With Controllable Viewing Angle for LEDs by Photosensitive Polymerization Process”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol.2(5), pp. 793-798, MAY 2012
22) “Full Resolution 3D Display on Computer Screen Free from Accommodation-convergence Conflict”, May 2017, SID Symposium Digest of Technical Papers;
23）An a-IGZO TFT pixel circuit with improved current mirror for active matrix organic light emitting diode displays, Aug 2016, 17the International Conference on Electronic Packaging Technology (ICEPT);
24) Improving thermal management in high power LEDs through fabricating nano-twinned copper substrates, Aug 2015, 16th International Conference on Electronic Packaging Technology (ICEPT);
25) The study on thermal crowding in high-power white light-emitting diode devices on luminaires, Aug 2015, 16th International Conference on Electronic Packaging Technology (ICEPT);
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