个人简介
Education:
2010/02 - 2010/12，Tianjin University, Ph. D.
2008/01 - 2010/01，Virginia Tech, Exchange student
2006/09 - 2007/12，Tianjin University, Master
2002/09 - 2006/07，Tianjin University, Bachelor
Work experience:
2011/05 until now, School of Materials Science and Engineering of Tianjin University, associated professor
2012/01 - 2012/02, Virginia Tech, visiting scholar
2015/02 - 2015/06, Hong Kong University of Science and Technology, visiting professor
Honors and awards：
IEEE CPMT Japan Chapter Young Award;
Peiyang Young Scholar" of Tianjin University.
Research projects：
Two 863 projects and 2 NSFC projects.
研究领域
Power electronics and materials; Reliability evaluation; Low temperature sinter-joining Micro-joining Fracture and plastic mechanics; Electrochemical migration; Finite element analysis.
近期论文
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Insulation and Reliability Enhancement by a Nonlinear Conductive Polymer-Nanoparticle Coating for Packaging of High-Voltage Power Devices
IEEE Transactions on Dielectrics and Electrical Insulation
2023 | Journal article
DOI: 10.1109/TDEI.2023.3316631
CONTRIBUTORS: Kai-Bing Sun; Yun-Hui Mei; Zhi-Bin Shuai; Longnv Li
On-Site Estimation of Thermal Resistance Degradation of Double-Sided Cooling (DSC) Power Modules Under Power Cycling Conditions
IEEE Journal of Emerging and Selected Topics in Power Electronics
2023-08 | Journal article
DOI: 10.1109/JESTPE.2023.3278453
CONTRIBUTORS: Yue Chen; Yun-Hui Mei; Puqi Ning; Guo-Quan Lu
Reliability Improvement of Low-Temperature Sintered Nano-Silver as Die Attachment by Porosity Optimization
IEEE Transactions on Components, Packaging and Manufacturing Technology
2023-08 | Journal article
DOI: 10.1109/TCPMT.2023.3299291
CONTRIBUTORS: Bowen Zhang; Shaoqiong Zhang; Xinyan Lu; Lili Han; Yun-Hui Mei
Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules
IEEE Transactions on Power Electronics
2023-06 | Journal article
DOI: 10.1109/TPEL.2023.3252266
CONTRIBUTORS: Siqi Liu; Yun-Hui Mei; Jing Li; Xin Li; Guo-Quan Lu
Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles
IEEE Transactions on Device and Materials Reliability
2023-06 | Journal article
DOI: 10.1109/TDMR.2023.3272928
CONTRIBUTORS: Panpan Lu; Longnv Li; Guo-Quan Lu; Zhibin Shuai; Xinhua Guo; Yun-Hui Mei
Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers
IEEE Transactions on Power Electronics
2022-09 | Journal article
DOI: 10.1109/TPEL.2022.3170067
CONTRIBUTORS: Xiao-Di Li; Guo-Quan Lu; Yun-Hui Mei
Reliable epoxy/SiC composite insulation coating for high-voltage power packaging
Journal of Materials Science: Materials in Electronics
2022-09 | Journal article
DOI: 10.1007/s10854-022-08865-8
CONTRIBUTORS: Yu Liang; Gaojia Zhu; Guo-Quan Lu; Yun-Hui Mei
A Reliable Way to Improve Electrochemical Migration (ECM) Resistance of Nanosilver Paste as a Bonding Material
Ding Zikun,Wang Zhichao,Zhang Bowen,Lu Guo-Quan,Mei Yun-Hui
Page:4748 ISSN:2076-3417 2022
Container-title:Applied Sciences
Design and Analysis of a Self-Circulated Oil Cooling System Enclosed in Hollow Shafts for Axial-Flux PMSMs
IEEE Transactions on Vehicular Technology
2022-05 | Journal article
DOI: 10.1109/TVT.2022.3154150
CONTRIBUTORS: Gaojia Zhu; Longnv Li; Yunhui Mei; Tao Liu; Ming Xue
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C
IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-04 | Journal article
DOI: 10.1109/TCPMT.2022.3159033
CONTRIBUTORS: Shi Chen; Yun-Hui Mei; Meiyu Wang; Xin Li; Guo-Quan Lu
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science
IEEE Journal of Emerging and Selected Topics in Power Electronics
2022-04 | Journal article
DOI: 10.1109/JESTPE.2022.3150223
CONTRIBUTORS: Meiyu Wang; Yunhui Mei; Weibo Hu; Xin Li; Guo-Quan Lu
Packaging Design of 15 kV SiC Power Devices With High-Voltage Encapsulation
IEEE Transactions on Dielectrics and Electrical Insulation
2022-02 | Journal article
DOI: 10.1109/TDEI.2022.3146569
CONTRIBUTORS: Junjie Li; Yu Liang; Yunhui Mei; Xinling Tang; Guo-Quan Lu
High-Temperature Characterizations of a Half-Bridge Wire-Bondless SiC MOSFET Module
IEEE Journal of the Electron Devices Society
2021 | Journal article
DOI: 10.1109/JEDS.2021.3119428
CONTRIBUTORS: Yue Chen; Guangyin Lei; Guo-Quan Lu; Yun-Hui Mei
Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging
IEEE Transactions on Power Electronics
2021-11 | Journal article
DOI: 10.1109/TPEL.2021.3074853
CONTRIBUTORS: Meiyu Wang; Yun-Hui Mei; Jingyou Jin; Shi Chen; Xin Li; Guo-Quan Lu
A 200 °C curable soft magnetic composite with high permeability and low core loss for power applications at >1 MHz
Journal of Magnetism and Magnetic Materials
2021-10 | Journal article
DOI: 10.1016/j.jmmm.2021.168061
CONTRIBUTORS: Xiaoyan Yao; Panpan Lu; Yanhong Tian; Guo-Quan Lu; Yunhui Mei
A Double-Sided Bidirectional Power Module With Low Heat Concentration and Low Thermomechanical Stress
IEEE Transactions on Power Electronics
2021-09 | Journal article
DOI: 10.1109/TPEL.2021.3066582
CONTRIBUTORS: Junlin Cao; Jing Li; Yun-Hui Mei
A Way to Reduce Leakage Current and Improve Reliability of Wire-Bonds for 300-A Multichip SiC Hybrid Modules
IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2020.3028132
CONTRIBUTORS: Wenbin Deng; Yunhui Mei; Meiyu Wang; Xin Li; Changsheng Ma; Guo-Quan Lu
Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-06 | Journal article
DOI: 10.1109/TCPMT.2021.3070020
CONTRIBUTORS: Yanliang Shan; Yunhui Mei; Meiyu Wang; Xin Li; Yanhong Tian; Gang Chen; Kim Shyong Siow
学术兼职
IEEE member;
Committee member of Device Sub-committee of China Power Supply Society.
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