个人简介

Doctoral of Philosophy Inorganic Chemistry University of Illinois at Urbana-Champaign 1979 Bachelor of Science (with honors) Chemistry California Institute of Technology 1975

研究领域

Analytical Materials

Professor Kelber’s research involves graphene growth and interfacial interactions, growth and characterization of novel electronic and spintronic materials, boron carbides, and plasma/surface interactions.

近期论文

查看导师最新文章 （温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Vamala, Chiranjeevi; Manandhar, Sudha; Kelber, Jeff “Pt Interactions with Annealed and Chemically-Etched Nb-doped SrTiO3(001) surfaces. Metal/Oxide Surface Chemical Effects on Band Bending Behavior”, Surface Science 603(1), 33-39 (2009). Manandhar, Sudha; Kelber, Jeffry “Effects of Molecular Versus Atomic Oxygen on NiSi and Ni(Pt)Si Films Grown on both p- and n-doped Si(100)”, Applied Physics Letters 92(15) (2008). S. Manandhar, B. Copp, J.A. Kelber "Oxidation of Ni(Pt)Si by Molecular vs. Atomic Oxygen", Appl. Surf. Sci. 254 (22) (2008). S. Manandhar and J.A. Kelber "Spontaneous Deposition of Pt and Ir on Ru: Reduction to Intermediate Oxidation States", Electrochim. Acta 52 (15) (2007). J. Kelber, N. Magtoto, C. Vamala, M. Jain, D.R. Jennison, P.A. Schultz "Reactivities of Ultrathin Alumina Films Exposed to Intermediate Pressures of H2O: Substrate-Mediated Mechanism for Growth and Loss of Surface Order", Surf. Sci. 601 (16) (2007). J.A. Wilks, N.P. Magtoto, J.A. Kelber, V. Arunachalam "Interfacial Reactions During Sputter Deposition of Ta and TaN Films on Organosilicate Glass: XPS and TEM Results", Appl. Surf. Sci. 253 (14) (2007). Kelber, Jeffry A. “Alumina Surfaces and Interfaces under Non-Ultrahigh Vacuum Conditions”, Surface Science Reports 62(7), 271-303 (2007). J. Kelber, S. Rudenja, C. Bjelkevig "Electrodeposition of Copper on Ru(0 0 0 1) in Sulfuric Acid Solution: Growth Kinetics and Nucleation Behavior", Electrochim. Acta 51 (15) (2006). J. Lei, S. Rudenja, N. Magtoto, J.A. Kelber "Cu Electrodeposition on Ru(0001): Perchlorate Dissociation and its Effects on Cu Deposition", Thin Solid Films 497 (1-2) (2006). F. Qin, N.P. Magtoto, J.A. Kelber, D.R. Jennison "Theory and Experiments on the Structure of 7 Å Alumina Films Grown on Ni3Al", Journal of Molecular Catalysis A: Chemical 228 (1-2) (2005). X. Zhao, N.P. Magtoto and J.A Kelber,"Chemical Vapor Deposition of Tantalum Nitride with Tert-Butylamina Tris(Diethylamino) and Atomic Hydrogen", Thin Solid Films (2005) J. Liu, J. Lei, N. Magtoto, M. Garza and J. A. Kelber, "The Effects of an Iodine Surface Layer on Ru Reactivity In Air and During Cu Electrodeposition" J. Electrochemical Society 152(2) (2005). Kelber, Jeffry A.; Lei, Jipu; Magtoto, Noel P.; Rudenja, Sergei “Conductors Created by Metal Deposition using a Selective Passivation Layer and Related Methods”, U.S. Pat. Appl. Publ. (2004), US 2004166658 A1 20040826. Jennison, Dwight R.; Bogicevic, Alexander; Kelber, Jeffry A.; Chambers, Scott A. “Method of Adhesion Between an Oxide Layer and a Metal Layer ”, U.S. Pat. Appl. Publ. (2004), US 6790476 B1 20040914. Zhao, X.; Magtoto, N. P.; Kelber, J. A. “Ruthenium Sputter Deposition on Organosilicate Glass and on Paralyne: An XPS Study of Interfacial Chemistry, Nucleation and Growth”, Materials Research Society Symposium Proceedings (2004), 812 F. Qin, N. P. Magtoto and J. A. Kelber, "H2O-Induced Instability of Al2O3/Ni3Al(110) and Al2O3/Ni3Al(111) Thin Films under Non-UHV Conditions" Surface Science Letters 565, L277-282 (2004) F. Qin, N. P. Magtoto and J. A. Kelber, and D. R. Jennison "Theory and Experiments on the Structure of the 7A Alumina Films Grown on Ni3Al" J. Molec. Catalysis A (in press) F. Qin, N. P. Magtoto and J. A. Kelber "Moisture-Induced Instability at the Al2O3/Ni3Al(110) Interface: Interfacial Chemistry" Materials at High Temperature 21(4), 193-204 (2004). M. Garza, Jian Liu, N. P. Magtoto and J. A. Kelber, "Adhesion Behavior of Electrolessly Deposited Cu on Pt/Ta Silicate and Pt/SiO2, Applied Surface Science 222, 253-62 (2004) J. Tong, N. Magtoto and J. Kelber, "Tetrakis(Diethylamido) Titianium (TDEAT) Interactions with SiO2 and Cu Substrates", Applied Surface Science 230, 203-16 (2003)