陈兢 - 北京大学 - 信息科学技术研究所

个人简介

Chen, Jing is a professor in the Department of Micronanoelectronics, School of EECS. He obtained his B.Sc. of Mechanical Engineering in 1997 from the Department of Precision Instrument and Mechanology, and PhD degree of Electrical Engineering in 2002 from the Institute of Microelectronics, both in Tsinghua University, Beijing, China. After finishing his PhD, he worked as a postdoctoral research fellow for two years in the Solid-State Electronics Laboratory, the Department of Electrical Engineering and Computer Science, the University of Michigan. He joined the faculty of Peking University in 2004. His research interests include multi-material microfabrication technologies and advanced packaging. Dr. Chen has published more than 100 research papers, and most of them are published in top-tier conferences and journals, such as JMM, PCCP, IEEE TCPMT, IEEE TSM and IEEE MEMS, MicroTAS, Transducers conference. He has served in the Technical Program Committee of various international conferences including IEEE NEMS and ISMNM. He has been serving as the deputy secretary general of Chinese Society of Micro/Nano Technologies since 2010.

研究领域

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1) Multi-material microfabrication technologies: With MEMS technology in different fields facing more requirements, such as bio-field reliability, compatibility; harsh environment of anti-radiation, anti-high temperature and pressure, shock, etc., the emerging bulk metal material for its superior performance, is gradually replacing traditional bulk silicon material in many applications. He proposed several metal-based deep etching process, as a reliable three-dimensional microfabrication technology. ICP etching of bulk metal material combined with other microfabrication technologies offers numerous opportunities in MEMS applications. 2) Advanced Packaging: 3D-TSV Package makes chip-level heterogeneous integration possible while satisfies the demands for high performance, small footprint and high reliability in aerospace applications. His research focuses on the reliability of TSV in aerospace applications, thermal management for 3D microsystems, key fabrication technologies for silicon interposer and high reliable TSV redundancy architecture.