个人简介
教育背景
2002/09-2008/07,清华大学，工学博士 导师：汪劲松
1998/09-2002/07,清华大学，工学学士
工作履历
2016/12-2018/01，佐治亚理工学院材料科学与工程系，访问学者
2013/12-至今, 清华大学机械工程系，副教授/副研究员
2010/08-2012/12, 清华大学精密仪器与机械学系，助理研究员
2008/08-2010/08, 清华大学精密仪器与机械学系，博士后
奖励与荣誉
国家科学技术进步奖 二等奖（100nm高密度等离子刻蚀机研发与产业化），2009年
清华大学“第六届青年教师教学大赛”理工组 一等奖，2014年
清华大学青年教师教学优秀奖 （10人/年），2015年
清华大学优秀硕士研究生指导教师，2019年
近期论文
查看导师新发文章
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Wang Z?, Shi Y?, Liu F, Wang H, Liu X, Sun R, Lu Y, Ji L, Wang ZL*, Cheng J*. 2020. Distributed mobile ultraviolet light sources driven by ambient mechanical stimuli. Nano Energy:104910. （IF=15.5）
Wang K, Lu Y, Cheng J*, Zhu X, Ji L. 2020. Quantitative electrostatic force measurement and characterization based on oscillation amplitude using atomic force microscopy. AIP Advances 10:015143.
Huo H?, Liu F?, Luo Y, Gu Q, Liu Y, Wang Z, Chen R, Ji L, Lu Y*, Yao R*, Cheng J*. 2020. Triboelectric nanogenerators for electro-assisted cell printing. Nano Energy 67:104150. （封底文章，IF=15.5）
Cao M, Lu Y, Cheng J*, Ji L. 2020. Electrical description of an inductively coupled plasma processing reactor with discharge parameters calculated from a global model. AIP Advances 10:035216.
Wu C?, Tetik H?, Cheng J?, Ding W, Guo H, Tao X, Zhou N, Zi Y, Wu Z, Wu H, Wang ZL*. 2019. Electrohydrodynamic jet printing driven by a triboelectric nanogenerator. Advanced Functional Materials 29:1901102. （IF=15.6）
Ding W?, Zhou J?, Cheng J?, Wang Z, Guo H, Wu C, Xu S, Wu Z, Xie X*, Wang ZL*. 2019. TriboPump: a low‐cost, hand‐powered water disinfection system. Advanced Energy Materials 9:1901320. （IF=24.9）
Liu F?, Liu Y?, Lu YJ, Wang ZZ, Shi YX, Ji LH*, Cheng J* "Electrical analysis of triboelectric nanogenerator for high voltage applications exampled by DBD microplasma." Nano Energy, 2019; 56: 482-493. （IF=15.5）
Wang KS, Lu YJ, Cheng J*, Ji LH, Prediction of residual clamping force for Coulomb type and Johnsen–Rahbek type of bipolar electrostatic chucks. Proceedings of the Institution of Mechanical Engineers, Part C: Journal of Mechanical Engineering Science, 2019; 233: 302-312.
Cheng J, Ding WB, Zi YL, et al., "Triboelectric microplasma powered by mechanical stimuli," Nature Communications, 2018; 9: 3733. （IF=11.9）
Wang KS, Cheng J, et al., A novel measuring method of clamping force for electrostatic chuck in semiconductor devices. Journal of Semiconductors, 2016. 37(4).
Wang KS, Cheng J*, et al., Determination of electrostatic force and its characteristics based on phase difference by amplitude modulation atomic force microscopy. Nanoscale Research Letters, 2016. 11.
Lu YJ, Ji LH, and Cheng J*, Simulation of Dual-Electrode Capacitively Coupled Plasma Discharges. Plasma Science & Technology, 2016. 18(12): p. 1175-1180.
Cao ML, Lu YJ, Cheng J*, Ji LH. Electron heating enhancement due to plasma series resonance in a capacitively coupled RF discharge: Electrical modeling and comparison to experimental measurements. Japanese Journal of Applied Physics 2016; 55.
Lin J, Hou YM, Cheng J, et al., Interactive Construction of Product Digital Model: The Recursive FBS Design Method and System Prototype. 2015 Advanced Design Concepts and Practice (Adcp 2015), 2016: p. 172-180.
Sun Y, Cheng J, Lu Y, Ji L, Wang C. Investigation on thermal contact resistance of Si-wafer and electrostatic chuck. Chinese Journal of Vacuum Science and Technology 2016; 36(1). (in Chinese)
Wang C, Cheng J, Lu Y, Ji L. Effect of showerhead hole structure on flow-field in large sized chemical vapor deposition reactor. Chinese Journal of Vacuum Science and Technology 2015; 35(11). (in Chinese)
Wang C, Cheng J, Ji L, Lu Y, Sun Y, Lin J. 2-D DSMC algorithm based on Delaunay triangles.Qinghua Daxue Xuebao/Journal of Tsinghua University 2015;55:1079-86,97. (in Chinese)
Sun Y, Cheng J, Lu Y, Hou Y, Ji L. Design space of electrostatic chuck in etching chamber. Journal of Semiconductors 2015;36.
Sun Y, Cheng J, Lu Y, Hou Y, Ji L. Factors influcing rarefied gas heat transfer between a wafer and an electrostatic chuck. Qinghua Daxue Xuebao/Journal of Tsinghua University 2015;55:756-60.
Wang XK, Cheng J, Wang KS, Yang YY, Sun YC, Cao ML, et al. Modeling of electrostatic chuck and simulation of electrostatic force. 2013 International Conference on Sensors, Mechatronics and Automation, ICSMA 2013, December 24, 2013 - December 25, 2013. Shenzhen, China: Trans Tech Publications; 2014. p. 588-94.
Wang X, Cheng J, Wang K, Yang Y, Sun Y, Cao M, et al. Finite element analysis on factors influencing the clamping force in an electrostatic chuck. Journal of Semiconductors 2014;35.
Cao ML, Cheng J, Han CK, Ji LH. The current status of development and applications of wave-heated discharge plasma sources. 4th International Conference on Advanced Engineering Materials and Technology, AEMT 2014, June 14, 2014 - June 15, 2014. Xiamen, China: Trans Tech Publications Ltd; 2014. p. 193-9.
Cheng J, Ji L, Wang K, Han C, Shi Y. Two-dimensional simulation of inductively coupled plasma based on COMSOL and comparison with experimental data. Journal of Semiconductors 2013;34.
Hao D, Cheng J, Ji L, Sun Y. Simulation of cold plasma in a chamber under high- and low-frequency voltage conditions for a capacitively coupled plasma. Journal of Semiconductors 2012;33.
Cheng J, Zhu Y, Ji L. Modeling approach and analysis of the structural parameters of an inductively coupled plasma etcher based on a regression orthogonal design. Plasma Science and Technology 2012;14:1059-68.
Cheng J, Ji L, Zhu Y, Shi Y. Fluid model of inductively coupled plasma etcher based on COMSOL. Journal of Semiconductors 2010;31.
Cheng J, Ji L, Zhu Y. Two-dimensional model and experimental comparison of an inductively coupled plasma. Qinghua Daxue Xuebao/Journal of Tsinghua University 2010;50:250-3. (in Chinese)
Cheng J, Zhu Y, Duan G, Wang C. Analysis of processing chamber flow field characteristics for an ICP etcher based on regression orthogonal design. Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors 2008;29:780-784. (in Chinese)
Cheng J, Zhu Y, Wang J. Two-dimensional discharge simulation of inductively coupled plasma etcher. Pan Tao Ti Hsueh Pao/Chinese Journal of Semiconductors 2007;28:989-994. (in Chinese)
Cheng J, Zhu Y, Duan G, Chen Y. Three-dimensional discharge simulation of inductively coupled plasma etcher. International Conference on Integration and Commercialization of Micro and Nanosystems 2007, January 10, 2007 - January 13, 2007. Sanya, Hainan, China: American Society of Mechanical Engineers; 2007. p. 795-800.
Cheng J, Zhu Y. Influence of configurations of chamber and coil on uniformity of plasma distribution for inductively coupled plasma etcher. International Technology and Innovation Conference 2006, ITIC 2006, November 6, 2006 - November 7, 2006. 524 ed. Hangzhou, China: Institution of Engineering and Technology; 2006. p. 1113-7.
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