赵德文 - 清华大学 - 机械工程系

个人简介

教育背景 2007/09-2012/06,清华大学，博士 2003/09-2007/06,华中科技大学，学士工作履历 2019/12至今，清华大学机械工程系，副研究员 2015/04-2019/12，清华大学机械工程系，助理研究员 2012/07-2015/04，清华大学精仪系，博士后荣誉与奖励 2019年天津市技术发明奖一等奖 (排名2) 2019年中国机械工业技术发明奖特等奖 (排名3) 2019年中国好设计金奖 (排名3) 2013年第三届上银优秀机械博士论文奖铜奖

研究领域

化学机械抛光、纳米摩擦学、超精密加工装备

近期论文

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Zhao D W, He Y Y, Wang T Q, et al. Comparative study of the lubricating behavior between 12-in. copper disk and wafer during chemical mechanical polishing, Tribology International, 2017, 105:37-41. 赵德文, 路新春, 何永勇, 王同庆, 化学机械抛光设备负载特性与主体结构变形, 机械工程学报, 2014, 50(15):160-165. Zhao D W, Lu X C, Chemical mechanical polishing: Theory and experiment, Friction, 2013, 1(4):306-326. Zhao D W, Wang T Q, He Y Y, Lu X C, Kinematic optimization for chemical mechanical polishing based on statistical analysis of particle trajectories, IEEE Transactions On Semiconductor Manufacturing, 2013, 26(4):556-563. Zhao D W, He Y Y, Wang T Q, Lu X C, Luo J B, Wafer bending/orientation characterization and their effects on fluid lubrication during chemical mechanical polishing, Tribology International, 2013, 66:330-336. Zhao D W, Wang T Q, He Y Y, Lu X C, Effect of zone pressure on wafer bending and fluid lubrication behavior during multi-zone CMP process, Microelectronic Engineering, 2013, 108:33-38. Zhao D W, He Y Y, Wang T Q, Lu X C, Effect of kinematic parameters and their coupling relationships on global uniformity of chemical mechanical polishing, IEEE Transactions On Semiconductor Manufacturing, 2012, 25(3):502-508. Zhao D W, He Y Y, Wang T Q, Lu X C, Luo J B, Effects of the polishing variables on the wafer-pad interfacial fluid pressure in chemical mechanical polishing of 12-inch wafer, Journal of the Electrochemical Society, 2012, 159(3):H342-H348. Zhao D W, He Y Y, Lu X C, In-situ measurement of fluid pressure at the wafer-pad interface during chemical mechanical polishing of 12" wafer, Journal of the Electrochemical Society, 2011, 159(1):H22-H28. Wang T Q, Zhao D W, He Y Y, Lu X C, Effect of slurry injection position on material removal in chemical mechanical planarization, International Journal of Advanced Manufacturing Technology, 2013, 67(9-12):2903-2908.