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Aihara, H., G. S. Selvaduray, A. Y. Craig, and J. Moskito, “Surface Characteristics and Biocompatibility Study of Electropolished Wrought Co-Cr Alloy L605 for Biomedical Application”, Proceedings of 2008 International Medical Devices Conference, Oct 1-3, 2008, Minneapolis, Minnesota
Leung, D. and G. Selvaduray, “Effect of Design Factors on Microvia Reliability of Flip Chip Ball Grid Array Polymeric Substrates,” Journal of Microelectronics and Electronic Packaging, No. 5, p 104-115. (2008)
Aihara, H. and G. S. Selvaduray, “Surface Characterization and Biocompatibility of Co-Cr Alloy L605 Electropolished in 15 vol % Phosphoric Acid”, Proceedings of 2008 Translational Biomaterial Research Symposium, Society for Biomaterials, September 11-13, 2008, Atlanta, Georgia
Drexel, M., G.S. Selvaduray, and A. Pelton, “The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire", Proceedings of Materials and Processes for Medical Devices Conference, Palm Desert, California (September 23-25, 2007)
Chun B., H, Aihara, A.M.-C. Kuo, K.Jaladi, G. S. Selvaduray, and A.Y. Craig, “Effect of Microblasting on Surface Characteristics and Cytotoxicity of NiTi”, Proceedings of Materials and Processes for Medical Devices Conference, Palm Desert, California (September 23-25, 2007)
Cruz, M. M., R. T. Winslow, and G.Selvaduray, “Effect of BGA Reballing on the Formation of Intermetallic Compounds,” Symposium for RoHS Impact on Rework/Repair/ Reprocessing, Maryland, USA (September 11, 2007).
Vukazich, S., G. Selvaduray, and J. Tran, “Santa Clara County Soft First Story Multi Unit Building Survey”, Earthquake Spectra, Earthquake Engineering Research Institute, (November 2006)
Selvaduray, G. and S. Trigwell, “Effect of Surface Treatment on Surface Characteristics and Biocompatibility of AISI 316L Stainless Steel,” Proceedings of NanoBio2006 Frontiers in Biomedical Devices Conference, Irvine, California. (June 8-9, 2006)
Drexel, Masao J., G. Selvaduray and A. Pelton, “The Effects of Cold Work and Heat Treatment on the Properties of Nitinol Wire”, Proc. 4th International Conference on Shape Memory and Superelastic Technologies, Asilomar, California. (April 2006).
Trigwell, S. and G. Selvaduray, “Effects of welding on the passive oxide film of electropolished 316L stainless steel,” Journal of Materials Processing Technology, No. 166 p 30-43 (2005).
Selvaduray, G., “Protecting Laboratory Equipment by Implementing Nonstructural Hazard Mitigation,” Seismic Design, Retrofit and Performance of Nonstructural Components in Critical Facilities, ATC-29-2, Applied Technology Council, Redwood City, California, (October, 2003)
Selvaduray, G., and H. Bueno, "The Critical Surface Tension of 316L Stainless Steel: Implications for Stent Thrombogenicity", Proceedings ASM Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.
Fariabi, S., M. Rooein and G. Selvaduray, "Structure-Property-Processing Relationships of 316L Stainless Steel Hypotubing for Manufacturing of Intravascular Stents", Proceedings Materials and Processes for Medical Devices Conference, ASM International, Anaheim, California, September 8-10, 2003.
Trigwell, S. and G. Selvaduray, "Effects of welding electropolished 316L stainless steel as used in ultra-pure fluid delivery systems for the semiconductor and pharmaceutical industries," Journal of the Arkansas Academy of Science, Vol. 59, pp 198-207 (2002)
Selvaduray, G., "Hazardous Materials: Earthquake Caused Incidents and Mitigation Approaches," in Earthquake Engineering Handbook, W. F. Chen and C. Scawthorn, Eds., CRC Press, 2002, p 30-1 ~ 30-29.
Selvaduray, G., W. Lee and S. Yee, "Fluxless Soldering: A Review," Microelectronic Packaging, 2001, Vol. 1, pp 289-304.
Abtew, M. and G. Selvaduray, "Lead-Free Solders in Microelectronics," Materials Science & Engineering Reports, Vol R27, Nos 5-6, June 1, 2000.
Selvaduray, G, "Recyclability of Microelectronic Systems," Advances in Packaging Development and Research, Edited by J.A. Marcondes, (June 2000) pp 450 - 460.
Selvaduray, G, "Sintered Architectural Glass Tiles from Recycled Glass," Advances in Packaging Development and Research,, Edited by J.A. Marcondes, (June 2000) pp 461 – 467.
Lee, W., L.T. Nguyen and G. Selvaduray, "Solder Joint Fatigue Models – Review and Applicability to Chip Scale Packages," Microelectronics Reliability, 40 (2000), pp 231-244.
Selvaduray, G., "Transforming the Mechanical Engineering Curriculum to meet the Challenges of the 21st Century," Invited paper for the Journal of the Japan Society of Mechanical Engineering, November, 1998.
Selvaduray, G., "Effect of the Hanshin-Awaji Earthquake on Manufacturing Industries," Proceedings of the Sixth National Conference on Earthquake Engineering, EERI, Oakland, California, May 1998.
Selvaduray, G., "Earthquake Caused Hazardous Materials Incidents at Educational Facilities", Seismic Design, Retrofit and Performance of Nonstructural Components, Applied Technology Council, Redwood City, California, (January 1998)
Trigwell, S., R. Hayden, K. Nelson and G. Selvaduray, "Effects of Treatment on the Surface Chemistry of NiTi Shape Memory Alloys", Journal of Surface and Interface Analysis, June, 1997.
Thomas, S., E. Hasenkamp and G. Selvaduray, "Determination of Oxygen Diffusion in Ionic Solids", The Journal of Materials Education, Vol 19, No. 3, pp 213-215.