个人简介
2002.04- 至今:西北工业大学 凝固技术国家重点实验室 教授 1995.12-2002.04:西北工业大学 凝固技术国家重点实验室 副教授 1990.06-1995.12:西北工业大学 材料科学与工程系 讲师 1986.06-1990.06:西北工业大学 材料科学与工程系 助教 教育经历 Education Experience 1995.03-2000.04:西北工业大学 材料学 工学博士 1983.09-1986.06:西北工业大学 铸造 工学硕士 1979.09-1983.07:西北工业大学 铸造 工学学士
研究领域
主要研究领域:高导热材料、电子封装材料、纳米复合材料及凝固技术。
近期论文
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C. Xue, J.K. Yu. Enhanced thermal transfer and bending strength of SiC/Al composite with controlled interfacial reaction. Materials & Design 2014, 53: 74-78. C.X. Ma, J.K. Yu, C. Xue, Z.Q. Zhang. Interfacial reactions and bending strength of SiC/A356/FeNi50 composite fabricated by gas pressure infiltration. Transactions of Nonferrous Metals Society of China 2013, 23(8): 2229-2235. W. Yu, J.K. Yu. Silicon dissolution and interfacial characteristics of Si/Al composites fabricated by gas pressure infiltration. Materials Chemistry and Physics 2013, 139(2-3): 783-788. C. Xue, J.K. Yu, Z.Q. Zhang. In-situ joining of titanium to SiC/Al composites by low pressure infiltration. Materials & Design 2013, 47: 267-273. C. Xue, J.K. Yu. Enhanced thermal conductivity in diamond/aluminum composites: Comparison between the methods of adding Ti into Al matrix and coating Ti onto diamond surface. Surface and Coatings Technology 2013, 217: 46-50. X.M. Zhu, J.K. Yu, X.Y. Wang. Microstructure and properties of Al/Si/SiC composites for electronic packaging. Transactions of Nonferrous Metals Society of China 2012, 22(7): 1686-1692. C. Xue, J.K. Yu. Thermal conductivity of TiC-coated diamond/Al composites. Emerging Materials Research 2012, 1(2): 99-105. C. Xue, J.K. Yu, X.M. Zhu. Thermal properties of diamond/SiC/Al composites with high volume fractions. Materials & Design 2011, 32(8-9): 4225-4229. H. Feng, J.K. Yu, W. Tan. Microstructure and thermal properties of diamond/aluminum composites with TiC coating on diamond particles. Materials Chemistry and Physics 2010, 124(1): 851-855. B. Yang, J.K. Yu, C. Chen. Microstructure and thermal expansion of Ti coated diamond/Al composites. Transactions of Nonferrous Metals Society of China 2009, 19(5): 1167-1173.