李欣 - 天津大学 - 材料科学与工程学院

个人简介

教育背景： 2003.9 – 2007.7 天津大学材料学院材料成型及控制工程系工学学士 2007.9 – 2012.1 天津大学材料学院材料加工工程系工学博士工作经历： 2012.4 – 今天津大学材料学院副教授 2014.6 – 2015.1 美国弗吉尼亚理工大学材料科学与工程系访问学者主要承担项目： [1]裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究，国家自然科学基金，2015.1-2017.12 [2]新型热界面材料封装大功率LED的恶劣环境可靠性研究，天津市自然科学基金，2013.4-2016.3 [3]功率电子封装中新型热界面材料的高温扩散行为研究，教育部博士点基金，2014.1-2016.12 [4]高密度三维封装IGBT无铅化模块关键技术研究，天津大学自主创新基金，2016.1-2017.12 [5]功率电子封装中新型热界面材料的高温扩散行为研究，天津大学自主创新基金，2013.1-2014.12

研究领域

高温功率电子及光电子封装技术；封装材料与结构可靠性及失效分析

近期论文

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An explanation for the effect of Au surface finish on the quality of sintered Ag-Au joints Liting Lin,Xin Li,Hongyu Zhang Page:156356 ISSN:0169-4332 2023 Container-title:Applied Surface Science Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate Li Xin,Lin Liting,Du Cheng-Jie,Li Jie Page:391-398 ISSN:2156-3950 2023 Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules IEEE Transactions on Power Electronics 2023-06 | Journal article DOI: 10.1109/TPEL.2023.3252266 CONTRIBUTORS: Siqi Liu; Yun-Hui Mei; Jing Li; Xin Li; Guo-Quan Lu Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C IEEE Transactions on Components, Packaging and Manufacturing Technology 2022-04 | Journal article DOI: 10.1109/TCPMT.2022.3159033 CONTRIBUTORS: Shi Chen; Yun-Hui Mei; Meiyu Wang; Xin Li; Guo-Quan Lu Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science IEEE Journal of Emerging and Selected Topics in Power Electronics 2022-04 | Journal article DOI: 10.1109/JESTPE.2022.3150223 CONTRIBUTORS: Meiyu Wang; Yunhui Mei; Weibo Hu; Xin Li; Guo-Quan Lu High thermal conductivity diamond-doped silver paste for power electronics packaging Zhao Peihao,Li Xin,Mei Yunhui,Lu Guo-Quan Page:131603 ISSN:0167-577X 2022 Container-title:Materials Letters Study on the Performance of Insulating Substrate Based on Silver Sintering Zhao Weirong,Li Xin Page:253-258 ISSN:2156-3950 2022 Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging IEEE Transactions on Power Electronics 2021-11 | Journal article DOI: 10.1109/TPEL.2021.3074853 CONTRIBUTORS: Meiyu Wang; Yun-Hui Mei; Jingyou Jin; Shi Chen; Xin Li; Guo-Quan Lu A Way to Reduce Leakage Current and Improve Reliability of Wire-Bonds for 300-A Multichip SiC Hybrid Modules IEEE Journal of Emerging and Selected Topics in Power Electronics 2021-08 | Journal article DOI: 10.1109/JESTPE.2020.3028132 CONTRIBUTORS: Wenbin Deng; Yunhui Mei; Meiyu Wang; Xin Li; Changsheng Ma; Guo-Quan Lu Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging IEEE Transactions on Components, Packaging and Manufacturing Technology 2021-06 | Journal article DOI: 10.1109/TCPMT.2021.3070020 CONTRIBUTORS: Yanliang Shan; Yunhui Mei; Meiyu Wang; Xin Li; Yanhong Tian; Gang Chen; Kim Shyong Siow A Novel Hermetic Sealing Method for the Metal Package Based on Electric-Current-Assisted Sintering of Silver Paste IEEE Transactions on Components, Packaging and Manufacturing Technology 2021-05 | Journal article DOI: 10.1109/TCPMT.2021.3069277 CONTRIBUTORS: Yongfei Zhang; Xin Li; Yunhui Mei; Guo-Quan Lu I3–/I– Redox Enhanced Sodium Metal Batteries by Using Graphene Oxide Encapsulated Mesoporous Carbon Sphere Cathode Xudong Hu, Yang Zhao, Seung Joon Yoo, Xin Li, Xiaojun Zeng, Chunming Zheng, Xiaohong Sun, Galen D. Stucky First published: 31 May 2021 https://doi.org/10.1002/adfm.202101637 Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules IEEE Transactions on Components, Packaging and Manufacturing Technology 2021-01 | Journal article DOI: 10.1109/TCPMT.2020.3032962 CONTRIBUTORS: Hong-Yu Zhang; Xin Li; Han-Ning Jiang; Yun-Hui Mei; Guo-Quan Lu Recent progress in rate and cycling performance modifications of vanadium oxides cathode for lithium-ion batteries Zhang Xi,Sun Xiaohong,Li Xin,Hu Xudong,Cai Shu,Zheng Chunming Page:343-363 ISSN:2095-4956 2021 Container-title:Journal of Energy Chemistry A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules IEEE Transactions on Power Electronics 2020-08 | Journal article DOI: 10.1109/TPEL.2019.2963236 CONTRIBUTORS: Xinyin Zhang; Meiyu Wang; Xin Li; Zikun Ding; Changsheng Ma; Guo-Quan Lu; Yunhui Mei Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic IET Power Electronics 2020-08 | Journal article DOI: 10.1049/iet-pel.2019.1345 CONTRIBUTORS: Yunhui Mei; Baisen Hao; Yue Chen; Meiyu Wang; Xin Li; Guo‐Quan Lu Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC–DC Converter IEEE Transactions on Power Electronics 2020-01 | Journal article DOI: 10.1109/TPEL.2019.2907770 CONTRIBUTORS: Junchang Liu; Yunhui Mei; Shengchang Lu; Xin Li; Guo-Quan Lu