个人简介
教育背景:
2003.9 – 2007.7 天津大学 材料学院 材料成型及控制工程系 工学学士
2007.9 – 2012.1 天津大学 材料学院 材料加工工程系 工学博士
工作经历:
2012.4 – 今 天津大学材料学院 副教授
2014.6 – 2015.1 美国弗吉尼亚理工大学材料科学与工程系 访问学者
主要承担项目:
[1]裸铜基大功率IGBT器件的无铅烧结型界面及其服役可靠性研究,国家自然科学基金,2015.1-2017.12
[2]新型热界面材料封装大功率LED的恶劣环境可靠性研究,天津市自然科学基金,2013.4-2016.3
[3]功率电子封装中新型热界面材料的高温扩散行为研究,教育部博士点基金,2014.1-2016.12
[4]高密度三维封装IGBT无铅化模块关键技术研究,天津大学自主创新基金,2016.1-2017.12
[5]功率电子封装中新型热界面材料的高温扩散行为研究,天津大学自主创新基金,2013.1-2014.12
研究领域
高温功率电子及光电子封装技术;封装材料与结构可靠性及失效分析
近期论文
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An explanation for the effect of Au surface finish on the quality of sintered Ag-Au joints
Liting Lin,Xin Li,Hongyu Zhang
Page:156356 ISSN:0169-4332 2023
Container-title:Applied Surface Science
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate
Li Xin,Lin Liting,Du Cheng-Jie,Li Jie
Page:391-398 ISSN:2156-3950 2023
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules
IEEE Transactions on Power Electronics
2023-06 | Journal article
DOI: 10.1109/TPEL.2023.3252266
CONTRIBUTORS: Siqi Liu; Yun-Hui Mei; Jing Li; Xin Li; Guo-Quan Lu
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C
IEEE Transactions on Components, Packaging and Manufacturing Technology
2022-04 | Journal article
DOI: 10.1109/TCPMT.2022.3159033
CONTRIBUTORS: Shi Chen; Yun-Hui Mei; Meiyu Wang; Xin Li; Guo-Quan Lu
Pressureless Sintered-Silver as Die Attachment for bonding Si and SiC Chips on Silver, Gold, Copper, and Nickel Metallization for Power Electronics Packaging: The Practice and Science
IEEE Journal of Emerging and Selected Topics in Power Electronics
2022-04 | Journal article
DOI: 10.1109/JESTPE.2022.3150223
CONTRIBUTORS: Meiyu Wang; Yunhui Mei; Weibo Hu; Xin Li; Guo-Quan Lu
High thermal conductivity diamond-doped silver paste for power electronics packaging
Zhao Peihao,Li Xin,Mei Yunhui,Lu Guo-Quan
Page:131603 ISSN:0167-577X 2022
Container-title:Materials Letters
Study on the Performance of Insulating Substrate Based on Silver Sintering
Zhao Weirong,Li Xin
Page:253-258 ISSN:2156-3950 2022
Container-title:IEEE Transactions on Components, Packaging and Manufacturing Technology
Pressureless Sintered-Silver Die-Attach at 180 °C for Power Electronics Packaging
IEEE Transactions on Power Electronics
2021-11 | Journal article
DOI: 10.1109/TPEL.2021.3074853
CONTRIBUTORS: Meiyu Wang; Yun-Hui Mei; Jingyou Jin; Shi Chen; Xin Li; Guo-Quan Lu
A Way to Reduce Leakage Current and Improve Reliability of Wire-Bonds for 300-A Multichip SiC Hybrid Modules
IEEE Journal of Emerging and Selected Topics in Power Electronics
2021-08 | Journal article
DOI: 10.1109/JESTPE.2020.3028132
CONTRIBUTORS: Wenbin Deng; Yunhui Mei; Meiyu Wang; Xin Li; Changsheng Ma; Guo-Quan Lu
Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging
IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-06 | Journal article
DOI: 10.1109/TCPMT.2021.3070020
CONTRIBUTORS: Yanliang Shan; Yunhui Mei; Meiyu Wang; Xin Li; Yanhong Tian; Gang Chen; Kim Shyong Siow
A Novel Hermetic Sealing Method for the Metal Package Based on Electric-Current-Assisted Sintering of Silver Paste
IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-05 | Journal article
DOI: 10.1109/TCPMT.2021.3069277
CONTRIBUTORS: Yongfei Zhang; Xin Li; Yunhui Mei; Guo-Quan Lu
I3–/I– Redox Enhanced Sodium Metal Batteries by Using Graphene Oxide Encapsulated Mesoporous Carbon Sphere Cathode
Xudong Hu, Yang Zhao, Seung Joon Yoo, Xin Li, Xiaojun Zeng, Chunming Zheng, Xiaohong Sun, Galen D. Stucky
First published: 31 May 2021 https://doi.org/10.1002/adfm.202101637
Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules
IEEE Transactions on Components, Packaging and Manufacturing Technology
2021-01 | Journal article
DOI: 10.1109/TCPMT.2020.3032962
CONTRIBUTORS: Hong-Yu Zhang; Xin Li; Han-Ning Jiang; Yun-Hui Mei; Guo-Quan Lu
Recent progress in rate and cycling performance modifications of vanadium oxides cathode for lithium-ion batteries
Zhang Xi,Sun Xiaohong,Li Xin,Hu Xudong,Cai Shu,Zheng Chunming
Page:343-363 ISSN:2095-4956 2021
Container-title:Journal of Energy Chemistry
A Method for Improving the Thermal Shock Fatigue Failure Resistance of IGBT Modules
IEEE Transactions on Power Electronics
2020-08 | Journal article
DOI: 10.1109/TPEL.2019.2963236
CONTRIBUTORS: Xinyin Zhang; Meiyu Wang; Xin Li; Zikun Ding; Changsheng Ma; Guo-Quan Lu; Yunhui Mei
Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic
IET Power Electronics
2020-08 | Journal article
DOI: 10.1049/iet-pel.2019.1345
CONTRIBUTORS: Yunhui Mei; Baisen Hao; Yue Chen; Meiyu Wang; Xin Li; Guo‐Quan Lu
Continuously Variable Multi-Permeability Inductor for Improving the Efficiency of High-Frequency DC–DC Converter
IEEE Transactions on Power Electronics
2020-01 | Journal article
DOI: 10.1109/TPEL.2019.2907770
CONTRIBUTORS: Junchang Liu; Yunhui Mei; Shengchang Lu; Xin Li; Guo-Quan Lu