Roy, Sudipta - University of Strathclyde - Department of Chemical & Process Engineering

个人简介

I completed my BTech in Chemical Engineering from the Indian Institute of Technology, Delhi in 1985. After working in India for just over a year I studied for MS (1990) and PhD degrees (1992) in Chemical Engineering from Tulane University in the USA. I then spent nearly three years as postdoctoral scientist at the materials department in EPFL in Switzerland, before moving to Newcastle University in the UK in 1994 to take up a position as lecturer in Chemical Engineering. I was promoted to Reader in 2000 and then to a personal chair in Electrochemical Nanomaterials in 2005. In 2015 I moved to the University of Strathclyde where I am currently Professor of Chemical Engineering and Head of Department. I am a Fellow of the IChemE, IMF and a Chartered Engineer

研究领域

I am interested in employing electrochemistry and electrochemical engineering to fabricate novel materials at the micro- and nano-scales. The applications of my research are in corrosion mitigation, manufacturing micro and nano devices for electronics and implants, and the removal of toxic substances from effluents. Much of the work embraces principles of green chemistry for sustainable process development

近期论文

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Application of a duplex diffusion layer model to pulse reverse platingGreen T.A., Roy S.Transactions of the Institute of Metal Finishing Vol 95, pp. 46-51, (2017)http://dx.doi.org/10.1080/00202967.2016.1214354 Fast degradation of dyes in water using manganese-oxide-coated diatomite for environmental remediationDang Trung-Dung, Banerjee Arghya Narayan, Tran Quang-Tung, Roy SudiptaJournal of Physics and Chemistry of Solids Vol 98, pp. 50-58, (2016)http://dx.doi.org/10.1016/j.jpcs.2016.06.006 Electrochemical copper recovery from galvanic sludgeHuyen Pham T., Dang T.D., Tung Mai T., Huyen Nguyen T.T., Green T.A., Roy S.Hydrometallurgy Vol 164, pp. 295-303, (2016)http://dx.doi.org/10.1016/j.hydromet.2016.06.028 Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodSerrà Albert , Coleman Simon J., Gómez Elvira, Green T.A., Vallés Elisa, Vilana Joan, Roy SudiptaElectrochimica Acta Vol 207, pp. 207-217, (2016)http://dx.doi.org/10.1016/j.electacta.2016.04.003 Effect of additive concentration during copper deposition using EnFACE electrolyteDela Pena E.M., Bains N., Hussain A., Cobley A., Roy SudiptaTransactions of the Institute of Metal Finishing Vol 93, pp. 288-293, (2015)http://dx.doi.org/10.1080/00202967.2015.1117257 Effect of fluorosurfactant additive during Cu-Sn codeposition from methanesulfonic acidPewnim Naray, Roy SudiptaJournal of the Electrochemical Society Vol 162, pp. D360-D364, (2015)http://dx.doi.org/10.1149/2.0551508jes