个人简介
Initially I studied at the University of Western Australia and obtained a BSc(Hon) and PhD in Physical Chemistry. I was then a post-doctoral researcher in electrochemistry at Aarhus University in Denmark (1995) and electrochemical engineering at the University of Newcastle in the UK (1996 - 1998). Subsequently I worked (1999 - 2015) as a Process Engineer for a number of UK companies involved in the microfabrication of optoelectronic, semiconductor and microsystem devices.
In 2015 I moved to the University of Strathclyde where I am currently a Knowledge Exchange Associate in the Department of Chemical and Process Engineering. I am a member of Institute of Engineering and Technology (IET) and NACE International.
近期论文
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Application of a duplex diffusion layer model to pulse reverse platingGreen T.A., Roy S.Transactions of the Institute of Metal Finishing Vol 95, pp. 46-51, (2017)http://dx.doi.org/10.1080/00202967.2016.1214354
Electrochemical copper recovery from galvanic sludgeHuyen Pham T., Dang T.D., Tung Mai T., Huyen Nguyen T.T., Green T.A., Roy S.Hydrometallurgy Vol 164, pp. 295-303, (2016)http://dx.doi.org/10.1016/j.hydromet.2016.06.028
Sono-electrodeposition transfer of micro-scale copper patterns on to A7 substrates using a mask-less methodSerrà Albert , Coleman Simon J., Gómez Elvira, Green T.A., Vallés Elisa, Vilana Joan, Roy SudiptaElectrochimica Acta Vol 207, pp. 207-217, (2016)http://dx.doi.org/10.1016/j.electacta.2016.04.003
Gold etching for microfabricationGreen T. A.Gold Bulletin Vol 47, pp. 205-216, (2014)http://dx.doi.org/10.1007/s13404-014-0143-z
Pulse PlatingHansal Wolfgang E. G., Roy Sudipta, Leisner Peter, Green Todd, Reichenbach Andreas(2012)
Electrodeposition of microstructures using a patterned anodeWu Qi-Bai, Green T. A., Roy S.Electrochemistry Communications Vol 13, pp. 1229-1232, (2011)http://dx.doi.org/10.1016/j.elecom.2011.08.037