张志昊 - 厦门大学

个人简介

工作经历 2015.9-至今助理教授厦门大学材料学院 2012.12-2015.9 博士后研究员哈尔滨工业大学电力电子与电力传动教育背景 2009.07-2012.10 工学博士哈尔滨工业大学材料加工工程 2007.09-2009.07 工学硕士哈尔滨工业大学材料加工工程 2002.09-2006.07 工学学士哈尔滨工业大学材料成型及控制工程

研究领域

1. 电子封装材料与可靠性 2. 纳米金属浆料制备与应用 3. 先驱体陶瓷材料与器件

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

1.Zhihao Zhang*, Huijun Cao, Yong Xiao, Yong Cao, Mingyu Li, and Yuxi Yu. Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu|SnAg3.0Cu0.5|Cu lap-type interconnects. J. Alloy. Compd. 2017, 703, 1-9. 2.Z.H. Zhang*, M.Y. Li*, Z.Q. Liu and S.H. Yang. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Mater. 2016, 104, 1-8. 3.Zhihao Zhang*, Huijun Cao, Mingyu Li*, Yuxi Yu, Haifeng Yang and Shihua Yang. Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction. Mater. Design. 2016, 94, 280-285. 4.Z.H. Zhang*, H.J. Cao, H.F. Yang, M.Y. Li* and Y.X. Yu. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder. J. Electron. Mater. 2016, DOI: 10.1007/s11664-016-4814-9. 5.M.Y. Li*, H.F. Yang, Z.H. Zhang*, J.H. Gu and S.H. Yang. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. SCI REP-UK. 2016, 6, 27522. 6.Huijun Cao, Yuchuan Chu, Ermeng Wang, Yong Cao*, Guangqing Xia and Zhihao Zhang*. Numerical Simulation Study on Barrel Erosion of Ion Thruster Accelerator Grid. J. Propul. Power. 2015, 31, 1785-1792. 7.Mingyu Li*, Yong Xiao, Zhihao Zhang* and Jie Yu. Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications. ACS Appl. Mater. Inter. 2015, 7, 9157-9168. 8.Z.H. Zhang, H.J. Cao, M.Y. Li*, Y. Wang and Z.Q. Liu*. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing. J. Appl. Phys. 2014, 116, 054909. 9.Zhihao Zhang, Mingyu Li* and Chunqing Wang*. Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics, 2013, 42, 52-55. 10.M.Y. Li*, Z.H. Zhang and J.M. Kim*. Polymorphic transformation mechanism of η and η' in single crystalline Cu6Sn5. Appl. Phys. Lett. 2011, 98, 201901.