个人简介
教育背景
2004.09 - 2010.6 中国科学院金属研究所 博士
2000.09 - 2004.06 南京理工大学 学士
工作履历
2015.06-至今 南京理工大学 格莱特纳米科技研究所、材料科学与工程学院
教授
2013.09-2015.05 美国约翰霍普金斯大学 机械工程系、极端环境材料研究所
研究科学家
2010.09-2013.09 美国约翰霍普金斯大学机械工程系博士后
研究领域
研究兴趣主要集中在极端环境材料的设计和使役行为研究，具体包括：
1.纳米结构材料的强化和增韧机制研究
2.基于变形机制的镍基合金材料的高温力学行为调控
3.极端环境下的材料使役行为研究
4.轻质三维点阵材料的设计、制备和表征
近期论文
查看导师最新文章
（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）
1. Y. Zhang, S. Ha, K. Sharp, J.K. Guest, T.P. Weihs, K.J. Hemker, “Fabrication and mechanical characterization of 3D woven Cu lattice materials”, Materials & Design, 85(2015)743-751.
2. W.G. Huang, K. Besar, Y. Zhang, S. Yang, G. Wiedman, Y. Liu, W.M. Guo, J. Song, K.J. Hemker, K. Hristova, I.J. Kymissis, H.E. Katz, “A High-capacitance salt-free dielectric for self-healable, printable, and flexible organic field effect transistors and chemical sensor”, Advanced Functional Materials 25 (2015) 3745-3755.
3. L.Y. Zhao, S. Ha, K. Sharp, A.B. Geltmacher, R.W. Fonda, A. Kinsey, Y. Zhang, S. Ryan, D. Erdeniz, D.C. Dunand, K.J. Hemker, J.K. Guest, T.P. Weihs, “Permeability Measurements and Modeling of Topology-optimized Metallic 3D Woven Lattices”, ActaMaterialia, 81 (2014) 326-336.
4. J.A. Sharon, Y. Zhang, F. Mompiou, M. Legros, K.J. Hemker, “Discerning Size Effect Strengthening in Ultra-fine Grain Mg Thin Films”, ScriptaMaterialia, 75 (2014) 10-13.
5. D.E. Burns, Y. Zhang, T.P. Weihs, K.J. Hemker, “Properties of Sputter Deposited Ni-base Superalloys for Microelectromechanical Systems”, Thin Solid Films 558 (2014) 20-23.
6. Y. Zhang, J.A. Sharon, G.L. Hu, K.T. Ramesh, K.J. Hemker, “Stress-driven Grain Growth in Ultrafine-grained Mg Thin Film”, ScriptaMaterialia, 68 (2013) 424-427.
7. D.E. Burns, Y. Zhang, M. Teutsch, K. Bade, J. Aktaa, K.J. Hemker, “Development of Ni-based Superalloys for Microelectromechanical Systems”, ScriptaMaterialia, 67 (2012) 459-462.
8. Y. Zhang, N.R. Tao, K. Lu, “Effects of Stacking Fault Energy, Strain Rate and Temperature on Microstructure and Strength of Nanostructured Cu-Al Alloys Subjected to Plastic Deformation”, ActaMaterialia, 59 (2011) 6048-6058.
9. Y. Zhang, N.R. Tao, K. Lu, “Effect of Stacking-fault Energy on Deformation Twin Thickness in Cu-Al Alloys”, ScriptaMaterialia, 60 (2009) 211-213.
10. Y.S. Li, Y. Zhang, N.R. Tao, K. Lu, “Effect of the Zener-Hollomon Parameter on the Microstructures and Mechanical Properties of Cu Subjected to Plastic Deformation”, ActaMaterialia, 57 (2009) 761-772.
11. Y.S. Li, Y. Zhang, N.R. Tao, K. Lu, “Effect of Thermal Annealing on Mechanical Properties of a Nanostructured Copper Prepared by means of Dynamic Plastic Deformation”, ScriptaMaterialia, 59 (2008) 475-478.
12. Y. Zhang, N.R. Tao, K. Lu, “Mechanical Properties and Rolling Behaviors of Nano-grained Copper with Embedded Nano-twin Bundles”, ActaMaterialia, 56 (2008) 2429-2440.
13. Y. Zhang, Y.S. Li, N.R. Tao, K. Lu, “High Strength and High Electrical Conductivity in Bulk Nanograined Cu Embedded with Nanoscale Twins”, Applied Physics Letters, 91 (2007) 211901.
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