个人简介
2006年7月，江苏省“材料加工工程”十一五重点学科建设首席学科带头人
1991年获机械电子工业部青年科技专家称号
2000年6月被国务院批准为享受政府特殊津贴专家
2004年1月至今 南京航空航天大学材料科学与技术学院教授、博导
学历：2002年4月获哈尔滨工业大学材料加工工程学科工学博士学位
1987年5月获上海交通大学工学硕士学位
1981年12月获湖南大学理学学士学位
研究领域
01 先进连接技术02 微电子组装与封装03 焊接新工艺与新装备 04 焊接新材料设计与制备
近期论文
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Peng Xue,Song-bai Xue,Yi-fu Shen,et al.Interfacial microstructures and mechanical properties of Sn-9Zn-0.5Ga-xNd on Cu substrate with aging treatment. Materials and Design[J]. 2014, 60: 1–6 （SCI收录）
Ji Feng, Xue Songbai, Growth behaviors of intermetallic compound layers in Cu/Al joints brazed with Zn–22Al and Zn–22Al–0.05Ce filler metals, Materials & Design, 2013, 51: 907–915 （SCI收录）
Huan Ye, Songbai Xue, Jiadong Luo and Yang Li, Properties and interfacial microstructure of Sn–Zn–Ga solder joint with rare earth Pr addition, Materials & Design, 2013,46: 816–823 （SCI收录）
Huan Ye, Songbai Xue, Michael Pecht, Effects of thermal cycling on rare earth(Pr)- induced Sn whisker/hillock growth, Materials Letters, 2013,98: 78-81 （SCI收录）
Dai Wei, Xue Song-bai, Lou Ji-yuan, Wang Shui-qing. Development of Al–Si–Zn–Sr filler metals for brazing 6061 aluminum alloy[J]. Materials and Design, 2012, 42: 395-402. （SCI收录）
Hu Yu-hua, Xue Song-bai, Ye Huan, Xiao Zheng-xiang, Gao Li-li, Zeng Guang. Reliability studies of Sn-9Zn/Cu and Sn-9Zn-0.06Nd/Cu joints with aging treatment[J].Materials and Design, 2012,34:768-775.（SCI收录）
Ji Feng, Xue Song-bai, Dai Wei. Reliability studies of Cu/Al joints brazed with Zn–Al–Ce filler metals[J]. Materials and Design, 2012, 42:156-163. （SCI收录）
Xue Peng, Xue Song-bai, Shen Yi-fu, Zhu Hong, Gao Li-li. Study on properties of Sn-9Zn-Ga solder bearing Nd[J]. Journal of materials science: materials in electronics, 2012, 23(6): 1272-1278. （SCI收录）
Ye Huan, Xue Song-bai, Pecht Michael. Evaluation of the microstructure and whisker growth in Sn–Zn–Ga solder with Pr content[J]. Journal of Materials Research, 2012, 27(14): 1887-1894. （SCI收录）
Zhang Liang, Xue Song-bai, Zeng Guang, Gao Li-li, Ye Huan. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging[J]. Journal of Alloys and Compounds, 2012, 510(1): 38-45. （SCI收录）
Xue Peng, Xue Song-bai, Shen Yi-fu, Zhu Hong, Gao Li-li. Study on properties of Sn-9Zn-Ga solder bearing Nd[J]. Journal of materials science: materials in electronics, 2012, 23(6): 1272-1278. （SCI收录）
Ye Huan, Xue Song-bai, Pecht Michael. Evaluation of the microstructure and whisker growth in Sn–Zn–Ga solder with Pr content[J]. Journal of Materials Research, 2012, 27(14): 1887-1894. （SCI收录）
Zhang Liang, Xue Song-bai, Zeng Guang, Gao Li-li, Ye Huan. Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging[J]. Journal of Alloys and Compounds, 2012, 510(1): 38-45. （SCI收录）
Zeng Guang, Xue Song-bai, Gao Li-li, Zhang Liang, Hu Yu-hua, Lai Zhong-min. Interfacial microstructure and properties of Sn-0.7Cu-0.05Ni/Cu solder joint with rare earth Nd addition[J]. Journal of Alloys and Compounds, 2011, 509(25): 7152-7161. （SCI收录）
Ye Huan, Xue Song-bai, Zhang Liang, Xiao Zheng-xiang, Hu Yu-hua, Lai Zhong-min. Sn whisker growth in Sn-9Zn-0.5Ga-0.7Pr lead-free solder[J]. Journal of Alloys and Compounds, 2011, 509(5): 52-55. （SCI收录）
Zhang Liang, Xue Song-bai, Gao Li-li, Sheng Zhong, Yu Sheng-lin, Chen Yan, Dai Wei, Ji Feng,Guang Zeng. Reliability study of Sn-Ag-Cu-Ce soldered joints in quad flat packages [J]. Microelectronics Reliability, 2010, 50(12): 2071-2077. (SCI收录)
Gao Li-li, Xue Song-bai, Zhang Liang, Sheng Zhong, Ji Feng, Dai Wei, Yu Sheng-lin,Zeng Guang. Effect of alloying elements on properties and microstructures of SnAgCu solders[J]. Microelectronic Engineering, 2010, 87(11): 2025-2034. (SCI收录)
Chen Wen-xue, Xue Song-bai, Wang Hui. Wetting properties and interfacial microstructures of Sn-Zn-xGa solders on Cu substrate[J]. Materials & Design, 2010, 31(4): 2196-2200. (SCI收录)
Han Zong-jie, Xue Song-bai, Wang Jian-xin, ZhangXin, Yu Sheng-lin, Zhang Liang.Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders[J]. Journal of electronic packaging, 2009, 131(2): 021004.1-021004.5. (SCI收录)
Wang Jian-Xin, Xue Song-Bai, Han Zong-Jie, Yu Sheng-Lin, Chen Yan, Shi Yi-Ping,Wang Hui..Effects of rare earth Ce on microstructures, solderability of Sn-Ag-Cu and Sn-Cu-Ni solders as well as mechanical properties of soldered joints[J]. Journal of alloys and compounds, 2009, 467(1-2):219-226. (SCI收录)
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