Fang, Hui - Dartmouth College - Thayer School of Engineering

个人简介

Hui Fang received his B.S. degree in 2009 from Tsinghua University and his Ph.D. degree in 2014 from the University of California, Berkeley, both in Materials Science and Engineering. He was then a postdoctoral fellow at the University of Illinois, Urbana-Champaign from 2014 to 2016. After starting his independent career in August 2016, he joined Dartmouth College in July 2021 as an Associate Professor in the Thayer School of Engineering. Fang’s research interests encompass the fields of neuroelectronics, electronic materials, and electroactive organisms. His research has been recognized by multiple awards, including an NSF CAREER Award (2019).

研究领域

Neuroelectronics In this theme, we aim to develop multifunctional, scalable neuroelectronics and build next-generation tools and biomedical devices for various applications, such as brain activity mapping, diagnosis and treatment of neurological disorders, and neuroprosthetics. A recent example is developing functional nanomesh based transparent and soft neural interfaces. We have demonstrated that by stacking individual layers of metal, and low-impedance coating reliably in a same nanomeshed pattern, the final bilayer nanomesh achieved system-level performance from both individual layers, in addition to nanomesh advantages. Electronic Materials and Organisms Our interest in this thrust ranges from studying novel semiconductors to electroactive organisms. Over the past several years, we have been pioneering the materials processing and fundamental studies of semiconducting atomic layers, ranging from ultrathin III-V compounds, to 2-dimensional transition metal chalcogenides, to ultrathin Si. We are also interested in studying electroactive organisms from both fundamental and applied perspectives.

近期论文

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J. Ryu, Y. Qiang, L. Chen, G. Li, X. Han, E. Woon, T. Bai, Y. Qi, S. Zhang, J. Liou, K. J. Seo, B. Feng, and H. Fang, “Multifunctional Nanomesh Enables Cellular-Resolution, Elastic Neuroelectronics,” Advanced Materials, 2403141, 2024. G. Li, D. Jang, Y. Shin, Y. Qiang, Y. Qi, S. Wang, and H. Fang, “Cracking modes and force dynamics in the insertion of neural probes into hydrogel brain phantom,” Journal of Neural Engineering, 21, 046009, 2024. Y. Shin, J. Ryu, T. Bai, Y. Qiang, Y. Qi, G. Li, Y. Huang, K. J. Seo, H. Fang, “Array-wide uniform PEDOT:PSS electroplating from potentiostatic deposition,” Biosensors and Bioelectronics, 261, 116418, 2024. K. J. Seo, M. Hill, J. Ryu, C.-H. Chiang, I. Rachinskiy, Y. Qiang, M. Trumpis, C. Wang, J. Viventi and H. Fang, “A soft, high-density neuroelectronic array,” npj Flexible Electronics, 7:40, 2023. Y. Qi, S.-K. Kang and H. Fang, “Advanced materials for implantable neuroelectronics,” MRS Bulletin, 48, 475–483, 2023. J. Ryu, Y. Qiang, D. Jang, J. Suh and H. Fang, “Bilayer-Nanomesh Transparent Neuroelectrodes on 10μm-Thick PDMS,” IEEE IEDM, 2022. G. Shull, T. Jochum, K. J. Seo, Y. Shin, J. Morizio, H. Fang and J. Viventi, “Design and Simulation of a Low Power 384-channel Actively Multiplexed Neural Interface,” IEEE BioCAS, 477-481, 2022. N. Bhattacharjee, K. Mahalingam, A. Fedorko, A. Will-Cole, J. Ryu, M. Page, M. McConney, H. Fang, D. Heiman and N. Sun, “Effects of Crystalline Disorder on Interfacial and Magnetic Properties of Sputtered Topological Insulator/Ferromagnet Heterostructures,” ACS Applied Electronic Materials, 4, 9, 4288–4297, 2022. H. Fang and X. Yu, “Special Section Guest Editorial: Hybrid Photonic/X Neurointerfaces,” Neurophotonics, 9(3), 032201, 2022. Y. Qiang, W. Gu, Z. Liu, S. Liang, J. Ryu, K. J. Seo, W. Liu and H. Fang, “Crosstalk in Polymer Microelectrode Arrays,” Nano Research, 14, 3240–3247, 2021. Z. Ramezani, K. J. Seo and H. Fang, “Hybrid Electrical and Optical Neural Interfaces,” Journal of Micromechanics and Microengineering, 31, 044002, 2021. S. Vinnikova, H. Fang and S. Wang, “Mechanics of Regular-Shape Nanomeshes for Transparent and Stretchable Devices,” Journal of Applied Mechanics, 87(10): 101010, 2020. C.-H. Chiang, S.M. Won, A.L. Orsborn, K. J. Yu, M. Trumpis, B. Bent, C. Wang, Y. Xue, S. Min, V. Woods, C. Yu, B.H. Kim, S.B. Kim, R. Huq, J. Li, K.J. Seo, F. Vitale, A. Richardson, H. Fang, Y. Huang, K. Shepard, B. Pesaran, J.A. Rogers and J. Viventi, “Development of a Neural Interface for High-Definition, Long-Term Recording in Rodents and Non-Human Primates,” Science Translational Medicine, 12 eaay4682, 2020. Y. Mei, W. Gao, H. Fang, Y. Lin and G. Shen, “Preface to the Special Issue on Flexible Materials and Structures for Bioengineering, Sensing, and Energy Applications,” Journal of Semiconductors, 41(4), 040101, 2020. P.-M. Wang, S. Culaclii, K. J. Seo, Y. Wang, H. Fang, Y.-K. Lo, and W. Liu, “Challenges in the Design of Large-Scale, High-Density, Wireless Stimulation and Recording Interface,” Interfacing Bioelectronics with Clinical Investigation, New York: Springer, Cham, pp 1-28, 2020. Y. Qiang, A. Ren, X. Zhang, P. Patel, X. Han, K. J. Seo, Z. Shi, Y. Wang, and H. Fang, “Design of Atomically-Thin-Body Field-Effect Sensors and Pattern Recognition Neural Networks for Ultra-Sensitive and Intelligent Trace Explosive Detection,” 2D Materials, 6, 044002, 2019. E. Song, C.-H. Chiang, R. Li, X. Jin, J. Zhao, M. Hill, Y. Xia , L. Li, Y. Huang, S. M. Won, K. J. Yu, X. Sheng, H. Fang, M. A. Alam, Y. Huang, J. Viventi, J.-K. Chang, and J. A. Rogers, “Flexible electronic/optoelectronic microsystems with scalable designs for chronic biointegration,” Proceedings of the National Academy of Sciences, 116, 15398-15406, 2019. X. Han†, K. J. Seo†, Y. Qiang, Z. Li, S. Vinnikova, Y. Zhong, X. Zhao, P. Hao, S. Wang, and H. Fang, “Nanomeshed Si Nanomembranes,” npj Flexible Electronics, 3:9, 2019. K. J. Seo†, P. Artoni†, Y. Qiang, Y. Zhong, X. Han, Z. Shi, W. Yao, M. Fagiolini, and H. Fang, “Transparent, Flexible, Penetrating Microelectrode Arrays with Capabilities of Single Unit Electrophysiology,” Advanced Biosystems, 1800276, 2019. G. Rong, E. Kim, Y. Qiang, W. Di, Y. Zhong, X. Zhao, H. Fang, and H. Clark, “Imaging sodium flux during action potentials in neurons with fluorescent nanosensors and transparent microelectrodes,” ACS Sensors, 3, 2499–2505, 2018. E. Song, R. Li, X. Jin, H. Du, Y. Huang, J. Zhang, Y. Xia, H. Fang, Y. K. Lee, K. J. Yu, Y. Mei, M. A. Alam, Y. Huang, and J. A. Rogers. “Ultra-thin Trilayer Assemblies as Long-Lived Barriers Against Water and Ion Penetration in Flexible Bioelectronic Implants,” ACS Nano,12, 10317–10326, 2018. Y. Qiang†, P. Artoni†, K. J. Seo†, S. Culaclii, V. Hogan, X. Zhao, Y. Zhong, X. Han, P.-M. Wang, Y.-K. Lo, Y. Li, H. A. Patel, Y. Huang, A. Sambangi, J. S. V. Chu, W. Liu, M. Fagiolini, and H. Fang, “Transparent Arrays of Bilayer-Nanomesh Microelectrodes for Simultaneous Electrophysiology and 2-Photon Imaging in the Brain,” Science Advances, 4, eaat0626, 2018. K. J. Seo†, X. Han†, Y. Qiang, X. Zhao, Y. Zhong, Z. Shi, and H. Fang, “Wafer-scale, Stretchable Nanomeshes from an Ultrathin-Support-Layer Assisted Transfer,” Applied Physics Letters, 112, 263101, 2018. G. Conti, S. Nemšák, C.-T. Kuo, M. Gehlmann, C. Conlon, A. Keqi, A. Rattanachata, O. Karslıoğlu, J. Mueller, J. Sethian, H. Bluhm, J. E. Rault, J. P. Rueff, H. Fang, A. Javey, and C. S. Fadley, “Characterization of free standing InAs quantum membranes by standing wave hard x-ray photoemission spectroscopy,” APL Materials, 6, 058101, 2018.