近期论文
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会议论文
Y. Qu, C. Yan, X. Yu, Y. Ding, and Y Zhao, “GHz Cycle-to-cycle Variation in Ultra-scaled FinFETs: From The Time-zero To the Aging States,” IEEE International Reliability Physics Symposium (IRPS), pp. 10A.1.1–10A.1.6, 2023.
Y. Ding, X. Yu, C. Yan, Z. Weng, Y. Qu, and Y. Zhao, “Interval Time Dependent Wake-up Effect of HfZrO Ferroelectric Capacitor,” IEEE International Reliability Physics Symposium (IRPS), pp. p6EM.1–p6EM.4, 2023.
X. Yu, C. Yan, Y. Ding, Y. Qu, and Y Zhao, “GHz AC to DC TDDB Modeling With Defect Accumulation Efficiency Model,” IEEE International Reliability Physics Symposium (IRPS), pp. 4C.3.1–4C.3.6, 2023.
Y. Qu, C. Yan, Y. Ding, X. Yu, and Y. Zhao, “Sub-ns Scale Mechanism Understanding on Self-heating and Hot Carrier Degradation in Scaled FinFETs,” IEEE International Conference on Solid-State & Integrated Circuit Technology (ICSICT), pp. 1–2, 2022.
C. Yan, Y. Ding, Y. Qu, L. Zhao, and Y. Zhao, “Universal Hot Carrier Degradation Model under DC and AC Stresses,” IEEE International Reliability Physics Symposium (IRPS), pp. 7A.1.1–7A.1.6, 2022.
Y. Qu, Y. Shen, M. Su, J. Lu, and Y. Zhao, “GHz C-V Characterization Methodology and Its Application for Understanding Polarization Behaviors in High-k Dielectric Films,” IEEE International Reliability Physics Symposium (IRPS), pp. 3A.3.1–3A.3.6, 2022.
Y. Ding, W. Liu, Y. Qu, L. Zhao, and Y. Zhao, “Degradation Behaviors of 22 nm FDSOI CMOS Inverter Under Gigahertz AC Stress,” IEEE International Reliability Physics Symposium (IRPS), pp. p50.1–p50.5, 2022.
J. Li, M. Si, Y. Qu, X. Lyu, P.D. Ye “Multi-Probe Characterization of Ferroelectric/Dielectric Interface by C-V, P-V and Conductance Methods,” IEEE Symposium on VLSI Technology, pp. TF.2.6–2.7, 2022.
Y. Qu, J. Lu, J. Li, Z. Chen, J. Zhang, C. Li, S. Lee, and Y. Zhao, “In-Situ Monitoring of Self-Heating Effect in Aggressively Scaled FinFETs and Its Quantitative Impact on Hot Carrier Degradation Under Dynamic Circuit Operation,” IEEE International Reliability Physics Symposium (IRPS), pp. 5C.1.1–5C.1.5, 2020. (Best Paper Award).
S. Gao, B. Chen, Y. Qu, and Y. Zhao, “MRAM Acceleration Core for Vector Matrix Multiplication and XNOR-Binarized Neural Network Inference,” International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA), pp. 153–154, 2020.
S. Gao, B. Chen, N. Xu, Y. Qu, and Y. Zhao, “Probing Write Error Rate and Random Telegraph Noise of MgO Based Magnetic Tunnel Junction Using a High Throughput Characterization System,” IEEE International Reliability Physics Symposium (IRPS), pp. 1–5, 2019.
Y. Qu, R. Cheng, W. Liu, J. Li, B. Nguyen, O. Faynot, N. Xu, B. Chen, and Y. Zhao, “Effect of Measurement Speed (μs-800 ps) on the Characterization of Reliability Behaviors for FDSOI nMOSFETs,” IEEE International Reliability Physics Symposium (IRPS), pp. 6E.6.1–6E.6.6, 2018.
Y. Zhao, and Y. Qu, “Will Self-heating be Seriously Problematic in Sub-10nm Technology Nodes?” IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S), pp. 1–3, 2018.
Y. Qu, X. Lin, J. Li, R. Cheng, X. Yu, Z. Zheng, J. Lu, B. Chen, and Y. Zhao, “Ultra fast (<1 ns) Electrical Characterization of Self-Heating Effect and Its Impact on Hot Carrier Injection in 14nm FinFETs,” IEEE International Electron Device Meeting (IEDM), pp. 864–867, 2017.
X. Yu, B. Chen, R. Cheng, Y. Qu, J. Han, R. Zhang, and Y. Zhao, “Fast-Trap Characterization in Ge CMOS Using Sub-1ns Ultra-Fast Measurement System,” IEEE International Electron Device Meeting (IEDM), pp. 774–777, 2016.
期刊论文
X. Ding, N. Wei, Y. Qu, Z. Lan, X. Yu, C. Yan, Z. Weng, S. Gao, T. Nishimura, L. Zhao, C.H. Lee, and Y. Zhao, “Fermi Level Pinning Engineering for Achieving High Performance Ge-based Resistive Memory with Ultra-High Self-Rectifying Ratio (>105),” IEEE Transactions on Electron Devices, vol. 69, no. 12, pp. 865–869, 2022.
Y. Ding, C. Yan, Y. Qu*, and Y. Zhao*, “Re-Examination of Hot Carrier Degradation Mechanism in Ultra-scaled nFinFETs,” IEEE Electron Device Letter, vol. 43, no. 11, pp. 1802–1805, 2022.
Z. Weng, Y. Qu, Z. Lan, J. Liu, M. Su, J. Li, Y. Ding, C.H. Lee, L. Zhao, and Y. Zhao, “Wake-Up Free La-Doped HfO2-ZrO2 Ferroelectrics Achieved With an Atomic Layer-Specific Doping Technique,” IEEE Electron Device Letters, vol. 43, no. 10, pp. 1665–1668, 2022.
X. Wang, Y. Qu, F. Yang, L. Zhao, C.H. Lee, and Y. Zhao, “A Highly Compact Nonvolatile Ternary Content Addressable Memory (TCAM) With Ultralow Power, and 200-ps Search Operation,” IEEE Transactions on Electron Devices, vol. 69, no. 8, pp. 4259–4264, 2022.
J. Noh, H. Bae, J. Li, Y. Luo, Y. Qu, T.J. Park, M. Si, X. Chen, A.R. Charnas, W. Chung, X. Peng, S. Ramanathan, S. Yu, and P.D. Ye, “First Experimental Demonstration of Robust HZO/β-Ga2O3 Ferroelectric Field-Effect Transistors as Synaptic Devices for Artificial Intelligence Applications in a High-Temperature Environment,” IEEE Transactions on Electron Devices, vol. 68, no. 5, pp. 2515–2521, 2021.
J. Li, M. Si, Y. Qu, X. Lyu, and P.D. Ye, “Quantitative Characterization of Ferroelectric/Dielectric Interface Traps by Pulse Measurements,” IEEE Transactions on Electron Devices, vol. 68, no. 3, pp. 1214–1220, 2021.
R. Cheng, Y. Sun, Y. Qu, W. Liu, F. Liu, J. Gao, N. Xu, and B. Chen, “Nano-Scaled Transistor Reliability Characterization At Nano-Second Regime,” Science China: Information Sciences, vol. 64, pp. 209401:1–209401:3, 2021.
Y. Qu, J. Li, M. Si, X. Lyu, and P.D. Ye, “Quantitative Characterization of Interface Traps in Ferroelectric/Dielectric Stack Using Conductance Method,” IEEE Transactions on Electron Devices, vol. 67, no. 12, pp. 5315–5321, 2020.
X. Yu, J. Lu, W. Liu, Y. Qu, and Y. Zhao, “Ultra-Fast (ns-scale) Characterization of NBTI Behaviors in Si pFinFETs,” IEEE Journal of the Electron Devices Society, vol. 8, pp. 573–577, 2020.
B. Chen, S. Gao,Y. Qu, N. Xu,and Y. Zhao, “An Euler-Lagrange Equation Oriented Solution for Write Energy Minimization of STT-MRAM,” IEEE Transaction on Electron Devices,vol. 66, no. 8, pp. 3686–3689, 2019.
J. Li, Z. Chen, Y. Qu, and R. Zhang, “Traps Around Ge Schottky Junction Interface: Quantitative Characterization and Impact on the Electrical Properties of Ge MOS Devices,” IEEE Journal of the Electron Devices Society, vol. 8, pp. 350–357, 2019.
Y. Zhao, and Y. Qu, “Impact of Self-Heating Effect on Transistor Characterization and Reliability Issues in Sub-10 nm Technology Nodes,” IEEE Journal of the Electron Devices Society, vol. 7, pp. 829–836, 2019.
X. Yu, R. Cheng, W. Liu, Y. Qu, B. Chen, J. Lu, and Y. Zhao, “A Fast Vth Measurement (FVM) Technique for NBTI Behavior Characterization,” IEEE Electron Device Letter, vol. 39, no. 2, pp. 172–175, 2018.
Z. Zheng, R. Cheng, Y. Qu, X. Yu, W. Liu, Z. Chen, B. Chen, Q. Sun, W. Zhang, and Y. Zhao,“Real-Time Polarization Switch Characterization of HfZrO4 for Negative Capacitance Field-Effect,” IEEE Electron Device Letters, vol. 39, no. 9, pp. 1469–1472, 2018.
X. Yu, R. Cheng, J. Sun, Y. Qu, J. Han, B. Chen, and Y. Zhao, “Quantitative Characterization of Fast-Trap Behaviors in Al2O3/GeOx/Ge pMOSFETs,” IEEE Transactions on Electron Devices, vol. 65, no. 7, pp. 2729–2735, 2018.
Y. Qu, B. Chen, W. Liu, J. Han, and Y. Zhao, “Sub-1 ns Characterization Methodology for Transistor Electrical Parameter Extraction,” Microelectronics Reliability, 85, pp. 93–98, 2018.
R. Cheng, X. Yu, B. Chen, J. Li, Y. Qu, J. Han, R. Zhang, and Y. Zhao, “Investigation of Self-Heating Effect on Ballistic Transport Characterization for Si FinFETs Featuring Ultrafast Pulsed IV Technique,” IEEE Transactions on Electron Devices, vol. 64, no. 3, pp. 909–916, 2017.