个人简介
林盼盼，哈尔滨工业大学材料科学与工程学院先进焊接与连接国家重点实验室准聘副教授。作为负责人承担国家重点研发计划1项、国家自然科学基金面上项目及青年基金各1项、中国博士后科学基金2项、黑龙江省科学基金、先进焊接与连接重点实验室开放课题1项。参与国家重点研发项目2项、国家自然科学基金面上项目2项、黑龙江省杰出青年基金1项。在国内外刊物上发表科研论文36篇，被SCI收录25篇，EI收录11篇。申请国家发明专利14项，已获授权5项。主要研究方向为新型钎料设计及开发、新材料及异种材料连接、全固态锂电池材料开发及界面行为研究。
工作经历
2022/1–至现在，哈尔滨工业大学，材料科学与工程学院，准聘副教授
2018/8–2021/12，哈尔滨工业大学，材料科学与工程学院，讲师
2018/1–至现在，哈尔滨工业大学，航天学院，博士后，合作导师：何鹏
教育经历
2013/03–2018/01，哈尔滨工业大学，材料科学与工程学院，博士，导师：何鹏
2010/09–2012/07，哈尔滨工业大学，航天学院，硕士，导师：曲寿江
2006/09–2010/07，郑州大学，材料科学与工程学院，学士
奖项成果
林盼盼(5/10)，清洁煤粉高效制备成套设备开发及产业化，河南省科学技术进步奖，二等奖，2020（孔金山，丁天然，徐东，侯宪勇，林盼盼，张伟伟，王喜昌，翟言忠，杨聪俐，徐小定）
林盼盼(3/4); 一种工字结构单侧预置钎料双面形成钎缝的真空钎焊方法, 中国专利优秀奖, 2019 (何鹏, 林铁松, 林盼盼, 阎超)
林盼盼(1/7); TiZrNiCu钎焊(Cf-SiCf)/SiBCN与Nb的工艺及机理研究, 第二十二届全国钎焊及特种连接技术交流会(钎焊年会)优秀青年论文奖, 2018 (林盼盼, 杨佳, 林铁松, 何鹏, 龙伟民, 鲍丽, 马佳)
林盼盼(5/10); 钎缝缺欠调控技术及工程应用, 中国机械工业科学技术奖, 二等奖, 2018 (鲍丽, 徐东, 孙华为, 丁天然, 林盼盼, 董显, 黄俊兰, 张冠星, 于奇, 纠永涛)
近期论文
查看导师新发文章
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Qinghua Feng, Panpan Lin*, Tiesong Lin, Peng He, Yan Liu, Weimin Long, Jian Li. Controllable distribution of reinforcements for reducing the strain energy in dissimilar ceramic/metal joints, Journal of the European Ceramic Society, https://doi.org/10.1016/j.jeurceramsoc.2020.09.030
Jia Yang, Xunye Zhang, Guanglu Ma, Panpan Lin*, Yanqiang Xu, Tiesong Lina, Peng He, Weimin Long, Jian Li. Microstructural evolution and mechanical property of a SiCf/SiC composite/Ni-based superalloy joint brazed with an Au-Cu-Ti filler. Journal of the European Ceramic Society. (Pre-proof)
Ce Wang, Pan-Pan Lin#, Yu Gong, Zhan-Guo Liu, Tie-Song Lin, Peng He. Co-doping effects of Ba2+ and Ta5+ on the microstructure and ionic conductivity of garnet-type solid state electrolytes. Journal of Alloys and Compounds 854 (2021) 157143
Jiujie Xu, Panpan Lin#*, Qianqian Chen, Xuan Zhao, Peng He*, Tiesong Lin***, Chonglai Jiang, Yan Liu, Hongzhi Liu, Weimin Long. Evolutionary mechanism of YBO3 whisker and its effect on the properties of YIG ferrite joint brazed by Bi2O3–B2O3–SiO2–ZnO glass. Ceramics International 47 (2021) 973–983
Wanqi Zhao, Panpan Lin*, Tiesong Lin, Peng He, Weimin Long, Ruyu Tian. Low temperature joining of GH3039 for high temperature applications with Au-Si isothermal solidification. Materials Letters 281 (2020) 128668
Wenhang Niu, Qianqian Chen, Panpan Lin？, Jingyi Cuib, Tiesong Lin, Wei Guo, Peng He, Chao Ai, Yanli Zhuang, Lei Chen, Xiaoming Duan. The formation mechanism of pores and unbonding in the Al2O3/Al2O3 joints brazed by 50Bi2O3–35B2O3–15ZnO glass. Ceramics International 46 (2020) 5575–5585
Qianqian Chen, Panpan Lin*, Wenhang Niu, Haoyue Li, Chonglai Jiang, Jiujie Xu, Jian Li, Tiesong Lin, Peng He, Weimin Long, Hongzhi Liu, Yan Liu. Microstructure and properties of YIG/bismuth-based composite glass/YIG joints with growth of in situ MgFe2O4 whiskers, Materials Characterization 169 (2020) 110593.
Qianqian Chen, Chonglai Jiang, Panpan Lin？, Wumo Du, Jincheng Lin, Ce Wang, Jiujie Xu, Tiesong Lin, Peng He. Microstructure evolution and properties of dielectric magnesium titanate ceramic joints fabricated with bismuth glasses, Ceramics International. 46 (2020) 28987–28995.
Wanqi Zhao, Panpan Lin*, Tiesong Lin, Peng He, Yan Liu, Weimin Long, Jian Li. Low temperature joining of NiTi shape memory alloy with Au-Si isothermal solidification, Journal of Manufacturing Processes. 58 (2020) 1034–1038.
Wenhang Niu, Qianqian Chen, Panpan Lin*, Jingyi Cui, Tiesong Lin, Wei Guo,Peng He, Chao Ai, Yanli Zhuang, Lei Chen, Xiaoming Duan. The formation mechanism of pores and unbonding in the Al2O3/Al2O3 joints brazed by 50Bi2O3-35B2O3-15ZnO glass [J]. Ceramics International. 2020, 46: 5575-5585.
Ce Wang, Panpan Lin#, Xin Liu, Gen Li, Tiesong Lin, Peng He, Weimin Long, Hongzhi Liu. Microstructure evolution and cooperative reinforcement mechanisms of Al2O3/Al2O3 joints brazed by low-melting borosilicate glass [J]. Ceramics International. 2020, 46: 186-195.
Chonglai Jiang, Panpan Lin#, Qianqian Chen, Ce Wang, Tiesong Lin, Peng He, Xuan Zhao, Jiujie Xu, Yan Liu, Hongzhi Liu, Weimin Long, Yi Zhen. Microstructure and properties of functional magnesium titanate ceramic joint brazed by bismuth-borate glass [J]. Journal of the European Ceramic Society. 2019, 39: 4901-4910.
Qianqian Chen, Tiesong Lin, Panpan Lin*, Peng He, Dusan P. Sekulica, Xuan Zhao, Chonglai Jiang, Jiujie Xu, Yan Liu. A new design of the YIG/MTC joint brazed by bismuth-based glass. Journal of the European Ceramic Society. 2019, 39:1514-1524.
Panpan Lin, Tiesong Lin, Peng He, Maochang Wang, Jia Yang. Microstructure evolution and mechanical properties of a vacuum-brazed Al2O3/Ti joint with Mo-coating on Al2O3 and Ti surfaces [J]. Ceramics International. 2019, 45: 11195-11203.
Panpan Lin, Tiesong Lin, Peng He, Dusan P. Sekulic. An influence of a glass composition on the structure and properties of Bi2O3-B2O3-SiO2-ZnO glass system with addition of BaO, CaO and Fe2O3 [J]. Journal of Materials Science: Materials in Electronics. 2018, 29(1):232-243.
Panpan Lin, Tiesong Lin, Peng He, Dusan P. Sekulic. Microstructural evolution and growth behavior of Bi5Ti3FeO15 whiskers in the lithium ferrite joints with different Ti substitution [J]. Journal of the European Ceramic Society. 2017, 37: 4715-4725.
Panpan Lin, Tiesong Lin, Peng He, Dusan P. Sekulic. Wetting behavior and bonding characteristics of bismuth-based glass brazes used to join Li-Ti ferrite systems [J]. Ceramics International. 2017, 43: 13530-13540.
Panpan Lin, Tiesong Lin, Peng He, Dusan P. Sekulic, Mengyuan Zhao, Shulei Wang. An influence of a glass braze composition on the properties of Li-Ti ferrite joints [J]. Journal of Electronic Materials. 2017, 46(4): 2003-2010.
Panpan Lin, Tiesong Lin, Peng He, Dusan P. Sekulic, Ziyang Xiu, Jiandong Wang. Microstructural evolution of Li-Ti ferrite/composite braze/Li-Ti ferrite joints reinforced by Bi5(Ti3Fe)O15 whiskers [J]. Journal of the European Ceramic Society. 2016, 36: 4065-4070.
Panpan Lin, Tiesong Lin, Peng He, Wei Guo, Jiandong Wang. Investigation of microstructure and mechanical property of Li–Ti ferrite/Bi2O3–B2O3–SiO2 glass/Li–Ti ferrite joints reinforced by FeBi5Ti3O15 whiskers [J]. Journal of the European Ceramic Society. 2015, 35: 2453-2459.
Jiandong Wang, Liqun Lia, Caiwang Tan，Han Liu, Panpan Lin. Microstructure and room tensile properties of TiC/Ti6Al4V titanium matrix composite manufactured by laser melting deposition [J]. Journal of Materials Processing Technology. 2018, 252:524-536
Jiandong Wang, Liqun Li, Panpan Lin, Jiming Wang. Effect of TiC particle size on the microstructure and tensile properties of TiCp/Ti6Al4V composites fabricated by laser melting deposition [J]. Optics and Laser Technology. 2018, 105:195-206.
Shuye Zhang, Ming Yang, Mingliang Jin, Wencan Huang, Tie-Song Lin, Peng He, Panpan Lin, Kyung-Wook Paik. Mechanism of Solder Joint Cracks in Anisotropic Conductive Films Bonding and Solutions: Delaying hot-bar Lift-up Time and Adding Silica Fillers [J]. Metals. 2018, 8(42):1-16.
Wei Guo, Tiesong Lin, Peng He, Dusan P. Sekulic, Zhan Sun, Panpan Lin, Xiao Shan, Guangjie Feng, Bingzhi Wu, Maochang Wang. Microstructure and characterization of interfacial phases of sapphire/sapphire joint bonded using Bi2O3-B2O3-ZnO glass. Journal of the European Ceramic Society. 2017, 37: 1073-1081.
Jiandong Wang, Liqun Li, Panpan Lin, Han Liu. Microstructure and mechanical properties of functionally graded TiCp/Ti6Al4V composite fabricated by laser melting deposition [J]. Ceramics International. 2017, 43: 16638-18851.
林盼盼, 马典, 李昊岳, 王子鸣, 何鹏, 林铁松, 龙伟民. AlNp/Al复合材料与6061 Al低温连接组织演变机理及力学性能. 材料工程.2020, 48(10):133-140.
林盼盼, 于凯凯, 林铁松, 何鹏, 刘守相, 徐李刚, 龙伟民, 鲍丽, 马佳. 锂霞石复合玻璃钎料连接碳化硅陶瓷接头的应力缓释机理. 硅酸盐学报. 2020, 48(3):408-415.
林盼盼，林铁松，何鹏，王茂昌，杨汉高，吴天准. Al2O3/Ti生物相容连接接头微观组织及力学性能. 焊接学报. 2019, 40(7):016-023.
林盼盼, 于凯凯, 林铁松, 何鹏, 刘守相, 徐李刚, 龙伟民, 鲍丽, 马佳. 硼硅酸盐玻璃钎料连接RB-SiC陶瓷的接头强化机理. 硅酸盐学报. 2019, 47(6):1-8.
林盼盼，杨佳，林铁松，何鹏，步澜斌，龙伟民，鲍 丽，马佳. TiZrNiCu钎焊(Cf-SiCf)/SiBCN与Nb的界面产物及机理研究. 焊接学报. 2019, 40(9):007-013.
林盼盼，林铁松，何鹏，赵梦圆，戴登峰. Bi2O3-B2O3-SiO2玻璃钎料连接Li-Ti铁氧体接头的电磁性能研究[J]. 焊接学报. 2017, 38(9): 9-13.
林盼盼，林铁松，何鹏，赵轩，于凯凯. Bi2O3-ZnO-SiO2-B2O3玻璃钎料连接铁氧体/钛酸镁陶瓷性能研究. 硅酸盐学报, 2017, 45(9): 1329-1334.
石宇皓，石成杰，吴炳英，林盼盼*，林铁松，何鹏. 陶瓷连接技术及其应用[J]. 精密成形工程, 2018, 10(1): 10-22.
何鹏, 林盼盼. 基于材料基因组理念的钎焊材料开发与智能钎焊技术创新系统工程[J]. 材料导报, 2019, 33(1): 156-161.
何鹏，郭伟，林铁松，林盼盼. 绿色无铅低熔点封接玻璃研究进展[J]. 材料工程, 2016, 44(6): 123-130.
赵万祺，林盼盼，何鹏，林铁松，常昕悦. Co-Si 钎料连接SiBCN 陶瓷接头组织及力学性能[J]. 焊接, 2019, 7:1-5.
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