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Mao, XC; Duan, FC; Wang, FY; Hang, CJ*; Chen, HT*; Li, MY. Interfacial microstructure characterization and solderability of the low pressure cold sprayed Cu-Al2O3 coating on Al substrate. SURFACE & COATINGS TECHNOLOGY. 2022, 452: 129093.
Peng, F; Zhu, WB; Fang, Y; Fu, BC; Chen, HT ; Ji, HJ; Ma, X; Hang, CJ*; Li, MY*. Ultralight and Highly Conductive Silver Nanowire Aerogels for High-Performance Electromagnetic Interference Shielding. ACS Applied Materials & Interface. DOI:10.1021/acsami.2c16940.
Peng Cui, Wenbo Zhu, Hongjun Ji, Hongtao Chen, Chunjin Hang,* Mingyu Li,* Analysis and optimization of induction heating processes by focusing the inner magnetism of the coil. Applied Energy 321 (2022) 119316. SCI.
李胜利; 任春雄;杭春进; 田艳红; 王晨曦; 崔宁; 蒋倩. 极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变. 机械工程学报, 2022, 58(2): 291-299. EI.
李胜利; 牛飘; 杭春进; 田艳红; 崔宁; 蒋倩. 极端温度环境Sn基焊点本构方程的研究进展. 机械工程学报, 2022, 58(2): 236-245. EI.
Feng, Jiayun; Tian, Yanhong; Wang, Sumei; Xiao, Ming; Hui, Zhuang; Hang, Chunjin; Duley, Walter W.; Zhou, Y. Norman. Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor. Journal of Materials Science & Technology, 2021, 84: 139-146. SCIE.
Liu, Jiahao; Liu, Hao; Yu, Fuwen; Wang, Xinjie; Wang, Jianqiang; Hang, Chunjin; Chen, Hongtao; Li, Mingyu. Cu@Sn@Ag core-shell particles preform for power device packaging under harsh environments. Journal of Materials Science: Materials in Electronics, 2021, 32(11): 14703-14714. SCIE.
Zhang, He; Wang, Shang; Hang, Chunjin; Tian, Yanhong. Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode.Welding in the World, 2021, 65(6): 1021-1030. SCIE.
Sun, Qin; Sun, Guoji; Liu, Yihan; Li, Yufeng; Chen, Hongtao; Li, Mingyu; Hang, Chunjin; Zhu, Wenbo. Microstructure and properties of a vacuum-tempered glass with low-temperature-sintered silver paste. Journal of Materials Science: Materials in Electronics, 2021, 32(12): 16230-16241. SCIE.
Fang, Hui; Wang, Chenxi; Li, Daoyuan; Zhou, Shicheng; Du, Yu; Zhang, He; Hang, Chunjin; Tian, Yanhong; Suga, Tadatomo. Fabrication of Ag@Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde. Journal of Materials Science & Technology, 2021, 91: 5-16. SCIE.
王尚; 王凯枫; 张贺; 徐佳慧; 杨东升; 杭春进; 田艳红. 射频器件超细引线键合工艺及性能研究. 机械工程学报, 2021, 1-7. EI.
Wang, Shang; Zhang, He; Hang, Chunjin; Feng, Jiayun; Sa, Zicheng; Li, Yue; Zhang, Weiwei; Tian, Yanhong. Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process. Materials Characterization, 2021, 180: 0-111401. SCIE.
Zhang, He; Wang, Shang; Wu, Bingying; Zhang, Weiwei; Hang, Chunjin; Tian, Yanhong. Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer. Micromachines, 2021, 12(1): 0-51. SCIE .
Hang, Chunjin; Liu, Jiahao; Wang, Jianqiang; Fu, Xing; Chen, Hongtao; Li, Mingyu. A low-temperature bonding method for high power device packaging based on In-infiltrated nanoporous Cu. Journal of Materials Science: Materials in Electronics, 2020, 31(17): 14157-14164. SCIE.
Zhang, He; Wang, Shang; Tian, Yanhong; Liu, Yubin; Wen, Jiayue; Huang, Yilong; Hang, Chunjin; Zheng, Zhen; Wang, Chenxi. Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films. Chemical Engineering Journal, 2020, 390: 0-124495. SCIE.
Feng, Jiayun; Xiao, Ming; Hui, Zhuang; Shen, Daozhi; Tian, Yanhong; Hang, Chunjin; Duley, Walter W.; Zhou, Norman Y.. High-Performance Magnesium-Carbon Nanofiber Hygroelectric Generator Based on Interface-Mediation-Enhanced Capacitive Discharging Effect. ACS Applied Materials & Interfaces, 2020, 12(21): 24289-24297. SCIE.
Wang, Chenxi; Fang, Hui; Hang, Chunjin; Sun, Yaru; Peng, Zhibin; Wei, Wei; Wang, Yansong. Fabrication and characterization of silk fibroin coating on APTES pretreated Mg-Zn-Ca alloy. Materials Science and Engineering: C, 2020, 110: 0-110742. SCIE.
Liu, Jiahao; Wang, Kang; Yu, Fuwen; Hang, Chunjin; Fu, Xing; Chen, Hongtao; Li, Mingyu. A paste based on Cu@Sn@Ag particles for die attachment under ambient atmosphere in power device packaging. Journal of Materials Science: Materials in Electronics, 2020, 31(3): 1808-1816. SCIE.
Yang, Fan; Zhu, Wenbo; Wu, Weizhen; Ji, Hongjun; Hang, Chunjin; Li, Mingyu. Microstructural evolution and degradation mechanism of SiC-Cu chip attachment using sintered nano-Ag paste during high-temperature ageing. Journal of Alloys and Compounds, 2020, 846: 0-156442. SCIE.
Zhang, He; Tian, Yanhong; Wang, Shang; Huang, Yilong; Wen, Jiayue; Hang, Chunjin; Zheng, Zhen; Wang, Chenxi. Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device. Chemical Engineering Journal, 2020, 399: 0-125075. SCIE.
Hang, Chunjin; Liu, Jiahao; Wang, Jianqiang; Fu, Xing; Chen, Hongtao; Li, Mingyu. A low-temperature Cu-to-Cu interconnection method by using nanoporous Cu fabricated by dealloying electroplated Cu-Zn. Journal of Materials Science: Materials in Electronics, 2020, 31(21): 18381-18388. SCIE.
Tian, Ruyu; Hang, Chunjin; Tian, Yanhong; Wu, Bingying; Liu, Yubin; Zhao, Jie. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures. Journal of Alloys and Compounds, 2019, 800: 180-190. SCIE.
Yu, Fuwen; Liu, Hao; Hang, Chunjin; Chen, Hongtao; Li, Mingyu. Rapid Formation of Full Intermetallic Bondlines for Die Attachment in High-Temperature Power Devices Based on Micro-sized Sn-Coated Ag Particles. JOM, 2019, 71(9): 3049-3056. SCIE.
Wen, Jiayue; Tian, Yanhong; Hang, Chunjin; Zheng, Zhen; Zhang, He; Mei, Zhipeng; Hu, Xuanyi; Tian, Yanqing. Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles. Nanomaterials, 2019, 9(7): 0-960. SCIE.
Huang, Yilong; Tian, Yanhong; Hang, Chunjin; Liu, Yubin; Wang, Shang; Qi, Miaomiao; Zhang, He; Zhao, Jie. Self-Limited Nanosoldering of Silver Nanowires for High-Performance Flexible Transparent Heaters. ACS Applied Materials & Interfaces, 2019, 11(24): 21850-21858. SCIE.
Su, Yue; Hang, Chunjin; Chen, Hongtao; Xie, Xingchi; Ma, Jie; Li, Mingyu. Interconnection method based on solder-filled nanoporous copper as interlayer for high-temperature applications. Microelectronic Engineering, 2019, 214: 60-67. SCIE.
Tian, Ruyu; Hang, Chunjin; Tian, Yanhong; Xu, Jikai. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes. Journal of Materials Processing Technology, 2019, 268: 1-9. SCIE.
Wang, Chenxi; Fang, Hui; Qi, Xiaoyun; Hang, Chunjin; Sun, Yaru; Peng, Zhibin; Wei, Wei; Wang, Yansong. Silk fibroin film-coated MgZnCa alloy with enhanced in vitro and in vivo performance prepared using surface activation.Acta Biomaterialia, 2019, 91: 99-111. SCIE.
Wang, Shang; Tian, Yanhong; Wang, Chenxi; Hang, Chunjin; Huang, Yilong; Liao, Chao. Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters. Composites Science and Technology, 2019, 174: 76-83. SCIE.
Wang, Shang; Tian, Yanhong; Wang, Chenxi; Hang, Chunjin; Zhang, He; Huang, Yuan; Zheng, Zhen. One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors. ACS Omega, 2019, 4(4): 6092-6096. SCIE.
Huang, Yilong; Tian, Yanhong; Hang, Chunjin; Liu, Yubin; Wang, Shang; Qi, Miaomiao; Zhang, He; Peng, Qiqi. TiO2-Coated Core-Shell Ag Nanowire Networks for Robust and Washable Flexible Transparent Electrodes. ACS Applied Nano Materials, 2019, 2(4): 2456-2466. SCIE.
Tian, Ruyu; Hang, Chunjin; Tian, Yanhong; Feng, Jiayun。 Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment。 Journal of Alloys and Compounds, 2019, 777: 463-471. SCIE.
Yang, Fan; Hu, Bo; Peng, Ye; Hang, Chunjin; Chen, Hongtao; Lee, Changwoo; Wei, Jun; Li, Mingyu。 Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications。 Journal of Materials Science: Materials in Electronics, 2019, 30(6): 5526-5535. SCIE.
Hu, Bo; Yang, Fan; Peng, Ye; Hang, Chunjin; Chen, Hongtao; Lee, Changwoo; Yang, Shihua; Li, Mingyu. Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications. Journal of Materials Science: Materials in Electronics, 2019, 30(3): 2413-2418. SCIE.
Yu, Fuwen; Chen, Hongtao; Hang, Chunjin; Li, Mingyu. Fabrication of high-temperature-resistant bondline based on multilayer core-shell hybrid microspheres for power devices. Journal of Materials Science: Materials in Electronics, 2019, 30(4): 3595-3603. SCIE.
Fuwen Yu; Chunjin Hang; Menghui Zhao; Hongtao Chen. An interconnection method based on Sn-coated Ni core-shell powder preforms for high-temperature applications. Journal of Alloys and Compounds, 2019, 776: 791-797. SCIE.
Wang Shang; Tian Yanhong; Hang Chunjin; Wang Chenxi. Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining. Scientific Reports, 2018, 8: 0-5260. SCIE.
Hang Chunjin; He Junjian; Zhang Zhihao; Chen Hongtao; Li Mingyu. Low Temperature Bonding by Infiltrating Sn3.5Ag Solder into Porous Ag Sheet for High Temperature Die Attachment in Power Device Packaging. Scientific Reports, 2018, 8: 0-17422. SCIE.
Hang Chunjin; Zhang He; Tian Yanhong; Wang Chenxi; Huang Yuan; Zheng Zhen; Wang Chunqing. A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package. APPLIED SCIENCES-BASEL, 2018, 8(11): 0-2188. SCIE.
Hang Chunjin; Tian Ruyu; Zhao Liyou; Tian Yanhong. Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock. APPLIED SCIENCES-BASEL, 2018, 8(11): 0-2056. SCIE.
Ruyu Tian; Chunjin Hang; Yanhong Tian; Jiayun Feng. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment. Journal of Alloys and Compounds, 2018, 777: 463-471. SCIE.
Feng Jiayun; Hang Chunjin; Tian Yanhong; Liu Baolei; Wang Chenxi. Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current. Scientific Reports, 2018, 8: 0-1775. SCIE.
Xie Xingchi; Hang Chunjin; Wang Jianqiang; Su Yue; Ma Jie; Guo Qiang; Chen Hongtao; Li Mingyu. A low temperature die attach technique for high temperature applications based on indium infiltrating micro-porous Ag sheet. Journal of Materials Science: Materials in Electronics, 2018, 29(21): 18302-18310. SCIE.
Wang Shang; Tian Yanhong; Wang Chenxi; Hang Chunjin. Communication—Ag NW networks enhanced by ni electroplating for flexible transparent electrodes. Journal of the Electrochemical Society, 2018, 165(9): D328-D330. SCIE.
Feng Jiayun; Hang Chunjin; Tian Yanhong; Wang Chenxi; Liu Baolei. Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints. Journal of Alloys and Compounds, 2018, 753: 203-211. SCIE.
Tian Ruyu; Hang Chunjin; Tian Yanhong; Zhao Liyou. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2018, 709: 125-133. SCIE.
Ding Ying; Tian Ruyu; Wang Xiuli; Hang Chunjin; Yu Fang; Zhou Ling; Meng Xiangang; Tian Yanhong Coupling effects of mechanical vibrations and thermal cycling on reliability of CCGAsolder joints. Microelectronics Reliability, 2015, 55(11): 2396-2402. SCI.
Zeng Chao; Wang Chunqing; Tian Yanhong; Hang Chunjin; Liu Wei; An Rong. Characterization of the hot-cutting defect generated from shape machining of alumina green tape in the ceramic-package manufacturing process. Journal of Microelectronics and Electronic Packaging, 2015, 12(1): 55-60. SCIE.
Zeng, Chao; Wang, Chunqing; Tian, Yanhong; Hang, Chunjin; Liu, Wei; An, Rong. Fracture statistics dominated by hot-cutting defect and deviation from weibull distribution. Journal of Harbin Institute of Technology, 2015, 22(2): 41-48. EI.
Chen, Hongtao; Hang, Chunjin; Fu, Xing; Li, Mingyu. Microstructure and Grain Orientation Evolution in Sn-3.0Ag-0.5Cu Solder Interconnects Under Electrical Current Stressing. Journal of Electronic Materials, 2015, 44(10): 3880-3887. SCIE.
Li, Yujie; Tang, Xiaofu; Zhang, Yanteng; Li, Jin; Lv, Chengbin; Meng, Xinling; Huang, Yilong; Hang, Chunjin; Wang, Chunqing. Cu nanoparticles of low polydispersity synthesized by a double-template method and their stability. Colloid and Polymer Science, 2014, 292(3): 715-722. SCIE.
Tian, Yanhong; He, Xiaobin; Hang, Chunjin; Tian, Y.. Influence of the hybrid BGA residual stress after reflow on the thermal cycling reliability. Jixie Gongcheng Xuebao/Journal of Mechanical Engineering, 2014, 50(2): 86-91. EI.
Tian, Yanhong; Hang, Chunjin; Zhao, Xin; Liu, Baolei; Wang, Ning; Wang, Chunqing. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding. Journal of Materials Science: Materials in Electronics, 2014, 25(9): 4170-4178. SCIE.
丁颖; 董芸松; 周岭; 杭春进; 飞景明. QFN焊点可靠性与服役寿命研究. 航天制造技术, 2014, (05): 49-55.
Tian Yanhong; Zhang Rui; Hang Chunjin; Niu Lina; Wang Chunqing. Relationship between morphologies and orientations of Cu6Sn5grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Materials Characterization, 2014, 88: 58-68. SCIE.
丁颖; 董芸松; 周岭; 杭春进; 飞景明. 表贴元件与双列直插器件温循过程中焊点可靠性研究. 电子工艺技术, 2014, (06): 330-333.
田艳红; 贺晓斌; 杭春进. 残余应力对混合组装BGA热循环可靠性影响. 机械工程学报, 2014, (02): 86-91. EI.
Li, Bin; Wang, Chunqing; Zhang, Wei; Hang, Chunjin; Fei, Jingming; Wang, Hong. Fabrication of multiferroic Ba0.7Sr0.3TiO3-Ni0.8Zn0.2Fe2O4composite nanofibers by electrospinning. Materials Letters, 2013, 91: 55-58. SCIE.
Zhang, Rui; Tian, Yanhong; Hang, Chunjin; Liu, Baolei; Wang, Chunqing. Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. Materials Letters, 2013, 110: 137-140. SCIE.
Hang Chunjin; Tian Yanhong; Wang Chunqing; Zhao Jiupeng. High temperature strorage reability of Cu bonds by ultrasonic bonding with fine copper wire. Transactions of the China Welding Institution, 2013, 34(2): 13-16. EI.
Hang, Chunjin; Tian, Yanhong; Zhang, Rui; Yang, Dongsheng. Phase transformation and grain orientation of Cu-Sn intermetallic compounds during low temperature bonding process. Journal of Materials Science: Materials in Electronics, 2013, 24(10): 3905-3913. SCIE.
Hang Chunjin; Tian Yanhong; Zhao Xin; Wang Chunqing. Research on microstructure of Pb-free BGA solder joint assembled with Sn-Pb solder during isothermal aging. Acta Metallurgica Sinica, 2013, 49(7): 831-837. SCIE.
杭春进; 付明亮; 孙少鹏; 王树峰; 王春青. Sb2Te3热电薄膜磁控溅射制备工艺. 电子工艺技术, 2013, (02): 103-107. 其他 .
杭春进; 安荣; 飞景明; 王宏; 孙毅; 王春青. 大功率LED照明模块及高效散热结构优化设计. 焊接, 2013, (02): 41-45.
安荣; 杭春进; 刘威; 张威; 田艳红; 王春青. 电子封装与组装焊点钎料合金力学行为研究进展. 电子工艺技术, 2013, (02): 65-69. 其他 .
杭春进; 田艳红; 赵鑫; 王春青. 混装BGA器件高温老化实验焊点微观组织研究. 金属学报, 2013, (07): 831-837. SCIE.
杭春进; 安荣; 王宏; 飞景明; 王春青; 郑振. 铝制散热器翅片钎焊工艺研究. 焊接, 2013, (01): 22-24.
杭春进; 田艳红; 王春青; 赵九蓬. 细径铜丝超声键合焊点高温存储可靠性分析. 焊接学报, 2013, (02): 13-114. 其他 .
Hang, Chunjin; Tian, Yanhong; Wang, Chunqing; Wang, Ning. Ultrasonic bondability and antioxidation property of Ti/Cu/TaN/Ag multi-layers on Si substrate. Thin Solid Films, 2012, 524: 224-228. SCIE.
Tian, Yanhong; Hang, Chunjin; Wang, Chunqing; Yang, Shihua; Lin, Pengrong. Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Materials Science and Engineering A-Structural Materials Properties Microstructure and Processing, 2011, 529(1): 468-478. SCIE.
Tian, Y. H.; Hang, C. J.; Wang, C. Q.; Ouyang, G. Q.; Yang, D. S.; Zhao, J. P. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound. Microelectronics Reliability, 2011, 51(1): 157-165. SCIE.
安荣; 刘威; 杭春进; 田艳红; 王春青; 安茂忠. 电子封装与组装焊点界面反应及微观组织研究进展. 电子工艺技术, 2011, (06): 321-325.
杨传超; 王春青; 杭春进. 功率LED多芯片模块水冷散热设计. 电子工艺技术, 2010, (05): 253-257.
何鹏; 林铁松; 杭春进. 电子封装技术的研究进展. 焊接, 2010, (01): 25-29 .
Pequegnat, A.; Hang, C. J.; Mayer, M.; Zhou, Y.; Moon, J. T.; Persic, J. Effect of EFO parameters on Cu FAB hardness and work hardening in thermosonic wire bonding. Journal of Materials Science: Materials in Electronics, 2009, 20(11): 1144-1149. SCIE.
Hang, C. J.; Song, W. H.; Lum, I.; Mayer, M.; Zhou, Y.; Wang, C. Q.; Moon, J. T.; Persic, J. Effect of electronic flame off parameters on copper bonding wire: Free-air ball deformability, heat affected zone length, heat affected zone breaking force. Microelectronic Engineering, 2009, 86(10): 2094-2103. SCIE.
Tian, Dewen; Tian, Yanhong; Wang, Chunqing; Hang, Chunjin. Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface. Journal of Materials Science, 2009, 44(7): 1772-1779. SCIE.
Hang, C. J.; Lum, I.; Lee, J.; Mayer, M.; Wang, C. Q.; Zhou, Y.; Hong, S. J.; Lee, S. M. Bonding wire characterization using automatic deformability measurement. Microelectronic Engineering, 2008, 85(8): 1795-1803. SCIE.
Hang, C. J.; Wang, C. Q.; Mayer, M.; Tian, Y. H.; Zhou, Y.; Wang, H. H. Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectronics Reliability, 2008, 48(3): 416-424. SCIE.
Hang, C. J.; Wang, C. Q.; Tian, Y. H.; Mayer, M.; Zhou, Y. Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering, 2008, 85(8): 1815-1819. SCIE.
Tian, D. W.; Tian, Y. H.; Wang, C. Q.; Hang, C. J. Three-dimensional modelling of solder droplet impact onto a groove. Journal of Physics D: Applied Physics, 2008, 41(24): 0-245503. SCIE, EI.
杭春进; 王春青; 田艳红; 张丞. 塑料封装铜丝内连电子元器件开封新工艺研究. 电子工艺技术, 2008, (01): 5-7.
Hang Chunjin; Wang Chunqing; Tian Yanhong. Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds. China Welding, 2007, 16(3): 46-50. EI.
Xu Hui; Wang Chunqing; Hang Chunjin. Growth behavior of intermetallic compound on bonding joint of Cu wire on Al alloy pad during thermal aging. Acta Metallurgica Sinica, 2007, 43(2): 125-130. SCIE, EI.
Hang Chun-Jin; Wang Chun-Qing; Hong Shou-Yu. Research progress in copper wire bonding technology. Materials Science and Technology, 2007, 15(5): 673-678. EI.
徐慧; 王春青; 杭春进. 老化过程中Cu/Al合金键合界面金属间化合物的生长行为. 金属学报, 2007, (02): 125-130. SCIE.
杭春进; 王春青; 洪守玉. 铜丝球焊技术研究进展. 材料科学与工艺, 2007, (05): 673-678. EI.
田艳红; 杭春进; 王春青. Cu丝超声球焊及楔焊焊点可靠性及失效机理研究. 电子工艺技术, 2006, (02): 63-69.
徐慧; 杭春进; 王春青; 田艳红. 金、铜丝球键合焊点的可靠性对比研究. 电子工业专用设备, 2006, (05): 23-27.
会议论文
Wu Bingying; Hang Chunjin; Li Yue; Liu Yang; Tian Yanhong; Zhang Weiwei. Thermo-mechanical Modelling of Cu Wire Parallel Gap Micro-resistance Welding Process. 19th International Conference on Electronic Packaging Technology, ICEPT 2018, 2018-8-8至2018-8-11.
Li Yue; Hang Chunjin; Tian Yanhong; Liu Wei; Wang Chunqing; Guo Xuguang. Interposer connection reliability using double-side solder bump for board-level vertical interconnection. 18th International Conference on Electronic Packaging Technology, ICEPT 2017, 2017-8-16至2017-8-19.
Tian Ruyu; Hang Chunjin; Tian Yanhong; Zhao Liyou. Microstructure evolution and mechanical property of Sn-37Pb and Sn-3.0Ag-0.5Cu BGA solder joints under extreme temperature environment. 18th International Conference on Electronic Packaging Technology, ICEPT 2017, 2017-8-16至2017-8-19.
Huang Yuan; Hang Chunjin; Tian Yanhong; Zhang He; Wang Chenxi; Wang Xiuli. Rapid sintering of copper nanopaste by pulse current for power electronics packaging. 18th International Conference on Electronic Packaging Technology, ICEPT 2017, 2017-8-16至2017-8-19.
Jia Yongheng; Hang Chunjin; Tian Yanhong; Liu Wei; Wang Chunqing; Guo Xuguang; Wang Xiuli. Reliability prediction of different size solder bumps in thermal shock test using FEM. 18th International Conference on Electronic Packaging Technology, ICEPT 2017, 2017-8-16至2017-8-19.
Hang Chunjin; Tian Yanhong; Wang Chunqing; Wang Hong. Research on tensile property and creep resistance of electroplating nickel reinforced by A12O3nanoparticles. 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, 2014-8-12至2014-8-15.
Zeng Keming; Li Yujie; Chang Jin; Hang Chunjin; Wang Chunqing; Zeng Keming; Li Yujie; Chang Jin; Wang Chunqing. Secondary optical design of LED lamps with high CRI and adjustable CCT. 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, 2014-8-12至2014-8-15.
Ding Y.; Wu G. D.; Wang X. L.; Yan G. S.; Hang C. J. Tensile testing and microstructure analysis on Sn-Pb-Cd and Sn-Pb eutectic solder. 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, 2014-8-12至2014-8-15.
Zhang Rui; Tian Yanhong; Liu Baolei; Hang Chunjin. Growth mechanism of Cu-Sn full IMC joints on polycrystalline and single crystal Cu substrate. 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013-8-11至2013-8-14.
Hang Chunjin; Sun Shaopeng; Lin Panpan; Wang Chunqing. Molecular Dynamics study of thermal conductivity in bismuth telluride thin films. 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013-8-11至2013-8-14.
Hang Chunjing; Fei Jingming; Tian Yanhong; Zhang Wei; Wang Chunqing; Zhao Susan; Caers Jo. The effects of humidity and temperature aging test on flexible packaging LED modules. 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013-8-11至2013-8-14.
Hang Chunjin; Wang Hong; Fei Jingming; Wang Chunqing. Development of a new die-attach process and related bonding tool for multi-chip LED module. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, 2012-8-13至2012-8-16.
Zhu Jiandong; Wang Chunqing; Hang Chunjin; Tian Yanhong. Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, 2012-8-13至2012-8-16.
Tian, Yanhong; Liu, Wei; Hang, Chunjin; Wang, Xuelin; Liu, Ruiyang; Wang, Chunqing. Morphologies and grain orientations of Cu-Sn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints. 5th International Brazing and Soldering Conference, IBSC 2012, 2012-4-22至2012-4-25.
Han Leilei; Wang Chunqing; Hang chunin. Theoretical study on power factor of Si/Ge multi-layer thermoelectric micro-cooler. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, 2012-8-13至2012-8-16.
Hang Chunjin; Fei Jingming; Wang Hong; Wang Chunqing. Thermal characterization of high power LED array in aluminum base copper clad laminate package. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, 2012-8-13至2012-8-16.
Zeng, Chao; Wang, Chunqing; Tian, Yanhong; Liu, Wei; An, Rong; Hang, Chunjing. Characterization of the hot-cutting defects produced by the processing of alumina green tape. 2011 12th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2011, 2011-8-8至2011-8-11.
Feng, J.C.; Li, L.Q.; Hang, C.J.; Chen, Y.B.; Qin, H.. Effects of welding positions on droplet transfer in CO2laser-MAG hybrid welding. Materials Science and Technology Conference and Exhibition 2011, MS and T'11, 2011-10-16至2011-10-20.
Tian, Yanhong; Hang, Chunjin; Niu, Lina; Wang, Chunqing. Size effect on deformation and fracture behavior of Sn3.0Ag0.5Cu lead free solder joints. Materials Science and Technology Conference and Exhibition 2011, MS and T'11, 2011-10-16至2011-10-20.
王春青; 杭春进; 张威. 大功率多芯片LED封装的结构及制造关键技术研究. 国家半导体照明工程协调领导小组办公室、广东省科学技术厅、广州市人民政府、中国照明学会（CIES）、中国照明电器协会（CALI）、国际半导体照明工程研发及产业联盟（CSA）, 广东省广州市.
Tian, Yanhong; Hang, Chunjin; Wang, Chunqing; Zhou, Y. Evolution of Cu/Al intermet allic compounds in the copper bump bonds during aging process. 2007 8th International Conference on Electronic Packaging Technology, ICEPT, 2007-8-14至2007-8-17.
Hang C.J.; Lum I.; Lee J.; Mayer M.; Zhou Y.; Wang C.Q.; Hong S.J.; Lee S.M. On-line hardness characterization of novel 2-mil copper bonding wires. ASME Electronic and Photonics Packaging Division, 2007-7-8至2007-7-12.
Shouyu Hong; Chunjing Hang; Chunqing Wang。 Experimental research of copper wire ball bonding. 2005 6th International Conference on Electronics Packaging Technology, 2005-8-30至2005-9-2.
Hang Chunjin; Wang Chunqing; Shi Mingda; Wu Xiaochun; Wang Honghui. Study of copper free air ball in thermosonic copper ball bonding. 2005 6th International Conference on Electronics Packaging Technology, 2005-8-30至2005-9-2.
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