个人简介
李政玮，男，山东青岛人，博士，助理研究员。主要研究方向为超声波辅助钎焊、超声波焊接、新材料及异种材料的焊接、液态金属的声空化理论及效应等，在Ultrasonics Sonochemistry、Welding Journal、International Journal of Mechanical Sciences、Journal of Materials Processing Technology、Materials Science and Engineering: A、Journal of Alloys and Compounds、Materials & Design、Ceramics International等期刊发表学术论文60余篇，他引1300余次。获得美国焊接学会2021年Robert L. Peaslee Brazing Award；获批10余项国家发明专利。
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Zhengwei Li, Zhiwu Xu*, Zhongwei Ma, Shu Chen, He Zhang, Boxu Ren, Jiuchun Yan. Fabricating porous Si3N4 ceramics joint by ultrasonic brazing at 450°C. Materials Characterization. 196 (2023) 111987.
Zhengwei Li, Zhiwu Xu*, Liming Peng, Jiuchun Yan. Ultrafast ultrasonic-assisted transient liquid bonding Al/Mg in air. Materials Characterization. 190 (2022) 111987.
Zhengwei Li, Zhiwu Xu*, Peng He, Zhongwei Ma, Shu Chen, Jiuchun Yan. High speed imaging of cavitation bubbles during the spreading of GaIn melt under ultrasonication. International Journal of Mechanical Sciences. 221 (2022) 107221.
Zhengwei Li, Zhiwu Xu*, Peng He, Shu Chen, Zhongwei Ma, Boxu Ren, Jiuchun Yan. Microstructure and enhanced joint performance of porous Si3N4 ceramics in ultrasonic soldering. Materials Science and Engineering: A. 840 (2022) 142984
Zhengwei Li, Zhiwu Xu*, Peng He*, Zhongwei Ma, Shu Chen, Jiuchun Yan. Dependence of wetting on the cavitation during the spreading of a filler droplet on the ultrasonically agitated Al substrate. Ultrasonics Sonochemistry. 82 (2022) 105893.
Zhengwei Li, Zhiwu Xu*, Boxu Ren, Jiuchun Yan. Fast ultrasonically soldering porous Si3N4 ceramics using Sn9Zn2Al solder in the air. Ceramics International. 48(4) (2022) 5663-5673.
Zhiwu Xu*, Zhengwei Li*, Zirong Xu, Zhongwei Ma, Shu Chen, Xuesong Liu, Jiuchun Yan. Avoiding degradation and increasing joint strength of 7075 Al alloys by rapid ultrasonic soldering at 200 °C. Journal of Materials Processing Technology. 300 (2022) 117397.
Zhengwei Li, Zhiwu Xu*, Zhongwei Ma, Zirong Xu, Xuesong Liu, Jiuchun Yan. Dependence of the microstructure and properties of joints on acoustic intensity during the ultrasonic soldering of 7075 Al alloys. Journal of Manufacturing Processes. 64 (2021) 518-529.
Zhengwei Li, Zhiwu Xu*, Degang Zhao, Shu Chen, Jiuchun Yan. Ultrasonic cavitation at liquid/solid interface in a thin Ga–In liquid layer with free surface. Ultrasonics Sonochemistry. 71(2021) 105356.
Zhiwu Xu*, Zhengwei Li*, Lin Ma, Junlan Bo, Jiuchun Yan. Ultrasonic-driven spreading of liquid solder on non-wetting substrates. Welding Journal. 2020, 99: 163-174.
Zhiwu Xu*, Zhengwei Li*, Ben Chai, Jiuchun Yan. Formation of TiAl3 and its reinforcing effect in TA15 alloy joint ultrasonically brazed with pure Al. Journal of Alloys and Compounds. 2020, 815, 152493.
Zhengwei Li, Zhiwu Xu*, Degang Zhao, Xuesong Liu, Jiuchun Yan. Grain refinement caused by intensified cavitation within narrow channel and its improvement to ultrasonically soldered Al joint property. Ultrasonics Sonochemistry. 2020, 60: 104786.
Zhengwei Li, Zhiwu Xu*, Lin Ma, Sheng Wang, Xuesong Liu, Jiuchun Yan. Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part II: Cavitation erosion effect. Ultrasonics Sonochemistry. 2019, 50: 278-288.
Zhiwu Xu*, Zhengwei Li*, Liming Peng, Jiuchun Yan. Ultra-rapid transient liquid phase bonding of Mg alloys within 1 second in air by ultrasonic assistance. Materials & Design.2019, 161: 72-79.
Zhiwu Xu*, Zhengwei Li*, Degang Zhao, Xuesong Liu, Jiuchun Yan. Effects of Zn on intermetallic compounds and strength of Al/Mg joints ultrasonically soldered in air. Journal of Materials Processing Technology. 2019, 271: 384-393.
Zhiwu Xu*, Zhengwei Li*, Yushi Qi, Jiuchun Yan. Soldering porous ceramics through ultrasonic-induced capillary action and cavitation. Ceramics International. 2019, 45(7): 9293-9296.
Zhiwu Xu*, Zhengwei Li*, Lin Ma, Ziwei Cao, Jianguo Yang, Jiuchun Yan. Dynamic behavior of solder filling during ultrasonic soldering. Welding Journal. 2019, 98: 194-203.
Zhiwu Xu*, Zhengwei Li*, Lei Xu, Jiuchun Yan. Reduction of intermetallic compounds in ultrasonic-assisted semi-solid brazing of Al/Mg alloys. Science and Technology of Welding and Joining. 2019, 24(2):163-170.
Zhengwei Li, Zhiwu Xu*, Lin Ma, Sheng Wang, Xuesong Liu, Jiuchun Yan. Cavitation at filler metal/substrate interface during ultrasonic-assisted soldering. Part I: Cavitation characteristics.Ultrasonics Sonochemistry. 2018, 49: 249-259.
Zhiwu Xu*, Zhengwei Li*, Shijiang Zhong, Zhipeng Ma, Jiuchun Yan. Wetting mechanism of Sn to Zr50.7Cu28Ni9Al12.3 bulk metallic glass assisted by ultrasonic treatment. Ultrasonics Sonochemistry. 2018, 48: 207-217.
Zhiwu Xu*, Zhengwei Li*, Jiaqi Li, Zhipeng Ma, Jiuchun Yan. Control Al/Mg intermetallic compound formation during ultrasonic-assisted soldering Mg to Al. Ultrasonics Sonochemistry. 2018, 46: 79-88.
Zhengwei Li, Zhiwu Xu*, Dawei Zhu, Zhipeng Ma,Jiuchun Yan. Control of Mg2Sn formation through ultrasonic-assisted transient liquid phase bonding of Mg to Al. Journal of Materials Processing Technology. 2018, 255: 524-529.
Zhiwu Xu*, Zhengwei Li*, Bo Peng, Zhipeng Ma, JiuchunYan. Application of a new ultrasonic-assisted semi-solid brazing on dissimilar Al/Mg alloys. Materials Letters. 2018, 228: 72-76.
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