祝温泊 - 哈尔滨工业大学（深圳）

个人简介

祝温泊，哈尔滨工业大学(深圳) 材料科学与工程学院，助理教授，深圳市高层次人才。长期从事微纳连接及电子封装材料与技术研究，协助李明雨教授开发新型电子封装材料、特种封装工艺及装备和柔性电子功能结构与器件，旨在推动电子封装及柔性电子制造技术的发展和应用。已以第一/通讯作者发表SCI论文10余篇，包括ACS AMI, Journal of Materials Chemistry A, Applied Energy, NPJ Flexible Electronics, Materials & Design等国际高水平期刊文章，授权发明专利10余项。主持多项国家及省市级科研项目，包括国家自然科学基金青年基金、广东省青年基金、深圳市基础研究面上、深圳市基础研究自由探索、深圳市技术攻关等，并主持、参与航天5院、8院及与华为横向合作课题近10项。教育及工作经历教育经历 2012.10 - 2016.12, 英国拉夫堡大学, 博士（机械、电子与制造工程） 2010.09 - 2017.03, 华中科技大学, 博士（材料加工工程） 2006.09 - 2010.06, 华中科技大学, 学士（材料成型及控制工程）研究与工作经历 2022.05 - 至今，哈尔滨工业大学(深圳)，助理教授 2020.05 - 2022.05, 哈尔滨工业大学（深圳）, 助理研究员 2017.07 - 2020.01, 哈尔滨工业大学（深圳）, 博士后已获奖项 2022年03月，获广东省技术进步二等奖 2021年11月，获广东大学生材料创新大赛优秀指导教师

研究领域

电子封装材料与工艺特种封装工艺与装备柔性电子功能结构与器件

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Fei Peng§, Wenbo Zhu§, Yi Fang, Bicheng Fu, Hongtao Chen, Hongjun Ji, Xing Ma, Chunjin Hang, Mingyu Li, Ultralight and Highly Conductive Silver Nanowire Aerogels for High-Performance Electromagnetic Interference Shielding, ACS Appl. Mater. Interfaces, 2023, 15(3): 4284. Wenbo Zhu§, Panpan Wang§, Zhe Chen, Chengyan Xu, Yan Jiao, Mingyu Li, Yan Huang, One-pot self-assembled AgNW aerogel electrode with ultra-high electric conductivity for intrinsically 500% super-stretchable high-performance Zn-Ag battery, Journal of Materials Chemistry A, 2022, 10: 10780. Cui Peng§, Wenbo Zhu§, Hongjun Ju, Hongtao Chen, Chunjin Hang, Mingyu Li, Analysis and optimization of induction heating processes by focusing the inner magnetism of the coil, Applied Energy, 2022, 321: 119316. Shaowei Hu§, Wenbo Zhu§, Wanchun Yang, Mingyu Li, Morphology simulation of drop-on-demand inkjet-printed droplets, NPJ Flexible electronics, 2022, 6, 64. Shaowei Hu§, Wenbo Zhu§, Wanchun Yang, Hongjun Ji, Mingyu Li, Facile method for printing reliable sliver patterns on polymer film, Materials letters, 2022, 314: 131551. Fan Yang§, Wenbo Zhu§, Xiaoting Wang, Mingyu Li, Enhancement of high-temperature stability in sintered Ag joints on bare Cu substrates by inducing the transient liquid phase, Materials letters, 2021, 292:129620. Qing Sun, Guoji Sun, Yihan Liu, Yufeng Li, Hongtao Chen, Mingyu Li, Chunjin Han*, Wenbo Zhu*, Microstructure and properties of a vacuum tempered glass with low-temperature sintered silver paste, Journal of Materials Science: Materials in Electronics, 2021, 32:16230-16241. Fan Yang, Wenbo Zhu§, Weizhe Wu, Hongjun Ji, Chunjin Hang, Mingyu Li, Microstructural evolution and degradation mechanism of SiC–Cu chip attachment using sintered nano-Ag paste during high-temperature ageing, Journal of Alloys and Compounds, 2020, 846, 156442. Wenbo Zhu, Xiaoting Wang, Changqing Liu, Zhaoxia Zhou, Fengshun Wu, Formation and homogenisation of SnCu interconnects by self-propagated exothermic reactive bonding, Materials & Design, 2019, 174, 107781. Wenbo Zhu, Xiaoting Wang, Mingyu Li, Low-temperature bonding of Cu through self-propagating reaction under various temperatures and press, Journal of electronic packaging, 2019, 142, 021006. Xiaoting Wang, Mingyu Li, Wenbo Zhu*, Formation and homogenization of Si interconnects by non-equilibrium self-propagating exothermic reaction, Journal of Alloys and Compounds, 2019, 817. Wenbo Zhu, Fengshun Wu, Baihui Wang, Eric Hou, Paul Wang, Changqing Liu, Weisheng Xia, Microstructural and mechanical integrity of Cu/Cu interconnects formed by self-propagating exothermic reaction methods, Microelectronic Engineering, 2014, vol. 128, 24-30.