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个人简介

钟颖,哈尔滨工业大学(深圳)材料科学与工程学院教授、博导,国家级青年人才。2017年博士毕业于美国加州大学圣地亚哥分校(UCSD)。2017年至2019年于UCSD任博士后研究员,2019年至2022年在美国南佛罗里达大学任Tenure-track助理教授,2022年起任哈尔滨工业大学(深圳)教授。主持多项中国及美国国家自然科学基金委项目;其中包括美国助理教授最具竞争力的奖项之一NSF CAREER Award,中国国家自然科学基金面上项目等。 在Acta Materialia、Environmental Science & Technology (封面文章)、Small等国际著名期刊发表论文35篇,受邀撰写Rowman & Littlefield出版社专著《Sustainable Engineering for Life Tomorrow》第2章。受邀担任30余个国际SCI期刊的审稿人。现任Frontiers in Chemistry杂志副编辑、Metallurgical and Materials Transactions: A 杂志Key Reader 、JOM杂志客座编辑。作为Symposium Organizer及Session Chair组织美国矿物、金属与材料学会TMS、国际材料应用与技术大会IMAT、IEEE电子器件技术与制造会议EDTM等知名国际会议多次; 做国际会议学术口头报告30次,其中Keynote报告1次,特邀报告15次,受邀为美国国会议员做特邀报告2次,获国际学术会议奖5项,获2022年USF Excellence in Innovation Award 。研究成果被国内外媒体如Science Magazine、ScienceDaily、美国科学促进会(AAAS)EurekAlert!、世界科技研究新闻资讯网Phys.org、西班牙最大媒体EFE News等关注和报道,被JMCC评为2023年Emerging Investigator。 工作经历 2022.11-至今,哈尔滨工业大学(深圳),材料科学与工程学院,教授 (2022.11-Now, Harbin Institute of Technology (Shenzhen), Materials Science and Engineering, Professor) 2019.08-2022.11,美国南佛罗里达大学,机械工程系,Tenure-track助理教授 (2019.08-2022.11, University of South Florida, Mechanical Engineering, Tenure-track Assistant Professor) 2017.11-2019.07,美国加州大学圣地亚哥分校,结构工程系,博士后研究员 (2017.11-2019.07, University of California at San Diego, Structural Engineering, Postdoctoral Researcher) 教育经历 2017.06 美国加州大学圣地亚哥分校,材料科学与工程,博士 2012.07 哈尔滨工业大学,材料科学与工程,硕士 2010.07 哈尔滨工业大学,电子封装技术,学士 科研项目 2024.01-2027.12 中国国家自然科学基金面上项目,主持 2023.01-2025.12 深圳市新引进高精尖缺人才科研启动项目,主持 2022.03-2027.02 美国自然科学基金委, NSF CAREER Award, 61.0万美元, 主持 2021.09-2024.08 美国自然科学基金委, 先进制造部项目,30.8万美元, 主持 2019.08-2023.07 美国南佛洛里达大学启动资金, 58.7万美元, 主持 2021.05-2022.04 美国南佛洛里达大学, USF Interdisciplinary Research Grants, 2万美元, 主持 2020.05-2021.06 美国自然科学基金委, RAPID项目, 16.8万美元, 主持 2020.04-2020.09 美国南佛洛里达大学USF Pandemic Research Response Grant, 2.5万美元, 主持

研究领域

课题组长期致力于微纳电子封装及制造领域材料界面及材料与外场相互作用机制的研究,具体包括: 三维微纳器件封装技术 (3D Packaging of Micro/Nano-Electronics) 柔性电子超快速非接触静电打印技术 (Ultra-fast Contact-less Electrostatic Printing for Flexible Electronics) 高功率半导体互连及封装技术 (Interconnection and Packaging Technology for High-Power Semiconductors) 材料界面及材料与外场相互作用机制研究 (The Interaction Mechanism of Materials Interfaces/Materials with External Field) 科研内容兼顾对材料界面以及材料与外场相互作用机制的科学探索,以及微纳器件封装及制备的实际应用,具有较强的国际前沿性与多学科交叉性。

近期论文

查看导师新发文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

Sriram S. K. S. Narayanan, Zijian Weng, Andrew Tenjo, Marcelo Farfan, Parinitha Giridharan, Xudong Wang, Valerie Zapata, Xing Ma, Libin Ye, Ehsan Sheybani, Ying Zhong*. Automated corona discharge (CD) for efficient and broad-spectrum surface and air sterilization. Journal of Materials Chemistry C, 2023, 11, 11834-11841. (Front Cover, Emerging Investigator.) S Narayanan, X Wang, J Paul, V Paley, Z Weng, L Ye, Y Zhong*. Disinfection and electrostatic recovery of N95 respirators by corona discharge for safe reuse. Environmental Science & Technology, 2021, 55(22): 15351-15360. (Supplementary Cover) L Wang, R Kou, Z Shang, Z Weng, C Zhu, Y Zhong*. Corona-enabled electrostatic printing (CEP) for ultra-fast manufacturing of binder-free multifunctional e-skins. ACS Applied Materials & Interfaces, 2021, 13(38): 45966-45976. (Supplementary Cover) Y Zhong*, R Kou, R Chen, Y Qiao*. Window+: electrostatic levitation enabled polymer-air multilayer (EPAM) structures for highly transparent energy efficient windows. Energy Conversion and Management, 2021, 248: 114803. R Kou#, Y Zhong#, Q Wang, J Kim, R Chen, Y Qiao*. Improved window energy efficiency with thermal insulating polymer-air multilayer. Applied Thermal Engineering, 2021, 191(5): 116890. R Kou, Y Zhong*, Q Wang, J Kim, J Zeng, R Chen, Y Qiao*. Hollow-structured bilayer system for windowpane insulation. Journal of Energy Engineering, 2021, 147(4): 06021001. Y Zhong*, C Wang*, J Wang, H Ma, S Krishnamoorthy, V Paley, Z Weng, S Jin. Spontaneous formation of sub-4 nm nanocrystalline alloy via polymorphic phase transformation. Materials Research Letters, 2020, 8 (11): 431-437. R Kou#, Y Zhong#, Y Qiao*. Flow electrification of a corona-charged polyethylene terephthalate film. Langmuir, 2020, 36(32): 9571–9577. G Kim, C Gardner, K Park, Y Zhong, R Chen, S Jin*. Human-skin-inspired adaptive smart textiles capable of amplified latent heat transfer for thermal comfort. Advanced Intelligent Systems, 2020: 2000163. Y Zhong, R An, H Ma, C Wang*. Low-temperature-solderable intermetallic nanoparticles for 3D printable flexible electronics. Acta Materialia, 2019, 162: 163-175. Y Zhong*, R Kou, M Wang, Y Qiao. Synthesis of centimeter-scale monolithic SiC nanofoams and pore size effect on mechanical properties. Journal of the European Ceramic Society, 2019, 39 (7): 2566-2573. R Kou, Y Zhong*, Y Qiao*. Effects of anion size on flow electrification of polycarbonate and polyethylene terephthalate. Applied Physics Letters, 2019, 115, 073704. Y Zhong#, R Kou#, M Wang, Y Qiao*. Electrification mechanism of corona charged organic electrets. Journal of Physics D: Applied Physics, 2019, 52: 44. R Kou#, Y Zhong#, J Kim, M Wang, Q Wang, R Chen, Y Qiao*. Elevating low-emissivity films for lower U-value. Energy and Buildings, 2019, 193: 69-77. H Su, T Chen, R Kou, M Wang, Y Zhong, Y Qiao, Y Hong*. Fatigue behavior of inorganic-organic hybrid “Lunar Cement”. Scientific Reports, 2019, 9: 2238. T Chen, B Chow, Y Zhong, M Wang, R Kou, Y Qiao*. Formation of polymer micro-agglomerations in ultralow-binder-content composite based on lunar soil simulant. Advances in Space Research, 2018, 61(3): 830-836. M Wang, L Zhu, A Le, D Noelle, Y Shi, Y Zhong, F Hao, X Chen, Y Qiao*. A multifunctional battery module design for electric vehicle. Journal of Modern Transportation, 2017, 25 (4): 218-222. Y Zhong, F Zhang, M Wang, G Calvin, G Kim, Y Liu, J Leng*, S Jin, R Chen*. Reversible humidity sensitive clothing for personalized thermoregulation. Scientific Reports, 2017, 7: 44208. B Chow, T Chen, Y Zhong, Y Qiao*. Direct formation of structural components using a Martian soil simulant. Scientific Reports, 2017, 7: 1151. C Zhao, Y Zhong, Y Qiao*. Effects of porosity on dynamic indentation resistance of silica nanofoam. Scientific Reports, 2017, 7: 1060. B Chow, T Chen, Y Zhong, M Wang, Y Qiao*. Compaction of montmorillonite in ultra-dry state. Advances in Space Research, 2017, 60 (7): 1443-1452. T Chen, B Chow, M Wang, Y Zhong, Y Qiao*. High-pressure densification of composite Lunar cement. Journal of Materials in Civil Engineering, 2017, 29 (10): 06017013. Y Zhong, W Liu, C Wang*, X Zhao, J Caers. The influence of strengthening and recrystallization to the cracking behavior of Ni, Sb, Bi alloyed SnAgCu solder during thermal cycling. Materials Science and Engineering: A, 2016, 652: 264-270. Y Zhong, R An, C Wang*, Z Zheng, Z Liu, C Liu, C Li, T Kim, S Jin. Low temperature sintering Cu6Sn5 nanoparticles for superplastic and super-uniform high temperature circuit interconnections. Small, 2015, 11(33), 4097-4103. W Zhang, Y Zhong, C Wang*. Effect of diamond additions on wettability and distribution of SnAgCu composite solder. Journal of Materials Science and Technology, 2012, 28(7): 661-665. B Li, C Wang*, W Liu, Y Zhong. Synthesis of Co-doped barium strontium titanite nanofibers by sol-gel/electrospinning process. Materials Letters, 2012, 75: 207-210.

学术兼职

Key Reader for Metallurgical and Materials Transactions A Journal Guest Editor for JOM Journal Associate Editor for Frontiers of Chemistry Organizer, Session Chair, Committee Member of 2D Materials Symposium of TMS 2021, 2022, 2023, 2024 Organizer, Session Chair, Symposium: Joining of Advanced and Specialty Materials (JASM XXII), ASM’s Annual Meeting, International Materials Applications & Technologies (IMAT) 2020 Organizer, Session Chair, Packaging & Heterogenous Integration sub-committee, IEEE EDTM2021 Organizer, Session Chair, 3D Printing/Advanced Manufacturing Session, APS Physics conference, 2023. Reviewer for Energy Conversion and Management, Metallurgical and Materials Transactions A, ACS Applied Electronic Materials, Solar Energy, Journal of Alloys and Compounds, Journal of the European Ceramic Society, Results in Materials, Smart Materials and Structures, Sustainable Materials and Technologies, Journal of Sound and Vibration, Journal of Microelectronics and Electronic Packaging, Journal of Physics D: Applied physics, Sensors, Applied Science, Metals, Materials, Machines, Polymer Testing, Journal of Materials Science: Materials in Electronics, Transactions on Components, Packaging and Manufacturing Technology, JOM, Medicine in Novel Technology and Devices, Industrial & Engineering Chemistry Research, etc.

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