张宏强 - 北京航空航天大学 - 机械工程及自动化学院

个人简介

张宏强，北京航空航天大学副教授，博士生导师。主要研究方向航空发动机制造、表面强化、钎焊及扩散焊、芯片封装及微纳制造。在PNAS、JMST、MD、JMC等国内外期刊发表SCI学术论文70余篇，申请国家发明专利20余项，参与撰写专著1部，其研究成果获评《Nature》期刊十大亮点研究论文，《Nature materials》针对其结果刊发其长篇评述性文章。主持国家基金委青年及面上、江西省面上基金、重点实验室基金等10余纵向项目，作为科研骨干参与科技部重点研发计划项目、两机专项、自然科学基金国际合作重点等项目。教育背景 Education 2014.09-2018.07 清华大学，机械工程，博士 2007.09-2014.07 吉林大学，材料加工工程，本硕工作经历 Career 2021.06-至今北京航空航天大学，助理教授、副教授、博士生导师 2018.08-2021.05 北京航空航天大学，博士后

研究领域

纳米金属烧结、高性能电子器件封装 Electronic packaging, Nano metallic particle sintering 陶瓷、复合材料与金属的钎焊扩散焊连接 Brazing diffusion of ceramics, composites and metals 微纳连接及功能器件 Micro/nano joining and functional devices 航空发动机关重构件强化及延寿 Strengthening and life extension of aircraft engine components

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Hongqiang Zhang, Guanlei Zhao, Ximin He*, Zhiyuan He*. Solar anti-icing surface with enhanced condensate self-removing at extreme environmental conditions. PNAS. 2021, 118(18):e2100978118. (Highlighted by Nature and Nature materials). Wang Y, Guo W, Hongqiang Zhang*. In-situ monitoring plume, spattering behavior and revealing their relationship with melt flow in laser powder bed fusion of nickel-based superalloy. Journal of Materials Science & Technology, 2023. Hongqiang Zhang, Wei Guo, Guisheng Zou*, Lei Liu. Boride evolutionary behavior and mechanism in the TLP repaired IN738 superalloy with crack-like defects. Journal of Alloys and Compounds, 2022, 909: 164692. Junliang Xue, Wei Guo, Hongqiang Zhang*. In-situ observation of microcrack initiation and damage nucleation modes on the HAZ of laser-welded DP1180 joint. Journal of Materials Science & Technology, 2023, 148:138-149. Zhang Y, Guo W, Zhang H*. Long-lasting action mechanism of 3D skeleton regulated the residual stress fluctuations in SiCf/SiC heterogeneous joints. Materials Characterization, 2023, 200: 112922. Wang Y, Guo W, Zhang H*. Microstructure, crack formation and improvement on Nickel-based superalloy fabricated by powder bed fusion. Journal of Alloys and Compounds, 2023: 171151. Guo W, Zhang Y, Zhang H*. Microstructure evolution and fatigue properties subjected to optimized coverage areas of laser shock peened TB10 titanium alloy. Optics & Laser Technology, 2023, 158: 108851. Zhang H, Zhang H*, Guo W. Novel SiC-based power device bonding materials of nano foam sheet and its characteristic and properties. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023. Qu G, Guo W, Zhang H*. The heat-dissipation sintered interface of power chip and heat sink and its high-temperature thermal analysis. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2023. Hong-Qiang Zhang, Wei Guo*, Lei Liu, Gui-Sheng Zou*. The high electrical and thermal conductivity of nano-Ag paste for power electronic applications. Acta Metallurgica Sinica (English Letters). 2020, 33:1543-1555.