刘勇攀 - 清华大学 - 电子工程系

个人简介

刘勇攀，博士，清华大学电子工程系长聘教授，教育部长江学者，电路与系统研究所所长，IEEE高级会员，北京信息科学与技术国家研究中心及未来芯片高精尖中心核心成员。研究兴趣包括高能效计算芯片、感存算融合系统等。围绕后摩尔时代新型器件与新兴应用带来的挑战与机遇，开展“器件-架构-算法”跨层次协同优化，高能效芯片成果转移至湃方科技和源清慧虹等公司。在ISSCC、JSSC、ACM/IEEE Trans.等杂志及会议上发表了200余篇论文，研制了世界首款非易失处理器，高能效人工智能芯片STICKER系列等高能效计算芯片。获得国际电子设计自动化领域40岁以下发明创新奖（2017），ASP-DAC最佳论文（2017），IEEE Micro Top Pick（2016），HPCA最佳论文（2015）以及低功耗电子系统设计ISLPED2012-2013,2019设计竞赛奖等。担任IEEE Trans. CAD、CAS2和IET Cyber-physical理论和应用杂志的编委，ISSCC、DAC等国际会议的技术委员会委员，ASPDAC 2020设计自动化会议秘书长以及NVMSA 2019非易失存储会议技术委员会主席，A-SSCC会议Tutorial Speaker和IEEE CASS 2021 Distinguished Lecturer。主持10余项自然科学基金重点，国家重点研发计划，创新特区等重点项目。曾获教育部技术发明一等奖（2019），中国公路学会科学技术一等奖（2016）及电子学会科学技术二等奖（2012）。教育经历 2004.9-2007.6 清华大学电子工程系博士学位 1995.4-2010.6 清华大学电子工程系本硕连读工作经历 2020.4至今清华大学电子工程系长聘教授 2017.4-2019.4 清华大学电子工程系长聘副教授，研究员 2017.4-2017.6 香港城市大学计算机科学系访问学者 2014.7-2014.9 美国宾夕法尼亚州立大学计算机科学系访问学者 2007.4-2016.4 清华大学电子工程系助理研究员和副研究员 Honors And Awards Co-Leader of Tsinghua Team for NUEDC Contest, First Class, 2004 Tsinghua Nortel Scholarship, First Class, 2005 Tsinghua Cadence Scholarship, Second Class, 2006 Key Member in Tsinghua 985 Research Support Plan, 2008 Excellent Member of CPC in Electronic Engineering Dept., 2009 Nominated by Fok Ying Tung Foundation, 2009

研究领域

Nonvolatile Computing Electronics Design Automation Power/Thermal Aware VLSI Design and Test

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

B.H. Ying, Y.P. Liu, H. Z. Yang, H. Wang, “Evaluation of Tunable Data Compression in Energy-Aware Wireless Sensor Networks”, Sensors, 2010, 10, 3195-3217 (SCI IF 1.870) Tian Z X, Liu Y P, Yang H Z. “Combined novel gate level model and critical primary input sharing for genetic algorithm based maximum power supply noise estimation.” Chinese Journal of Semiconductors, 2007, 28(9): 1375-1380 Shaohua Wang, Guangming Yu, Yongpan Liu , Huazhong Yang, “Low noise fully digitally controlled LC oscillator with back-to-back in series MOS varactors”, Journal of Tsinghua University (Science and Technology), 48(7) 2008. Yongpan Liu, Huazhong Yang, Rong Luo, Hui Wang, “Thermal-Aware Floorplanning Considering Empty Space Effect Based on Genetic Algorithms”, Chinese Journal of Electronics, vol.16 no.3 429-434, July, 2007 Yongpan Liu, Yinan Sun, Yihao Zhu, Huazhong Yang, "Design Methodology of Variable Latency Adders with Multistage Function Speculation", To appear in ISQED2010, San Jose, 2010 Hengyu Long, Yongpan Liu, Yiqun Wang, Robert P. Dick, Huazhong Yang, "Battery Allocation for Wireless Sensor Network Lifetime Maximization Under Cost Constraints", p.705-712, ICCAD 2009 Jue Wang, Beihua Ying, Yongpan Liu, Huazhong Yang, Hui Wang, “Energy Efficient Architecture of Sensor Network Node Based on Compression Accelerator”, p.117--120, Boston, GLSVLSI, 2009. Hengyu Long, Yongpan Liu, Robert P. Dick, Huazhong Yang, “Energy-Efficient Spatially-Adaptive Clustering and Routing in Wireless Wireless Sensor Networks”, p.1267-1272, Nice, DATE, 2009. Yongpan Liu, Robert Dick, Li Shang, Huazhong Yang, “Accurate Temperature-Dependent Integrated Circuit Leakage Power Estimation is Easy”, p.1526-1532 , DATE 2007, Nice, France. (Cited 19 times) Yongpan Liu, Huazhong Yang, Robert Dick, Hui Wang, Li Shang, “Thermal vs Energy Optimization for DVFS-enabled Processors in Embedded Systems”, p. 204- 209 , ISQED 2007, San Jose, USA. (Cited 22 times) BOOKS Rong Luo, Yu Wang, Yongpan Liu, “Digital Principles and Design”, Tsinghua Press, Oct. 2006 Rong Luo, Wei Liu, Hong Luo, Yongpan Liu, “Contemporary Logic Design”, Publishing House of Electronics Industry, Mar. 2006

学术兼职

Reviewer of IEEE Trans. VLSI ASICON05, ICIC06, APCCAS06, ICCCAS06, GLSVLSI07, CF07 Member, IEEE, IEICE CONFERENCE ICCCAS 2009 TPC ICGCS2010 TPC