近期论文
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一、英文SCI期刊：
L Yuan, F Hong, P Cheng,Pool boiling enhancement through a guidance structure mounted above heating surface, International Journal of Heat and Mass Transfer 139 (2019), 751-763 (通讯作者)
J Li, F Hong, R Xie, P Cheng, Pore scale simulation of evaporation in a porous wick of a loop heat pipe flat evaporator using Lattice Boltzmann method, International Communications in Heat and Mass Transfer 102 (2019), 22-33 (通讯作者)
Two-phase flow instability in distributed jet array impingement boiling on pin-fin structured surface and its affecting factors，International Journal of Heat and Mass Transfer,2019
FL Cui, FJ Hong, P Cheng, Comparison of normal and distributed jet array impingement boiling of HFE-7000 on smooth and pin-fin surfaces, International Journal of Heat and Mass Transfer 126(2018), 1287-1298 (通讯作者)
D Ni, FJ Hong, P Cheng, G Chen, Numerical study of liquid-gas and liquid-liquid Taylor flows using a two-phase flow model based on Arbitrary-Lagrangian–Eulerian (ALE) formulation, International Communications in Heat and Mass Transfer 88(2017) , 37-47 (通讯作者)
Y. H. Chen, W. N. Hu, J. Wang, Transient effects and mass convection in sessile droplet evaporation: The role of liquid and substrate thermophysical properties，INTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER, 2017, 108(B), 2072-2087 (通讯作者)
CY Zhang, T Wang, DH Chen, FJ Hong, P Cheng, Confined jet array impingement cooling with spent flow distraction using NEPCM slurry, International Communications in Heat and Mass Transfer 77 (2016), 140-147 (通讯作者)
C.Y. Zhang , P. Cheng, F.J. Hong, Mesoscale simulation of heater size and subcooling effects on pool, NTERNATIONAL JOURNAL OF HEAT AND MASS TRANSFER 101 （2016）1331-1342
Chaoyang Zhang， Fangjun Hong*， Ping Cheng， Simulation of liquid thin film evaporation and boiling on a heated hydrophilic microstructured surface by Lattice Boltzmann method, International Journal of Heat and Mass Transfer 86（2015）629-638. (通讯作者）
F.J. Hong, C.Y. Zhang, W. He, P. Cheng, G. Chen, Confined jet array impingement boiling of subcooled aqueous ethylene glycol solution,International Communications in Heat and Mass Transfer 56 (2014) 165–173.
Fangjun Hong, Feng Bai, Ping Chen, A Parametric Study of Electrothermal Flow inside an AC EWOD Droplet, International Communications in Heat and Mass Transfer,Volume 55, July 2014, Pages 63–70.
Kai Yang, Fangjun Hong, Ping Cheng, A fully coupled numerical simulation of sessile droplet evaporation using Arbitrary Lagrangian–Eulerian formulation, International Journal of Heat and Mass Transfer 70 (2014) 409–420 (通讯作者）
Hong F.J. , Cheng P. , Wu H.Y. , Sun Z. , Evaporation/Boiling Heat Transfer on Capillary Feed Copper Particle Sintered Porous Wick at Reduced Pressure, International Journal of Heat and Mass Transfer 2013 (63 ): p.389–400
Hong, F.J., Jiang, D.D., Cheng, P, Frequency-dependent resonance and asymmetric droplet oscillation under ac electrowetting on coplanar electrodes, Journal of Micromechanics and Microengineering, 2012. 22(8)
Hong F. J., Bai F., Cheng P., Numerical simulation of AC electrothermal micropump using a fully coupled model. Microfluidics and Nanofluidics, 2012,13(3): p. 411-420.
Hong, F.J., P. Cheng, and H.Y. Wu, Characterization on the performance of a fractal-shaped microchannel network for microelectronic cooling. Journal of Micromechanics and Microengineering, 2011. 21(6).
Hong, F.J., J. Cao, and P. Cheng, A parametric study of AC electrothermal flow in microchannels with asymmetrical interdigitated electrodes. International Communications in Heat and Mass Transfer, 2011. 38(3): p. 275-279.
Hong, F. and P. Cheng, Three dimensional numerical analyses and optimization of offset strip-fin microchannel heat sinks. International Communications in Heat and Mass Transfer, 2009. 36(7): p. 651-656.
Cao Jun, Cheng Ping, Hong Fangjun, Applications of electrohydrodynamics and Joule heating effects in microfluidic chips: A Review. Science in China: Series E: Technological science, 2009, 52(12): 3477-3490
Cao J.，Cheng P. and Hong F.J., A numerical study of an electrothermal vortex enhanced micromixer, J. of Microfluidics and Nanofluidics, 2008, 5:13-21
Cao Jun, Cheng Ping, Hong Fangjun, A numerical analysis of forces imposed on particles in conventional dielectrophoresis in microchannels with interdigitated electrodes, Journal of Electrostatics, 2008, 66: 620-626
Hong F.J., Cheng P., Ge H. and Goh Teck Joo, Conjugate heat transfer in tree-shaped microchannel network heat sink for integrated microelectronic cooling application, International Journal of Mass and Heat Transfer, 2007,50: 4986-4998
Ping Cheng, Hui-Ying Wu, and Fang-Jun Hong, Phase-change heat transfers in microsystems, J. of Heat Transfer, 2007, 129:101-108
Cao J., Hong F.J. and Cheng P., Numerical Study on Sample Stacking in Capillary Electrophoresis, Chinese Journal of Chromography, 2007,25(2):183-188
Cao J., Hong F.J. and Cheng P., Numerical Analysis of the Influence Factors on Sample Stacking in Capillary Electrophoresis, Chinese Journal of Chromography, 2007, 25(4):482-485
Cao J., Hong F.J. and Cheng P., Numerical study of radial temperature gradient effect on separation efficiency in capillary electrophoresis, International Communications in Heat and Mass Transfer, 2007, 34:1048-1055
Hong F.J. and Qiu H.-H.: Characterization of Variable Thermal Contact Resistance in Rapid Contact Solidification Utilizing Novel Ultrasound Technique, Journal of Heat Transfer, Transactions of the ASME, 2007, 129:1036-1045
Wang W., Hong F. J. and Qiu H. -H., Prediction of Solder Bump Formation in Solder Jet Packaging Process, IEEE Transactions On Components and Packaging, 2006, 29 (3): 486-493
Wang W., Hong F. J. and Qiu H. -H., The Impact of Thermal Contact Resistance on the Spreading and Solidification of a Droplet on a Substrate, Heat Transfer Engineering,2006, 27(9): 68-80
Qiu H.-H, Wang X.S., Hong F. J., Measurements of interfacial film thickness for immiscible liquid-liquid slug/droplet flows, Measurement Science and Technology,2005,16(6):1374-1380
Hong F.J. and Qiu H.–H., Experimental study on rapid solidification process using a novel ultrasound technique, Experimental Thermal and Fluid Science，2005,30(1):17-26
Hong F.J. and Qiu H.–H., Modeling of substrate remelting, flow, and resolidification in microcasting, Numerical Heat Transfer Part A-Applications, 2005, 48(10): 987-1008
二、中文期刊论文：
詹可敬, 崔付龙, 洪芳军,等. 周期性热流下受限阵列射流沸腾特性的实验研究[J]. 低温工程, 2018(1):第6-12页.
崔付龙, 詹可敬, 洪芳军. 射流-针肋微通道混合型蒸发器换热特性的实验研究[J]. 制冷技术, 2017, 37(4):第1-6页.
周春鹏 胡伟男 崔付龙 洪芳军 ，板式单环路脉动热管的流动和传热特性，低温工程，2017年01期
胡伟男 周春鹏 崔付龙 洪芳军，单环路平板脉动热管定向循环的数值研究，《低温与超导》2017年 第2期
陈大衡、陈钢、洪芳军，细乳液-溶胶凝胶法制备软脂酸/二氧化硅纳米相变胶囊,低温工程，2017
李伟静，李振宁，洪芳军，陈钢，受限式阵列射流过冷沸腾的可视化实验研究，《低温工程》，2015年第二期，44-50
蒋冬冬, 洪芳军，郑平, 交流电润湿作用下液滴的振荡行为特性. 上海交通大学学报, 2013. 47(4): 第513-518页.
何为, 洪芳军，张朝阳, 受限式阵列射流沸腾换热影响参数研究. 低温工程, 2013(5): 第46-51,64页.
白锋，洪芳军, 介质上电润湿液滴输运、合并及振荡实验研究. 微纳电子技术, 2012(08): 第526-533页.
孙振, 洪芳军，郑平, 颗粒烧结多孔芯蒸发/沸腾换热的实验研究, 《工程热物理学报》 2011年第32第10期
洪芳军，郑平，介质上电润湿液滴动力学特性的数值模拟研究，工程热物理学报，2010年第31卷第7期
洪芳军，郑平，曹军，电润湿液滴型微流控芯片液滴驱动的EHD数值模拟，中国工程热物理学报，2009，30（8）：1393-1395
洪芳军，郑平，常欧亮，吴晟，树型微通道网络芯片热沉的实验研究，上海交通大学学报，2009，43(10):1649-1653
曹军，洪芳军，郑平，PDMS 微流控芯片中焦耳热效应的数值研究，工程热物理学报，2009，30（1）: 124-128
曹军，洪芳军，郑平，焦耳热效应对毛细管电泳中样品区带传输的影响，化学工程，2008，36(7):71-74
曹军，洪芳军，陈翔，郑平，芯片上叉指型电极结构介电电泳的数值分析与实验研究，微纳电子技术，2008, 45(7):397-402
曹军，洪芳军，郑平，平面叉指型微电极结构交流电渗泵的阻抗谱分析，微纳电子技术，2008，45(9): 521-526
曹军，洪芳军，郑平，双T型通道微流控芯片中样品电堆积富集技术的数值研究，上海交通大学学报, 2007，41(10)：1667-1671
曹军，洪芳军，郑平，毛细管电泳样品电堆积富集技术的数值研究，色谱，2007,25(2):183-188
曹军，洪芳军，郑平，毛细管电泳样品电堆积富集技术影响因素的数值研究，色谱，2007,25(4):482-485
葛浩，洪芳军，郑平，树型微通道网络在集成微电子冷却中的应用研究，工程热物理学报,2007,28(S2):41-44
马一太，洪芳军，王景刚，CO2跨临界双级压缩采暖热泵理论分析，大连理工学报, 2001，Vol.41
王景刚，侯立泉，马一太，魏东，洪芳军，CO2跨临界水-水热泵循环系统的实验研究, 暖通空调杂志, Vol.3，2001
魏东，马一太，王中铮，洪芳军，多孔型纵槽凝结换热表面的性能研究,太阳能学报，2001 Vol.22， No.4 P.374-379
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