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[1] Fulong Zhu*, Xinxin Lin, Wei Zhang, Jiajie Fan, Sheng Liu, “Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique”, IEEE Access, v6, p33099-33110, 2018. (SCI, EI, DOI:10.1109/ACCESS. 2018. 2842199)
[2] Yixin Xu, Fulong Zhu*, Miaocao Wang, Xiaojian Liu, Sheng Liu, “Molecular Dynamics Simulation on Grinding Process of Cu-Si and Cu-SiO2 Composite Structures”, in 19th International Conference on Electronic Packaging Technology, ICEPT 2018.
[3] Miaocao Wang, Fulong Zhu, Yixin Xu, Sheng Liu, “Investigation of the differences in nanometric grinding of SiC and Si by molecular dynamics”, in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, p434-437, 2018. (EI, DOI:10.23919/ICEP. 2018. 8374341)
[4] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Jiaquan Tao, Xinxin Lin, Fengren Wang and Lang Shi, “Investigation of mechanical properties of silicone/phosphor composite used in light emitting diodes package”, Polymers, v10, n2, p195, 2018. (SCI,EI, DOI: 10.3390/polym10020195)
[5] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiajie Fan and Sheng Liu, “Comparison of Ultrasonic Wire Bonding Process between Gold and Copper by Nonlinear Structure Analysis”, Journal of Adhesion Science and Technology, v32, n18, p 2007-2018, 2018. (SCI.EI, DOI: 10.1080/01694243.2018.1463651)
[6] Yongjun Pan, Fulong Zhu*, Xinxin Lin, Jiaquan Tao, Liping He, Han Wang, Sheng Liu, “Comparing the copper and gold wire bonding during thermalsonic wire bonding process”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, p 240-243, 2016. (EI, DOI: 10.1109/ICEPT. 2016. 7583127)
[7] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Jiaquan Tao and Sheng Liu, “Thermal-mechanical analysis of high power LED packaging during power cycling test”, 2017 18th International Conference on Electronic Packaging Technology, ICEPT 2017, p1-5, 2017. (EI, DOI: 10.1109/ICEPT.2017.8046394)
[8] Yongjun Pan, Fulong Zhu*, Jiajie Fan, Xinxin Lin, Fengren Wang, Lang Shi, Yan Kan and Sheng Liu, “Reliability prediction of LED packaging by fatigue behavior of bonding wire in power cycling accelerated test”, in 2017 IEEE 19th Electronics Packaging Technology Conference, EPTC 2017, p1-4, 2017. (EI, DOI: 10.1109/EPTC.2017.8277431)
[9] Xinxin Lin, Fulong Zhu*, Liping He, Yongjun Pan, Jiaquan Tao, Ke Duan, “Subsurface damage mechanism of wafer thinning process revealed by molecular dynamics simulation”, in 2016 17th International Conference on Electronic Packaging Technology, ICEPT2016, p417-420, 2016 (EI, DOI:10.1109/ICEPT. 2016.7583166).
[10] Zhu Fulong*, Kan Yan, Kan Tang, Sheng Liu, “Investigation of Thermal Properties of Ni-Coated Graphene Nanoribbons Based on Molecular Dynamics Methods”, Journal of Electronic Materials, v46, n8, p.4733-4739, 2017.(SCI,EI, DOI: 10.1007/s11664-017-5542-5)
[11] Liping He, Fulong Zhu*, Yanming Chen, Ke Duan, Xinxin Lin, Yongjun Pan, Jianquan Tao, “Ultrasonic power measurement system based on acousto-optic interaction”, Review of Scientific Instruments, v87, n5, p1-8, 2016.(SCI,EI, DOI: 10.1063/1.4948731)
[12] Liping He, Fulong Zhu*, Yuhong Liu, Sheng Liu, “Investigaton of machining mechanism of monocrystalline silicon in nanometric grinding”, AIP Advances, Vol.7, Issue 5, 2017. (SCI, EI, DOI: 10.1063/1.4983216)
[13] Liping He, Fulong Zhu*，Ke Duan，Kai Tang, Sheng Liu, “Mechanical response of copper nanowires under torsion”, in 2015 16th International Conference on Electronic Packaging Technology, ICEPT2015, p318-322, 2015. (EI, DOI: 10.1109/ICEPT. 2015. 7236600)
[14] Fulong Zhu*, Hengyou Liao, Kai Tang, Youkai Chen, Sheng Liu, “Molecular dynamics study on the effect of temperature on the tensile properties of single-walled carbon nanotubes with a Ni-coating”, Journal of Nanomaterials, v 2015, 2015(SCI, EI, DOI: 10.1155/2015/767182)
[15] Wei Zhang, Fulong Zhu*, Honghai Zhang, Sheng Liu, “An Adjustable Sensitivity Shadow Moiré Technique for Surface Morphology Measurement”, Journal of Modern Optics, v61, n8, p641-649, 2014. (SCI, EI, DOI: 10.1080/09500340. 2014. 904941)
[16] Wei Zhang, Fulong Zhu*, Yiquan Dai, Hengyou Liao, Shao Song, Honghai Zhang, Sheng Liu, “Warpage measurement of silicon wafers of various bonding areas”, in 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p1164-1167, 2012. ( EI, DOI: 10.1109/ICEPT-HDP.2012.6474814)
[17] Wei Zhang, Fulong Zhu, Shao Song, Honghai Zhang, Sheng Liu, “3-D warpage measurement of silicon wafer”, in 2011 2nd International Conference on Artificial Intelligence, Management Science and Electronic Commerce, AIMSEC 2011, p3603-3605,2011. (EI, DOI: 10.1109/AIMSEC.2011.6010064)
[18] Ying Li, Fulong Zhu*, Yanming Chen, Ke Duan, Kai Tang, Sheng Liu, “Analysis of insertion force of electric connector based on FEM”, 2014 21st International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA2014，p195-198, 2014. (EI, DOI: 10.1109/IPFA.2014.6898160)
[19] Ke Duan, Fulong Zhu*, Kai Tang, Liping He, Yanming Chen, Sheng Liu, “Effect of Chirality and Number of Graphene Layers on the Mechanical Properties of Graphene-Embedded Copper Nanocomposites”, Computational Materials Science, v117, p294-299, 2016.(SCI, EI, DOI: 10.1016/j.commatsci.2016.02.007)
[20] Fulong Zhu*, Ke Duan, Liping He, Kai Tang, Ying Li, Sheng Liu, “Effects of Chirality and Position of Graphene on the Bending Properties of Graphene-Embedded Copper Nanocomposites”, Journal of Nanoscience and Nanotechnology, Vol.17. Issue 5, p3105-3110, 2017 (SCI,EI, DOI: 10.1166/jnn. 2017. 13040)
[21] Ke Duan, Fulong Zhu*, Ying Li, Kai Tang, Sheng Liu, Yanming Chen, “Contact Resistance Investigation of Electrical Connector with Different Shrink Range”, in 2014 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1146-1149, 2014. (EI, DOI:10.1109/ICEPT.2014. 6922846)
[22] Ke Duan, Fulong Zhu*, Mingxiang Chen, Ying Li, Yanming Chen, “Warpage Analysis of DBC Substrate based on Non-contact Shadow Moiré Technology”, 2014 The 15th International Conference on Electronic Packaging Technology, ICEPT2014, p1427-1430,2014.( EI, DOI: 10.1109/ICEPT.2014.6922923)
[23] Kai Tang, Fulong Zhu*, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Effect of Defects on Thermal Conductivity of Graphene”, 2014 15th International Conference on Electronic Packaging Technology, ICEPT 2014, p592-595, 2014. ( EI, DOI: 10.1109/ICEPT.2014.6922725)
[24] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao, Sheng Liu, “Molecular Dynamics Simulation on Thermal Conductivity of Single-Walled Carbon Nanotubes”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p583-586, 2013.( EI, DOI: 10.1109/ICEPT.2013.6756538)
[25] Kai Tang, Fulong Zhu*, Youkai Chen, Ying Li, Hengyou Liao , Xiahui Chen, Sheng Liu, “Effect of Vacancy Defects on Thermal Conductivity of Single-walled Carbon Nanotube”, 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC2013, p817-820, p2013. ( EI, DOI: 10.1109/EPTC. 2013.6745835)
[26] Fulong Zhu*, Kai Tang, Ying Li, Ke Duan, Sheng Liu, Yanming Chen, “Heat conduction study across metal/graphene interface by molecular dynamics”, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC2014, p833-836, 2014. ( EI, DOI: 10.1109/EPTC.2014.7028411)
[27] Simin Wang, Xing Chen, Sheng Liu, Fulong Zhu, Xiaogang Liu, “Estimation of homogenized Young's modulus of silicone/phosphor composite considering random dispersion and size variation of phosphor particles”, Journal of Composite Materials, v50, n14, p1981-1988, 2015. (SCI,EI, DOI:10. 1177/0021998315597992)
[28] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “The effect of temperature on compressive mechanical behavior of SWCNT-Ni”, 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p633-636, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012. 6474697)
[29] Youkai Chen, Fulong Zhu*, Hengyou Liao, Shao Song, Sheng Liu, “Compressing Deformation Investigation of Single-Walled Carbon Nanotube Coated with Ni”，the 2012 IEEE 14th Electronics Packaging Technology Conference, EPTC 2012, p728-731, 2012. ( EI, DOI:10.1109/EPTC. 2012.6507178)
[30] Youkai Chen, Fulong Zhu, Kai Tang, Ying Li, Hengyou Liao, Sheng Liu, “Mechanical behavior investigation of single-walled carbon nanotubes with one vacancy”, 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, p579-582, 2013. (EI, DOI: 10.1109/ICEPT. 2013.6756537)
[31] Youkai Chen, Fulong Zhu*, Kai Tang, Ying Li, Hengyou Liao, Xiahui Chen, Sheng Liu, “Mechanical Properties Investigation of Graphene Coated with Ni”， the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013, p756-759,2013.( EI, DOI: 10.1109/EPTC.2013.6745822)
[32] Hengyou Liao, Fulong Zhu*, Sheng Liu, “Mechanical stretching behavior simulation of SWCNT and SWCNT-Ni”, 2011 International Symposium on Advanced Packaging Materials, APM 2011, p85-90, 2011. (EI, DOI: 10.1109/ISAPM.2011.6105677)
[33] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Tensile behaviors investigation of SWCNT-Ni with vacancies”，2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP2012, p294-297, 2012. (EI, DOI:10.1109/ICEPT-HDP. 2012.6474621)
[34] Hengyou Liao, Fulong Zhu*, Wei Zhang, Chen Youkai; Song Shao; Liu Sheng, “Torsion behavior simulation of Ni-coating SWCNT based on molecular dynamics”. 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2012, p1155-1158, 2012. (EI, DOI: 10.1109/ICEPT-HDP.2012.6474812)
[35] Shao Song, Fulong Zhu*, Wei Zhang, Sheng Liu, “Warpage measurement of various substrates based on white light shadow Moiré technology”, 2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2011, p389-392, 2011. (EI, DOI:10.1109/IMPACT. 2011.6117161)
[36] Zhaohui Chen, Shengjun Zhou, Zhicheng Lv, Chuan Liu, Xing Chen, Xiao Jia, Ke Zeng, Bin Song, Fulong Zhu, Mingxiang Chen, Xuefang Wang, Honghai Zhang, Sheng Liu, “Expert advisor for integrated virtual manufacturing and reliability for TSV/SiP based modules”, 2011 IEEE 61st Electronic Components and Technology Conference, ECTC 2011, p1183-1189, 2011. (EI, DOI: 10.1109/ECTC.2011.5898660);
[37] Dan Xie, Honghai Zhang, Sheng Liu, Fulong Zhu, Sheng Tao, “Mechanical Properties Investigation of PMMA PC and PS during Thermal Nanoimprinting”, 2008 4th International Symposium on Precision Mechanical Measurements, v7130, 2008. (EI,DOI: 10.1117/12.819561)
[38] Fulong Zhu*, Shao Song, Wei Zhang, Sheng Liu, “Creep behavior investigation of lead-free solder alloy Sn96.5Ag3Cu0.5”， 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, p195-198, 2010.(EI, DOI: 10.1109/ICEPT.2010.5582445)
[39] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Microstructures and Tensile Properties of a Sn-Cu Lead-free Solder Alloy”, Journal of Materials Science: Materials in Electronics, v17, n5, p379-384, 2006.( SCI, EI, DOI: 10.1007/s10854-006-7474-3)
[40] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “the Effect of Temperature and Strain Rate On the Tensile properties of a Sn99.3Cu0.7(Ni) Lead-free Solder Alloy”, Microelectronic Engineering, v84, n1, p144-150, 2007.( SCI, EI, DOI: 10.1016/j.mee.2006.09.031)
[41] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Effects of Temperature and Strain Rate on Mechanical property of Sn96.5Ag3Cu0.5”, Journal of Alloys and Compounds, v438, n1-2, p100-105, 2007.( SCI, EI, DOI: 10.1016/j.jallcom.2006.08.009)
[42] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, Microstructure and Mechanical Properties Investigation of Lead-free Solder Sn99.3Cu0.7, 2005 6th International Conference on Electronics Packaging Technology, p1-5, 2005.(EI, DOI: 10.1109/ICEPT.2005.1564686)
[43] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, “Mechanical Properties of a Lead-Free Solder Alloys”, 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v 2005, p107-112, 2005.( EI, DOI: 10.1109/AGEC.2005.1452326)
[44] ZHU Fu-long*, WANG Zhi-yong, GUAN Rong-feng, WANG Xue-fang, ZHANG Hong-hai, LIU Sheng, “Single Axis Mini-Tester of Mechanical Property for Micro-Specimen”, The 3rd International Symposium on Instrumentation Science and Technology (ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0562-0568.（ISTP）
[45] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Temperature and Strain Rate Behavior of Lead-free Solder Sn96.5Ag3.5”, 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2006), p 239-243, 2006.( EI, DOI: 10.1109/IPFA.2006.251038)
[46] Fulong Zhu*, Zhiyong Wang, Rongfeng Guan, Honghai Zhang, Sheng Liu, “Mechanical properties investigation of a SnAg solder”, Proceedings of 2005 International conference on electronics packaging, Tokyo，Japan，April 13-15, 2005, pp.208-213.(ISTP)
[47] Fulong Zhu*, Honghai Zhang, Rongfeng Guan, Sheng Liu, “Investigation of Creep Behaviors of a Lead-free Solder Alloy Sn96.5Ag3.5”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-6, 2006. ( EI, DOI: 10.1109/ICEPT.2006.359866)
[48] Rongfeng Guan, Fulong Zhu, Zhiyin Gan, Huang Dexiu , Sheng Liu, “Stress birefringence analysis of polarization maintaining optical fibers”, Optical Fiber Technology, v11, n3, p240-254, 2005.(EI, DOI: 10.1016/j.yofte.2004.10.002)
[49] Wang Zhiyong, Zhu Fulong, ZHANG Hong-hai, LIU Sheng, GUAN Rong-feng, “A Six-axis Mechanical Tester for Microspecimens”, The 3rd International Symposium on Instrumentation Science and Technology(ISIST2004), Aug.18-22, 2004, Xi’an, China, Vol.3, 0535-0540.（ISTP）
[50] Guan Rongfeng, Wang Xuefang, Zhu Fulong, Gan Zhiyin, Liu Sheng, Huang Dexiu, “Study on plasma cleaning and strength of wire bonding”, 2004 International Conference on the Business of Electronic Product Reliability and Liability ( EPRL), p65-71, 2004.( EI,)
[51] Guan Rongfeng, Gan Zhiyin, Zhu Fulong, Liu Sheng, Wang Xuefang, “Anodic bonding study on vacuum micro sealing cavity”, 2006 7th International Conference on Electronics Packaging Technology, ICEPT '06, p1-4, 2006. (EI, DOI: 10.1109/ICEPT.2006.359851)
[52] 陈四海, 汪殿民, 朱福龙, 徐涌, 易新建. 微型柔性剪切应力传感器的制作研究. 传感器技术, 2005(8) , 81-85
[53] 刘文明, 王志勇, 鲍剑斌, 汪学方, 关荣锋, 朱福龙, 刘胜. 微陀螺仪的真空回流真空封装工艺研究. 微细加工技术，April ,2006, p61-64.
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