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Xiaoyun Qi, Shicheng Zhou, Hui Fang, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*,One-step PDA coating strategy on pure Zn for blood-contacting engineering,Journal of Materials Science & Technology,Volume 123,2022,78-91.
Shuai Wang, Jiayun Feng, Shang Wang, Kaifeng Wang, Muying Yu, Yanhong Tian*, Interfacial reaction between novel high entropy alloy SnPbInBiSb and Cu substrate, Materials Letters, Volume 325, 2022.
张贺,冯佳运,丛森,王尚,安荣,吴朗,田艳红*.62Sn36Pb2Ag组装焊点长期贮存界面化合物生长动力学及寿命预测[J/OL].工程科学学报:1-8[2022-11-21].
Rong An*, Xiguang Zhang, Jingman Shen, Wanyu Jiang, Xunchun Wang, Wei Zhang, Wei Liu*, Yanhong Tian, Chunqing Wang, Physics-of-degradation-based life prediction of solder interconnects of long-life solar arrays in low-earth orbit, Solar Energy, Volume 248, 2022, 196-209.
Qing Sun, Maoxiang Yang, Guifang Zeng, Jing Li, Zhibiao Hu, Deping Li*, Shang Wang*, Pengchao Si*, Yanhong Tian, Lijie Ci*, Insights into the Potassium Ion Storage Behavior and Phase Evolution of a Tailored Yolk–Shell SnSe@C Anode. Small 2022, 18, 2203459.
张贺,冯佳运,丛森,王尚,安荣,吴朗,田艳红*.表面贴装锡基焊点长期贮存可靠性及寿命预测研究[J].电子与封装,2022,22(07):5-10.
王大为,董阳平,田艳红,毕云杰,严明*.活性气氛对金属材料激光增材制造的作用机制[J].中国激光,2022,49(14):87-107.
Wei Liu, Rong An*, Ying Ding, Chun-Qing Wang, Yan-Hong Tian & Kun Shen, Microstructure and properties of AgCu/2 wt% Ag-added Sn–Pb solder/CuBe joints fabricated by vapor phase soldering. Rare Met. 41, 1983–1988 (2022).
Weiwei Zhang, Sen Cong*, Jihua Fang & Yanhong Tian ,Relationship between dynamic resistance and welding quality during resistance spot welding for micron AuNi9 wire. Int J Adv Manuf Technol 120, 6605–6616 (2022).
Hui Fang, Shicheng Zhou, Xiaoyun Qi, Yanhong Tian, Chenxi Wang*, Hybrid Plasma Activation Strategy for the Protein-Coated Magnesium Implants in Orthopedic Applications,Adv. Mater. Interfaces 2022, 2101724.
张贺,王尚,冯佳运,马竟轩,胡轩溢,冯艳,田艳红*.金属/非金属纳米线连接及应用研究进展[J].机械工程学报,2022,58(02):76-87.
王晨曦*,戚晓芸,方慧,康秋实,周诗承,许继开,田艳红.紫外光活化低温键合研究进展[J].机械工程学报,2022,58(02):122-135.
吴卓寰,刘威*,温志成,王一平,田艳红,王春青.微米铜银复合结构与纳米银混合连接材料制备与高频感应快速烧结方法研究[J].机械工程学报,2022,58(02):26-33.
李胜利,任春雄,杭春进*,田艳红,王晨曦,崔宁,蒋倩.极端热冲击和电流密度耦合Sn-3.0Ag-0.5Cu焊点组织演变[J].机械工程学报,2022,58(02):291-299.
撒子成,王尚,冯佳运,马竟轩,张宁,于广良,梁洁玫,田艳红*.SiP器件组装焊点形态预测及其随机振动可靠性仿真研究[J].机械工程学报,2022,58(02):276-283.
李胜利,牛飘,杭春进*,田艳红,崔宁,蒋倩.极端温度环境Sn基焊点本构方程的研究进展[J].机械工程学报,2022,58(02):236-245.
Hui Fang, Xiaoyun Qi, Shicheng Zhou, Shuhan Yang, Chunjin Hang, Yanhong Tian, Chenxi Wang*, High-Efficient Vacuum Ultraviolet-Ozone Assist-Deposited Polydopamine for Poly(lactic-co-glycolic acid)-Coated Pure Zn toward Biodegradable Cardiovascular Stent Applications, ACS Appl. Mater. Interfaces 2022, 14, 2, 3536–3550.
Hui Fang, Shicheng Zhou, Xiaoyun Qi, Chenxi Wang*, Yanhong Tian, A multifunctional osteogenic system of ultrasonically spray deposited bone-active coatings on plasma-activated magnesium, Journal of Magnesium and Alloys, 2021.
Wei Liu*, Zhicheng Wen, Sizhen Chen, Chunqing Wang*, Rong An, Wei Zhang, Xinming Wang, Junjie Wang, Yanhong Tian, Preparation and characterization of self-assembled ZnO nanowire devices: nanowire strain sensor and homogeneous p–n junction, 2021 Nanotechnology, 32, 495604.
Yang Dongsheng, Yilong Huang, Yanhong Tian*. Microstructure of Ag Nano Paste Joint and Its Influence on Reliability. Crystals. 2021; 11(12):1537.
王尚,马竟轩,杨东升,徐佳慧,杭春进,田艳红*.射频器件超细引线键合射频性能仿真[J].焊接学报,2021,42(10):1-7%2B97.
Wei Liu, Zhicheng Wen, Jiahui Xu, Xinming Wang, Rong An*, Chunqing Wang*, Zhen Zheng, Wei Zhang, Yanhong Tian,Rapid fabrication of Cu/40-μm thick full Cu3Sn/Cu joints by applying pulsed high frequency electromagnetic field for high power electronics,Materials Chemistry and Physics,Volume 276,2022,125386.
王尚,王凯枫,张贺,徐佳慧,杨东升,杭春进,田艳红*.射频器件超细引线键合工艺及性能研究[J].机械工程学报,2021,57(22):201-208.
Xuanyi Hu, Shang Wang*, He Zhang, Yiping Wang, Chunjin Hang, Jiayue Wen & Yanhong Tian*. Silver flake/polyaniline composite ink for electrohydrodynamic printing of flexible heaters. J Mater Sci: Mater Electron 32, 27373–27383 (2021).
Sen Cong, Weiwei Zhang, He Zhang, Peng Liu, Xingwen Tan, Lang Wu, Rong An, Yanhong Tian*, Growth kinetics of (CuxNi1-x)6Sn5 intermetallic compound at the interface of mixed Sn63Pb37/SAC305 BGA solder joints during thermal aging test, 2021 Mater. Res. Express 8 106301.
Shang Wang, He Zhang, Chunjin Hang*, Jiayun Feng, Zicheng Sa, Yue Li, Weiwei Zhang, Yanhong Tian*, Phase transformation behavior of Al-Au-Cu intermetallic compounds under ultra-fast micro resistance bonding process, Materials Characterization,Volume 180,2021,111401.
He Zhang, Yanhong Tian*, Shang Wang*, Jiayun Feng, Chunjin Hang, Chenxi Wang, Jingxuan Ma, Xuanyi Hu, Zhen Zheng, Huijuan Dong, Robust Cu-Au alloy nanowires flexible transparent electrode for asymmetric electrochromic energy storage device, Chemical Engineering Journal, Volume 426, 2021,131438.
Qiushi Kang, Chenxi Wang*, Shicheng Zhou, Ge Li, Tian Lu, Yanhong Tian, Peng He, Low-Temperature Co-hydroxylated Cu/SiO2 Hybrid Bonding Strategy for a Memory-Centric Chip Architecture, ACS Appl. Mater. Interfaces 2021, 13, 32, 38866–38876.
Yanliang Shan, Yunhui Mei, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Kim Shyong Siow, "Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging," in IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 11, no. 6, pp. 983-989, June 2021.
Xiaoyan Yao, PanpanLu, YanhongTian, Guo-Quan Lu, YunhuiMei*, A 200 °C curable soft magnetic composite with high permeability and low core loss for power applications at >1 MHz, Journal of Magnetism and Magnetic Materials, 2021，535，168061.
Jiayun Feng, Yanhong Tian*, Sumei Wang, Ming Xiao, Zhuang Hui, Chunjin Hang, Walter W. Duley, Y. Norman Zhou*,Femtosecond laser irradiation induced heterojunctions between carbon nanofibers and silver nanowires for a flexible strain sensor, Journal of Materials Science & Technology, 2021, 84,139-146.
Shang Wang, Yan Feng, He Zhang, Qiqi Peng, Yanhong Tian*. Highly stable and printable Ag NWs/GO/PVP composite ink for flexible electronics, Flexible and printed electronics, 2021.
Shang Wang, He Zhang, Yue Li, WeiWei Zhang, Chunjin Hang, Yanhong Tian*.Transient Solid-Liquid interfacial Reaction between Al wire and Au/Cu pad during parallel gap micro-resistance welding, Materials Letters, 2021, 288(9).
He Zhang, Shang Wang, Bingying Wu, WeiWei Zhang, Chunjin Hang, Yanhong Tian*.Ultrafast Parallel Micro-Gap Resistance Welding of an AuNi9 Microwire and Au Microlayer, Micromachines, 2021, 12(1), 51.
He Zhang, Shang Wang, Chunjin Hang, Yanhong Tian*.Joining of copper nanowires by electrodepositing silver layer for high-performance transparent electrode, Welding in the world, 2021.
杨帆, 杭春进，田艳红*. 功率器件封装用纳米浆料制备及其烧结性能研究进展. 电子与封装，2021, 21(3).
Hui Fang, Chenxi Wang*, Daoyuan Li, Shicheng Zhou, Yu Du, He Zhang, Chunjin Hang, Yanhong Tian, Tadatomo Suga. Fabrication of Ag@Ag2O-MnOx composite nanowires for high-efficient room-temperature removal of formaldehyde, Journal of Materials Science & Technology, 2021.
Yanliang Shan, Yunhui Mei*, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Kim Shyong Siow. Ratcheting Behavior of Sintered Copper Joints for Electronic Packaging, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2021, 2156-3950.
Ruyu Tian*, Yanhong Tian*,Yilong Huang,Dongsheng Yang, Cheng Chen, Huhao Sun. Comparative study between the Sn–Ag–Cu/ENIGand Sn–Ag–Cu/ENEPIG solder joints under extremetemperature thermal shock, Journal of Materials Science: Materials in Electronics ,2021,32,6890-6899.
Yanhong Tian*, He Zhang, Chunjin Hang, Shang Wang, Jiayun Feng, Su Ding, Yilong Huang, Recent advances in metal nanowire based transparent conductive films: Fabrication and applications, Science Foundation in China, 2020, 28(2), 85-103.
Jikai Xu, Zhihao Ren, Bowei Dong, Xinmiao Liu, Chenxi Wang*, Yanhong Tian*, Chengkuo Lee*, Nanometer-Scale Heterogeneous Interfacial Sapphire Wafer Bonding for Enabling Plasmonic-Enhanced Nanofluidic Mid-Infrared Spectroscopy, ACS Nano, 2020, 14, 9, 12159–12172.
Jikai Xu, Chenxi Wang*, Xiaoliang Ji, Qi an, Yanhong Tian*, Tadatomo Suga, Direct bonding of high dielectric oxides for high-performance transistor applications, Scripta Materiala, 2020, 178, 307-312.
Jiayun Feng , Ming Xiao, Zhuang Hui, Daozhi Shen, Yanhong Tian*, Chunjin Hang, Walter W. Duley, and Norman Y. Zhou*, High-Performance Magnesium–Carbon Nanofiber Hygroelectric Generator Based on Interface-Mediation-Enhanced Capacitive Discharging Effect, ACS Applied Materials & Interfaces, 2020, 12, 21, 24289–24297.
He Zhang, Yanhong Tian*, Shang Wang, Yilong Huang, Jiayue Wen, Chunjin Hang, Zhen Zheng, Chenxi Wang, Highly stable flexible transparent electrode via rapid electrodeposition coating of Ag-Au alloy on copper nanowires for bifunctional electrochromic and supercapacitor device, Chemical Engineering Journal, 2020, 399(20),125075.
He Zhang, Shang Wang, Yanhong Tian* , Yubin Liu, Jiayue Wen, Yilong Huang, Chunjin Hang, Zhen Zheng, Chenxi Wang, Electrodeposition fabrication of Cu@Ni core shell nanowire network for highly stable transparent conductive films, Chemical Engineering Journal, 2020, 399(6),124495.
马竟轩, 王尚，杨东升，田艳红*. 纳米银焊膏热烧结及通电热老化过程动态电阻监测研究. 机械工程学报，2020, 56(08).
Dan Li, Yunhui Mei*, Yanhong Tian, Yunchang Xin.Doping low-cost SiOx (1.2 - x - 1.6) nanoparticles inhibit electrochemical migration of sintered silver at high temperatures, Journal of Alloys and Compounds, 2020, 830,154587.
Wei Liu, Kai Zhu, Chunqing Wang*, Zhen Zheng*, Rong An, Wei Zhang, Minxi Zhu, Zhicheng Wen, Xinming Wang, Yubin Liu, Yanhong Tian. Laser induced forward transfer of brittle Cu3Sn thin film, Journal of Manufacturing Processes, 2020, 60, 48-53.
Qiushi Kang, Chenxi Wang*, Fanfan Niu, Shicheng Zhou, Xiaoyun Qi, Jikai Xu, Yanhong Tian. Single-crystalline SiC integrated onto Si-based substrates via plasma-activated direct bonding, Ceramics International, 2020,46,14, 22718-22726.
Chenxi Wang*, Hui Fang, Shicheng Zhou, Xiaoyun Qi, Fanfan Niu, Wei Zhang, Yanhong Tian, Tadatomo Suga. Recycled low-temperature direct bonding of Si/glass and glass/glass chips for detachable micro/nanofluidic devices, Journal of Materials Science & Technology, 2020,46,156-167.
Hui Fang, Chenxi Wang*, Shicheng Zhou, Ge Li, Yanhong Tian, Tadatomo Suga. Exploration of the enhanced performances for silk fibroin/sodium alginate composite coatings on biodegradable Mg-Zn-Ca alloy, Journal of Magnesium and Alloys ,2020.
Hui Fang, Chenxi Wang*, Shicheng Zhou, Qiushi Kang, Te Wang, Dongsheng Yang, Yanhong Tian, Tadatomo Suga. Rapid pressureless and low-temperature bonding of large-area power chips by sintering two-step activated Ag paste, Journal of Materials Science: Materials in Electronics ,2020,31,8.
Hui Fang, Chenxi Wang*, Shicheng Zhou, Zhen Zheng, Tian Lu, Ge Li, Yanhong Tian, Tadatomo Suga. Enhanced adhesion and anticorrosion of silk fibroin coated biodegradable Mg-Zn-Ca alloy via a two-step plasma activation, Corrosion Science,2020,168, 108466.
Jikai Xu, Yu Du, Yanhong Tian, Chenxi Wang*. Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics, International Journal of Optomechatronics, 2020,14(1):94-118.
He Zhang, Shang Wang, Yanhong Tian*, Jiayue wen, Chunjin Hang*, Zhen Zheng, Yilong Huang, Su Ding, Chenxi Wang. High efficiency extraction synthesis for high-purity copper nanaowires and their applications in flexible transparent electrodes. Nano Materials Science. 2020,2, 164-171.
Hui Fang, Chenxi Wang*, Te Wang, Hong Wang, Shicheng Zhou, Yilong Huang, Yanhong Tian, Tadatomo Suga. Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging, Materials Letters, 2019, 256,120620.
Yilong Huang, Yanhong Tian*, Chunjin Hang, Yubin Liu, Shang Wang, Miaomiao Qi, He Zhang, Jie Zhao*.Self-limited nanosoldering of silver nanowires for high-performance flexible transparent heaters [J]. ACS Applied Materials & Interfaces, 2019, 11 (24): 21850-21858.
Jiayue Wen, Yanhong Tian*, Changxiang Hao, Shang Wang, Zhipeng Mei, Weizhen Wu, Junyi Lu, Zhen Zheng, Yanqing Tian*. Fabrication of high performance printed flexible conductors by doping of polyaniline nanomaterials into silver paste. Journal of Materials Chemistry C, 2019,7: 1188.
Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, Yilong Huang, Chao Liao. Chemical and thermal robust tri-layer rGO/Ag NWs/GO composite film for wearable heaters, Composites Science and Technology, 2019, 174: 76-83.
Yilong Huang, Yanhong Tian*, Chunjin Hang, Yubin Liu, Shang Wang, Miaomiao Qi, He Zhang, Qiqi Peng.TiO2-coated core-shell Ag nanowire networks for robust and washable flexible transparent electrodes, ACS Applied Nano Materials, 2019, 2, 2456-2466.
Ruyu Tian, Chunjin Hang*, Yanhong Tian*,Yubin Liu,Bingying Wu, Jie Zhao. Interfacial intermetallic compound growth in Sn-3Ag-0.5Cu/Cu solder joints induced by stress gradient at cryogenic temperatures, Journal of Alloys and Compounds, 2019, 800: 180-190.
Jiayue Wen,Yanhong Tian*, Chunjin Hang, Zhen Zheng, He Zhang, Zhipeng Mei, Xuanyi Hu, Yanqing Tian*. Fabrication of Novel Printable Electrically Conductive Adhesives (ECAs) with Excellent Conductivity and Stability Enhanced by the Addition of Polyaniline Nanoparticles. Nanomaterials, 2019,9: 960.
Shang Wang, Yanhong Tian*, Chenxi Wang, Chunjin Hang, He Zhang, Yuan Huang, Zhen Zheng. One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors, ACS Omega, 2019, 4: 6092-6096.
Jiayun Feng, Di Erick Xu, Yanhong Tian*, Michal Mayer*. SAC305 Solder Reflow: Identification of Melting and Solidification Using In-Process Resistance Monitoring, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2019, 9: 1623-1631.
Su Ding, Yanhong Tian*.Recent progress of solution-processed Cu nanowires transparent electrodes and their applications. RSC Advance.2019,9(46):26961-26980.
Jikai Xu, Chenxi Wang*, Runbo Zhang, Ji Cheng, Ge Li, Junshan Xiang, Yanhong Tian*, VUV/O3 activated direct heterogeneous bonding towards high-performance LiNbO3-based optical devices.Applied Surface Science. 2019, 495, 143576.
Ruyu Tian, Chunjin Hang, Yanhong Tian*, Jikai Xu. Brittle fracture of Sn-37Pb solder joints induced by enhanced intermetallic compound growth under extreme temperature changes, Journal of Materials Processing Techonology, 2019, 268: 1–9.
Ruyu Tian, Chunjin Hang, Yanhong Tian*,Jiayun Feng. Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment, Journal of Alloys and Compounds, 2019, 777: 463-471.
Jikai Xu, Chenxi Wang*, Shicheng Zhou, Runbo Zhang, Yanhong Tian*,Low-temperature direct bonding of Si and quartz glass using the APTES modification. Ceramics International. 2019, 45, 16670-16675.
Jikai Xu,Chenxi Wang*, Daoyuan Li, Ji Cheng, Yiping Wang, Chunjin Hang, Yanhong Tian, Fabrication of SiC/Si, SiC/SiO2, and SiC/glass heterostructures via VUV/O3 activated direct bonding at low temperature Ceramics International. 2019, 45, 4094-4098.
Ge Cao, Xiaolan Gao, Linlin Wang, Huahua Cui, Junyi Lu, Yuan Meng, Wei Xue, Chun Cheng, Yanhong Tian*, Yanqing Tian*.Easily Synthesized Polyaniline@Cellulose Nanowhiskers Better Tune Network Structures in Ag-Based Adhesives: Examining the Improvements in Conductivity, Stability, and Flexibility. Nanomaterials, 2019, 9, 1542.
Wei Liu, Yiping Wang, Zhen Zheng*, Rong An, Yanhong Tian, Lingchao Kong, Ronglin Xu，Chunqing Wang*. Laser sintering mechanism and shear performance of Cu–Ag–Cu joints with mixed bimodal size Ag nanoparticles, 2019, 30, 7787-7793.
李跃, 田艳红*, 丛森，张伟玮. PCB组装板多器件焊点疲劳寿命跨尺度有限元计算.机械工程学报，2019, 6, 54-60.
黄圆, 杭春进,田艳红*, 王晨曦, 张贺.纳米铜银核壳焊膏脉冲电流快速烧结连接铜基板研究.机械工程学报, 2019
黄圆，田艳红*，江智， 王晨曦. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究.机械工程学报, 2017
Yilong Huang, Yayun Liu, Kareem Youssef, Kwing Tong, Yanhong Tian*, Qibing Pei*. A solution processed flexible nanocomposite substrate with efficient light extraction via periodic wrinkles for white organic light-emitting diodes, Advanced Optical Materials, 2018: 1801015
Jiayun Feng, Chunjin Hang, Yanhong Tian*, Chenxi Wang, Baolei Liu, Effect of electric current on grain orientation and mechanical properties of Cu-Sn intermetallic compounds joints, Journal of Alloys and Compounds, 2018, 753: 203-211
Shang Wang, Yanhong Tian*, Chenxi Wang*, Chunjin Hang, Communication—Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes, Journal of the Electrochemical Society, 2018, 165(9): D328-D330
Shang Wang, Yanhong Tian*, Chunjin Hang, Chenxi Wang. Cohesively enhanced electrical conductivity and thermal stability of silver nanowire networks by nickel ion bridge joining, Scientific Reports, 2018(8):5260
Jiayun Feng, Chunjin Hang, Yanhong Tian*, Baoleiliu, Chenxi Wang, Growth kinetics of Cu6Sn5 intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current, Scientific Reports, 2018(8):1775
Su Ding; Yanhong Tian*; Jinting Jiu; Katsuaki Suganuma. Highly conductive and transparent copper nanowire electrodes on surface coated flexible and heat-sensitive substrates. RSC Adv. v 8, p 2109-2115, 2018
Ruyu Tian; Chunjin Hang; Yanhong Tian*; Liyou Zhao. Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock. Materials Science ＆ Engineering A,V709, 2018, P 125-133
Chenxi Wang*,Daoyuan Li, Shang Wang, Boyan Huang, and YanhongTian, A Self-Contained Temperature Sensing Approach for Ultrafast Microwelding,Journal of the Electrochemical Society, Vol. 165, No. 5, 2018, pp. B220-B222
Chenxi Wang*, Jikai Xu, Shu Guo, Qiushi Kang, Yuan Wang, Yiping Wang, Yanhong Tian, A facile method for direct bonding of single-crystalline SiC to Si, SiO2, and glass using VUV irradiation. Applied Surface Science. 2018, 471, 196-204.
Jikai Xu, Chenxi Wang*, Yanhong Tian*, Bin Wu, Shang Wang, He Zhang, Glass-on-LiNbO 3 heterostructure formed via a two-step plasma activated low-temperature direct bonding method.Applied Surface Science. 2018, 459, 621-629.
Jikai Xu, Chenxi Wang*, Te Wang, Yuan Wang, Qiushi Kang, Yannan Liu, Yanhong Tian, Mechanisms for Low-Temperature Direct Bonding of Si/Si and Quartz/Quartz via VUV/O3 Activation, RSC Advances, Vol. 8, 2018,pp. 11528-11535.
Chenxi Wang, Jikai Xu, Xiaoyun Qi, Yannan Liu, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Direct Homo/Heterogeneous Bonding of Silicon and Glass Using Vacuum Ultraviolet Irradiation in Air, Journal of The Electrochemical Society, Vol. 165, No. 4, 2018, pp. H3093-H3098.
Chenxi Wang, Jikai Xu, Xiaorun Zeng, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, Low-Temperature Wafer Direct Bonding of Silicon and Quartz Glass by a Two-Step Wet Chemical Surface Cleaning, Japanese Journal of Applied Physics, Vol. 57, 02BD02, 2018.
Chunjin Hang, Ruyu Tian, Liyou Zhao, Yanhong Tian*, Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock, Applied Sciences, 2018, 8(11), 2056.
Chunjin Hang, He Zhang, Yanhong Tian*, Chenxi Wang, Yuan Huang, Zhen Zheng, Chunqing Wang, A Modified Interposer Fabrication Process by Copper Nano-Pillars Filled in Anodic Aluminum Oxide Film for 3D Electronic Package, Applied Sciences, 2018, 8(11), 2188.
Wei Liu, Rong An*, Chunqing Wang, Zhen Zheng, Yanhong Tian, Ronglin Xu, Zhongtao Wang, Recent Progress in Rapid Sintering of Nanosilver for Electronics Applications, Micromachinces, 2018, 9, 346.
王晨曦*, 王源，田艳红，王春青. 基于广义铺展条件下的倒装焊焊点形态预测. 焊接学报, Vol. 39, No. 2, 2018, pp. 1-4%2B14.
刘威，费义鹍，郑振，安荣，张威，王春青，田艳红，朱泯西. 激光前向转移技术及其温度场数值模拟研究. 精密成形工程, Vol. 10, No. 01, 2018.
王晨曦, 王特，许继开，王源，田艳红. 晶圆直接键合及室温键合技术研究进展. 焊接学报, 精密成形工程, Vol. 10, No. 01, 2018.
Chenxi Wang*, Yuan Wang, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Room-temperature direct bonding of silicon and quartz glass wafers. Applied Physics Letters, 2017,110: 221602- 1~4
Wei Liu, Chunqing Wang, Guangbin Dou#, Yanhong Tian, Lei Yang*. Laser-induced actuation of individual microsize liquid metal droplets on an open solid surface. Applied Physics Express
Chenxi Wang, Yannan Liu*, Yue Li*, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Mechanisms for room-temperature fluorine containing plasma activated bonding. ECS Journal of Solid State Science and Technology, 2017,6(7): 373-378
Chenxi Wang, Yue Li*, Yannan Liu*, Zhitian Yuan*, Yanhong Tian, Chunqing Wang, Tadatomo Suga#. Investigation of thermal treatment processes for dissimilar wafer bonding. ECS Transactions, 2017, 77(5): 143-152
Ruyu Tian, Yanhong Tian*, Chenxi Wang, Liyou Zhao. Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures. Materials Science ＆ Engineering A, v 684, p 697-705, 2017
Baolei Liu; Yanhong Tian*; Jiang Feng; Chenxi Wang. Enhanced shear strength of Cu–Sn intermetallic interconnects with interlocking dendrites under fluxless electric current-assisted bonding process. J Mater Sci, v 52, p 1943-1954, 2017
Baolei Liu; Yanhong Tian*; An Rong; Chunqing Wang. Ultrafast formation of unidirectional and reliable Cu3Sn-based intermetallic joints assisted by electric current. Intermetallics, v 80, p 26-32, 2017
Jiayue Wen; Yanhong Tian*; Zhipeng Mei; Weizhen Wu; Yanqing Tian. Synthesis of polypyrrole nanoparticles and their applications in electrically conductive adhesives for improving conductivity. RSC Adv., v 7, p 53219, 2017
Chenxi Wang, Yuan Wang, Yanhong Tian, Chunqing Wang, andTadatomo Suga, “Room-Temperature Direct Bonding of Silicon and Quartz Glass Wafers”, Applied Physics Letters, Vol. 110, 221602, 2017.
Chenxi Wang, Yannan Liu, Yue Li, Yanhong Tian, Chunqing Wang, and Tadatomo Suga, “Mechanisms for Room-Temperature Fluorine Containing Plasma Activated Bonding”, ECS Journal of Solid State Science and Technology, Vol. 6, No. 7, 2017, pp. P373-P378.
王尚; 田艳红*. 微纳连接技术研究进展. 材料科学与工艺, 2017，25（5):1-5
田茹玉, 王晨曦, 田艳红*, 赵利有. 极限温度下 CBGA 焊点热冲击疲劳寿命预测. 焊接学报, 2017, 38(10): 93-97.
黄圆; 田艳红*; 江智; 王晨曦. 脉冲电流快速烧结纳米铜焊膏连接铜镍基板研究. 机械工程学报, v 53(4),:34-42 2017
Yilong Huang*; Ziyang Xiu#; Gaohui Wu; Yanhong Tian; Peng He. Sn-3.0Ag-0.5Cu nanocomposite solders reinforced by graphene nanosheets. Journal of Materials Science: materials in Electronics, 27: 6809- 6815, 2016
Yilong Huang, Ziyang Xiu, Gaohui Wu, Yanhong Tian, Peng He, Xiaolong Gu, Weimin Long. Improving shear strength of Sn-3.0Ag-0.5Cu/Cu joints and suppressing intermetallic compounds layer growth by adding graphene nanosheets. Materials Letters, 169:262-264, 2016
王晨曦, 安荣, 田艳红，王春青. 镀银的铜引线与PCB焊盘平行微隙焊时的界面行为. 焊接学报, Vol. 37, No. 11, 2016, pp. 55-58.
Shang Wang, Yanhong Tian*, Chunqing Wang. The role of chloride ions in rapid synthesis of ultra-long silver nanowires for flexible electrodes 2016
Shang Wang, Yanhong Tian*, Su Ding, Yilong Huang. Rapid synthesis of long silver nanowires by controlling concentration of Cu2%2B ions. Materials Letters, v 172, p 175-178, 2016
江智, 田艳红; 丁苏. Sn3.5Ag0.5Cu 纳米颗粒钎料制备及钎焊机理. 金属学报, v 52, n 1, p 105-112, 2016
Baolei Liu, Yanhong Tian*,Wei Liu, Weiwei Wu, Chunqing Wang. TEM observation of interfacial compounds of Sn Ag Cu/ENIG solder bump after laser soldering and subsequent hot air reflows. Materials Letters, v 163, p 254-257, 2016
Baolei Liu, Yanhong Tian*, Jingkai Qin, Rong An. Degradation behaviors of micro ball grid array (μBGA) solder joints under the coupled effects of electromigration and thermal stress. J Mater Sci: Mater Electron, v 27, p 11583-11592, 2016
Baolei Liu, Yanhong Tian*, Chenxi Wang, Rong An, Yang Liu. Extremely fast formation of Cue Sn intermetallic compounds in Cu/Sn/Cu system via a micro-resistance spot welding process. Journal of Alloys and Compounds, v 687, p 667-673, 2016
Yanhong Tian*, Zhi Jiang, Chenxi Wang, Su Ding. Sintering mechanism of the Cu–Ag core–shell nanoparticle paste at low temperature in ambient air. RSC Adv. v 6, p 91783-91790, 2016
Zhi Jiang,Yanhong Tian*,Su Ding,Jiayue Wen,Chenxi Wang. Facile synthesis of Cu–Ag hybrid nanowires with strong surface-enhanced Raman scattering sensitivity. CrystEngComm, v 18, p 1200-1206,2016
Su Ding,Jinting Jiu,Yue Gao,Yanhong, Tian*,Teppei Araki. One-Step Fabrication of Stretchable Copper Nanowire Conductors by a Fast Photonic Sintering Technique and Its Application in Wearable Devices. 2016, ACS Appl. Mater. Interfaces
Haihong Li*, Rong An, Chunqing Wang, Yanhong Tian, Zhi Jiang.Effect of Cu grain size onthe voiding propensity at the interface of SnAgCu/Cu solder joints. Materials Letters, 144: 97-99,2015
Wei Liu, Rong An, ChunqingWang, Yanhong Tian. Effect of Au-Sn IMCs’formation and morphologies on shear properties of laser reflowed micro-solderjoints. Soldering & Surface Mount Technology, 27(1): 45-51,2015
Chao Zeng, Chunqing Wang, Yanhong Tian, Chunjin Hang, Wei Liu,Rong An. Fracture Statistics Dominated by Hot-Cutting Defect and Deviation from Weibull Distribution. Journal of Harbin Institute of Technology (New Series), 22(2): 41-48, 2015
Su, Ding, Jinting, Jiu*, Yanhong Tian*, Tohru Sugahara, Shijo Nagao, Katsuaki Suganuma. Fast fabrication of copper nanowire transparent electrodes by a high intensity pulsed light sintering technique in air. Physical Chemistry Chemical Physics, v 17, p 31110-31116, 2015
Su, Ding, Yanhong, Tian*, Zhi, Jiang, Xiaobin, He. Molecular dynamics simulation of joining process of Ag-Au nanowires and mechanical properties of the hybrid nanojoint. AIP Advances, v ,5, 057120, 2015
Su Ding, Yanhong Tian*, Zhi Jiang, Chunqing Wang. Joining of silver nanowires by femtosecond laser methods. Materials Transactions, v 56, p 981-983, 2015
Ying, Ding, Ruyu Tian, Xiuli Wang, Chunjin Hang, Fang Yu, Ling Zhou, Xiangang Meng, Yanhong Tian*. Coupling Effects of Mechanical Vibrations and Thermal Cycling on Reliability of CCGA Solder Joints. Microelectronics Reliability, v 55, n 11, p 2396-2402, 2015
Rong An, Yanhong Tian, Rui Zhang, Chunqing Wang. Electromigration-induced intermetallic growth and voids formation in symmetrical Cu/Sn/Cu and Cu/Intermetallic compounds (IMCs)/Cu joints. Journal of Materials Science: Materials in Electronics, v 26, p 2674-2681, 2015
Yanhong Tian*; Chunjin Hang, Xin Zhao, Baolei Liu, Ning Wang, Chunqing, Wang. Phase transformation and fracture behavior of Cu/In/Cu joints formed by solid-liquid interdiffusion bonding. Journal of Materials Science: Materials in Electronics, v 25, p 4170-4178, 2014
Zhi, Jiang; Yanhong, Tian*; Su, Ding. Synthesis andcharacterization of ultra-long and pencil-like copper nanowires with a penta-twinned structure by hydrothermal method. Materials Letters, v 136, p 310-313, 2014
Yanhong, Tian*; Rui, Zhang; Chunjin, Hang; Lina, Niu; Chunqing, Wang. Relationship between morphologies and orientatios of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads. Materials Characterizaton, v 88, p 58-68, 2014
Rui, Zhang; Yanhong, Tian*; Chunjin, Hang; Baolei, Liu; Chunqing Wang. Formation mechanism and orientation of Cu3Sn grains in Cu-Sn intermetallic compound joints. Materials Letters, v 110, p 137-140, 2013
Chunjin, Hang; Yanhong, Tian*; Rui Zhang; Dongsheng Yang. Phase transformation and grain orientation of Cu-Sn intemetallic compounds during low temperature bonding process. Journals of Materials Science: Materials in Electronics, v 24, n 10, p 3905-3913, 2013
Wei Liu; Yanhong Tian; Chunqing Wang; Lining Sun. Formation of AuSnx IMCs in Sn3.5Ag0.75Cu micro-solder joints fabricated by laser and hot air reflow process. Journal of Materials Science: Materials in Electronics, v 24, p 217-223, 2013
Yang, Lei; Liu, Wei; Wang, Chunqing; Tian, Yanhong. Surface-Tension-Driven Self-Assembly of 3-D Microcompounds by Using Laser Reflow Soldering and Wire Limiting Mechanisms. IEEE Transactions on Components Packaging and Manufacturing Technology, v 3, n 1, p 168-176, 2013
田艳红*，贺晓斌，杭春进. 残余应力对混合组装BGA热循环可靠性影响，机械工程学报 2013
杭春进，田艳红*，赵鑫，王春青. 混装BGA器件高温老化实验焊点微观组织研究，金属学报 v 7, n 49, p 831-837, 2013
杭春进，田艳红*，王春青. 细径铜丝超声键合焊点高温存储可靠性分析，焊接学报 v 2, n 34, p 13-16, 2013
刘威，窦广彬，王春青，田艳红，叶交托. 激光诱发前向转移技术在电子制造领域的应用，电子工艺技术 v 2, n 34, p 70-72, 2013
Tian, Yanhong*; Liu,Wei; An, Rong; Zhang, Wei; Niu, Lina; Wang, Chunqing. Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test. Journal of Materials Science: Materials in Electronics, v 23, n 1, p 136-147, 2012
Liu,Wei; Tian, Yanhong*; Wang, Chunqing; Wang, Xuelin; Liu, Ruiyang.Morphologies and grain orientations of CuSn intermetallic compounds in Sn3.0Ag0.5Cu/Cu solder joints. Materials Letters, v 86, p 157-160, 2012
Chunjin Hang; Yanhong Tian*; Chunqing Wang; Ning Wang. Ultrasonic Bondability and Antioxidation Property of Ti/Cu/TaN/Ag Multi-layers on Si Substrate. Thin Solid Films, v 524, p 224-228, 2012
Liu,Wei; Tian, Yanhong; Yang, Lei; Wang, Chunqing; Sun, Lining.Oxidation and Au-Sn reaction of laser reflowed micro-solder joints protected by N2 or exposed to air atmosphere. Soldering and Surface Mount Technology, v 24, n 3, p 191-196, 2012
田艳红*,王宁,杨东升,王春青. 三维封装芯片键合IMC焊点应力分析及结构优化,焊接学报,2012,33(8):1-3.
Yanhong Tian*, Chunjin Hang, Chunqing Wang, Shihua Yang, Pengrong Lin.Effects of bump size on deformation and fracture behavior of Sn3.0Ag0.5Cu/Cu solder joints during shear testing. Materials Science and Engineering A 529 (2011) 468– 478
Yanhong Tian*, C J Hang, C Q Wang,G. Q Ouyang, J P Zhao. Reliability and failure analysis of fine copper wire bonds encapsulated with commercial epoxy molding compound Microelectronics Reliability, 2011(1):157-165
田艳红*； 杨东升； 王春青 细Cu丝超声球焊烧球工艺参数优化及Cu球组织分析. 焊接学报 2011,31(1): pp 1-4
王春青，王学林，田艳红，SnAgCu无铅微焊点剪切力学性能的体积效应，焊接学报，第32卷 第4期，2011年4月p1-4
田艳红*，王春青，赵少伟. Cu焊盘TiN/Ag金属化层超声键合性能及抗氧化性能.金属学报2010,5(46):618-622
田艳红*，王春青，杨世华. Sn3.0Ag0.5Cu/Cu无铅焊点剪切断裂行为的体积效应. 金属学报. 2010,3(46):366-371
Shihua Yang, Yanhong Tian*, Chunqing Wang, Investigation on Sn grain number and crystal orientation in the Sn-Ag-Cu/Cu solder joints of different sizes. Journal of Materials Science-Materials in Electronics 2010(21):1174-1180
Dewen Tian, Yanhong Tian*, Chunqing Wang.Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface, Journal of Materials Science 2009,44(7), pp 1772-1779
Dewen Tian, Chunqing Wang, Yanhong Tian. Modeling of Micropitch Shift of a Magnetoelectrical Sensor During Laser Solder Ball Bonding Process. IEEE Transactions on Advanced Packaging 2009,32(1)::p136-145
黄腾飞，杨世华，牛丽娜，田艳红，王春青，含有限晶粒的微小接头的拉伸变形行为研究，电子工艺技术，2009年第6期
刘琪 ，李卫 ，田艳红 气孔缺陷对同轴电缆焊点热疲劳寿命影响，电子工艺技术，2009年9月
Yanhong Tian*, Chunqing Wang, J.P.Jung, Ivan Lum, N.Zhou. Investigation of ultrasonic copper wire wedge bonding on Au/Ni plated Cu substrates at ambient temperature. Journal of materials processing technology, 2008,208(1-3) 179-186
Yanhong Tian*, Chunqing Wang, Y.Zhou. Finite element modeling of electron beam welding of a large complex Al alloy structure by parallel computations. Journal of materials processing technology 2008(199):p41-48
Yanhong Tian*, Chunqing Wang, Yarong Chen. Characteristics of Laser Reflow Bumping of Sn3.5Ag and Sn3.5Ag0.5Cu Lead-Free Solder Balls. J. Mater. Sci. Technol. 2008,24(2) :p220-226
Yanhong Tian*, Chunqing Wang. Bonding mechanism of ultrasonic wedge bonding of copper wire on Au/Ni/Cu substrate. Transactions of Nonferrous Metals Society of China 2008,18(2): 132-137
Dewen Tian, Yanhong Tian*, Chunqing Wang and Chunjin Hang. Three-dimensional modelling of solder droplet impact onto a groove. JOURNAL OF PHYSICS D: APPLIED PHYSICS. 41 (2008) 245503 (12pp)
Ying Ding, Chunqing Wang, Yanhong Tian. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in In-situ tensile test. Journal of Alloys and Compounds 2008 31(1) 274-285
Chunjin Hang, Chunqing Wang, Yanhong Tian. Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging. Microelectronics Reliability 48 (2008):p416–424
Wei Liu, Chunqing Wang, Yanhong Tian. Investigation of sagging phenomenon observed in laser reflow soldering right-angled solder joints during isothermal aging or thermal cycle process. Journal of Alloys and Compounds 2008, 458(1-2):323-329
Chunjin Hang, Chunqing Wang, Yanhong Tian. Microstructural study of copper free air balls in thermosonic wire bonding. Microelectronic Engineering 2008(85): 1815-1819
Rong An, Chunqing Wang, Yanhong Tian. Determination of the Elastic Properties of Au5Sn and AuSn from Ab Initio Calculations Journal of ELECTRONIC MATERIALS Vol.37,No.7,2008
Rong An, Chunqing Wang, Yanhong Tian Determination of the Elastic Properties of Cu3Sn Through First-Principles Calculations. Journal of ELECTRONIC MATERIALS Vol. 37, No. 4, 2008: 477- 482
Wei Zhang, Chunqing Wang, Yanhong Tian Numerical and experimental analysis of solder joint self-alignment in fiber attachment soldering Journal of Electronic Packaging, Transactions of the ASME 2008(130):91-99
Fuqian Li, Chunqing Wang, Yanhong Tian. Investigation of interfacial reaction between eutectic Sn–Pb solder droplet and Au/Ni/Cu pad. Materials Science and Technology 2008 （24）: 6
Dewen Tian, Chunqing Wang, Yanhong Tian. Effect of solidification on solder bump formation in solder jet process: Simulation and experiment. Trans. Nonferrous Met. Soc. China.18(2008) 1201-1208
W Liu, C Q Wang, Y H Tian, Y R Chen. Effect of Zn addition in Sn-rich alloys on interfacial reaction with Au foils. Trans. Nonferrous Met. Soc. China. 18(2008) 617-622
田德文，田艳红，王春青，孔令超均匀钎料熔滴喷射装置设计，机械工程学报，2008年12期
田德文，田艳红，王春青。 面向MEMS封装的微钎料球键合技术，电子工业专用设备，2008年37卷5期
韩磊磊，王春青，田艳红，一种白光LED投射灯组装结构的热分析，电子工艺技术，2008年第5期
鲁凯，王春青，田艳红，Cu引线超声键合FAB工艺及影响研究，电子工艺技术，2008年第4期
曾超，王春青 田艳红，孔令超，热切缺陷对氧化铝陶瓷强度的影响，宇航材料与工艺，2008年第2期
杭春进，王春青，田艳红，张丞，塑料封装铜丝内连电子元器件开封新工艺研究，电子工艺技术，2008年1期
TIAN Yanhong, WANG Chunqing, and :Liu Wei. Effects of Cu addition on growth of Au-Sn intermetallic compounds at Sn-xCu/Au interface during aging process. RARE METALS Vol.26,S pecI.s sueA, ug2007p, .331- 337
Ding, Ying; Wang, Chunqing; Tian, Yanhong; Li, Mingyu. Influence of aging treatment on deformation behavior of 96.5Sn3.5Ag lead-free solder alloy during in situ tensile tests. Journal of Alloys and Compounds, v 428, n 1-2, Jan 31, 2007, p 274-285
H.T. Chen, C.Q. Wang, Cheng.Y, and Y. Huang, Y.H. Tian. Effects of solder volume on formation and redeposition of Au-containing intermetallics in Au/Ni-SnAgCu-Ni(P) solder joints, Journal of electronic materials , Vol.36 No.1(2007) 26-32
Yanhong Tian, Chunqing WANG and Danyang ZHU. Shape Prediction and Reliability Design of Ball Grid Array Solder Joints. Key Engineering Materials Vols. 353-358 (2007)
Yanhong Tian and Chunqing WANG. Modeling of the Temperature Field during Electron Beam Welding of Aluminum Alloy by a Pre-defined Keyhole. Key Engineering Materials Vols. 353-358 (2007)
Hang Chunjin, Wang Chunqing and Tian Yanhong. Effect of ultrasonic power and bonding force on the bonding strength of copper ball bonds, China Welding. Vol.16 No.3 Sep. 2007:46-50
刁慧，王春青，赵振清，田艳红，孔令超. SnCu钎料镀层与Cu/Ni镀层钎焊接头的界面反应. 中国有色金属学报. Vol.17 No.3 2007:410-416
田艳红，王春青，孔令超. 激光键合技术在封装中的应用及研究进展. 电子工业专用设备. May. 2007（总第148 期）
Ying Ding, Chunqing Wang, Yanhong Tian, and Binbin Zhang. In-situ observation on microfracture behavior ahead of the crack tip in 63Sn37Pb solder alloy.Metallurgical and Materials Transactions A. Vol. 37A, March, 2006, pp. 1017-1025
王春青，田艳红，孔令超。电子封装与组装无铅化应用中的问题，半导体行业，2006年12月第75期:46-51
Hongtao CHEN, Chunqing WANG, Mingyu LI, Yanhong TIAN, Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability, Journal of Materials Science and Engineering, 2005 Vol.21 No.3 P.419-422
李福泉，王春青，田艳红，孔令超，钎料熔滴与焊盘界面反应及再重熔时的界面组织演变，中国有色金属学报，第15卷第10期：1506-1511，2005年
周文凡，田艳红，王春青，BGA焊点的形态预测与可靠性优化设计，电子工艺技术，26卷第4期，2005年7月:p187-191
Yanhong Tian, Chunqing Wang, Deming Liu. Thermomechanical Bechavior of PBGA Package during Laser and Hot Air Reflow Soldering. MODELLING AND SIMULATION IN MATERIALS SCIENCE AND ENGINEERING, 2004, (12): 235 – 243
李福泉，王春青，田德文，田艳红，SnPb 钎料熔滴与 Au/Ni/Cu 焊盘的反应过程，中国有色金属学报，2004年7月，14卷第7期 :p1139-1143
王春青，李明雨，田艳红，JIS Z 3198 无铅钎料试验方法简介与评述，电子工艺技术，2004 年第 2 期 :pp47-54
Yanhong Tian, Chunqing Wang, Xiaodong Zhang and Deming Liu, Interaction Kinetics between PBGA Solder Balls and Au/Ni/Cu Metallisation during Laser Reflow Bumping, Soldering & Surface Mount Technology, Vol.15 No.2, 2003:pp17-21(Awarded by Emerald Literati Club, 2004 Highly Commended Award)
丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测 -I. 焊点抗热疲劳能力的实验研究，金属学报，第39卷，第8期，2003年:879-884
丁颖、王春青、田艳红，通孔元件焊点的抗热疲劳性能预测 -II. 焊点内部力学响应特征的数值模拟，金属学报，第39卷，第8期，2003年 :885-891
Tian, Yanhong; Wang, Chunqing; Ge, Xiushan; Liu, Peter; Liu, Deming, Intermetallic compounds formation at interface between PBGA solder ball and Au/Ni/Cu/BT PCB substrate after laser reflow processes,Materials Science and Engineering: B Volume: 95, Issue: 3 Sep. 1, 2002 pp. 254-262
田艳红，王春青，激光重熔 PBGA 钎料球与 Au/Ni/Cu 焊盘界面反应，金属学报，2002;38(1):95-98
田艳红，王春青. 激光与红外重熔对 63Sn37Pb/ 焊盘界面微观组织的影响，中国有色金属学报，2002 年，第 12 卷第 3 期 :471-475
田艳红，王春青，微电子封装与组装中的再流焊技术研究进展，焊接，2002 年第 6 期： 5-9
田艳红，王春青，张哓东，激光加热条件下 SnPb 共晶钎料与 Au/Ni/Cu 焊盘界面反应动力学，材料科学与工艺，Vol.10 No.2, Jun. 2002:pp136-139
田艳红，王春青. 激光重熔在钎料凸点成形中的应用，电子工艺技术，2002 年，第 23 卷第 4 期： 139-142
田艳红，王春青，钎料球激光重熔温度场数值模拟，焊接学报，2001 年第 2 期： P75-78.
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