刘洋 - 哈尔滨理工大学 - 材料科学与工程学院

个人简介

教育背景： 2003.9-2007.6 兰州大学材料化学学士 2007.9-2010.4 哈尔滨理工大学材料加工工程硕士 2009.9-2012.8 哈尔滨理工大学材料学博士工作经历： 2012.9 至今哈尔滨理工大学材料科学与工程学院讲师 2015.12至今哈尔滨理工大学工程电介质教育部重点实验室博士后 2013.2-2015.2 荷兰代尔夫特理工大学北京研究中心博士后 2013.2-2015.2 半导体照明联合创新国家重点实验室常州基地项目经理助理

研究领域

微电子封装及微连接技术、LED封装及可靠性

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

1. Liu Y, Fu H, Sun F, et al. Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes. Journal of Materials Processing Technology, 2016, 238: 290-296. (SCI, EI) 2. Y Liu, H Zhang, F Sun. Solderability of SnBi-nano Cu solder pastes and microstructure of the solder joints. Journal of Materials Science: Materials in Electronics. 2016, 27 (3): 2235-2241. (SCI, EI) 3. Y Liu, F Sun, CA Yuan, G Zhang. Thermal Analysis of Chip-on-Flexible LED Packages with Cu Heat Sinks by SnBiSoldering. Microelectronics International. 2016, 33 (1): 42-46. (SCI, EI) 4. Y Liu, F Sun, L Luo, CA Yuan, G Zhang. Microstructure Evolution and Shear Behavior of the Solder Joints for Flip-chip LED on ENIG Substrate. Journal of Electronic materials. 2015: 1-8. (SCI, EI) 5. Y Liu, F Sun, H Zhang, T Xin, CA Yuan, G Zhang. Interfacial Reaction and Failure Mode Analysis of the Solder Joints for Flip-chip LED on ENIG and Cu-OSP Substrates. Microelectronics Reliability. 2015, 55(8): 1234–1240. (SCI, EI) 6. Y Liu, J Meerwijk, L Luo, H Zhang, F Sun, CA Yuan, G Zhang. Formation and evolution of intermetallic layer structures at SAC305/Ag/Cu and SAC0705-Bi-Ni/Ag/Cu solder joint interfaces after reflow and aging. Journal of Materials Science: Materials in Electronics. 2014, 25(11): 4954-4959. (SCI, EI) 7. Y Liu, SYY Leung, J Zhao, CKY Wong, CA Yuan, G Zhang, F Sun, L Luo. Thermal and mechanical effects of voids within flip chip soldering in LED packages. Microelectronics Reliability. 2014, 54(9): 2028-2033 (SCI, EI) 8. Y Liu, J Zhao, CCA Yuan, GQ Zhang, F Sun. Chip-on-Flexible Packaging for High-Power Flip-Chip Light-Emitting Diode by AuSn and SAC Soldering. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 2014, 4(11): 1754-1759 (SCI, EI) 9. Y Liu, F Sun, X Li. Effect of Ni, Bi concentration on the microstructure and shear behavior of low-Ag SAC–Bi–Ni/Cu solder joints. Journal of Materials Science: Materials in Electronics. 2014, 25(6): 2627-2633. (SCI, EI) 10. Liu Y, Sun F. Characterization of interfacial IMCs in low-Ag Sn-Ag-xCu-Bi-Ni solder joints. Journal of Materials Science: Materials in Electronics, 2013, 24(1): 290-294. (SCI, EI) 11. Y Liu, F Sun, et al. Solderability, IMC Evolution, and Shear Behavior of Low-Ag Sn0.7Ag0.5Cu-BiNi/Cu Solder Joint. Journal of Materials Science: Materials in Electronics, 2012, 23(9): 1705-1710. (SCI, EI) 12. Y Liu, SYY Leung, CKY Wong, CA Yuan, G Zhang, F Sun. Thermal Simulation of Flexible LED Package Enhanced with Copper Pillars. Journal of Semiconductors. 2015, (006): 85-88. (EI) 13. 刘洋, 孙凤莲. Ni、Bi 元素对SnAgCu 钎焊界面IMC 生长速率的影响. 中国有色金属学报, 2012, 22(2): 460-464. (EI) (《中国有色金属学报》2014年度优秀论文) 14. 刘洋, 孙凤莲, 王家兵. Ag元素含量对Sn-Ag-Cu钎料焊接性的影响.焊接学报, 2011, 32(4): 25-28. (EI)