刘洋 - 哈尔滨理工大学 - 材料科学与工程学院

个人简介

工作经历 2014年3月至今哈尔滨理工大学材料成型系副主任 2013年7月-至今哈尔滨理工大学材料成型系副教授 2009年7月-2013年6月哈尔滨理工大学材料成型系讲师 2008年10月-2009年10月荷兰NXP Semiconductor封装可靠性研究中心合作研究员 2007年7月-2009年6月哈尔滨理工大学材料成型系助教学习经历 2007年9月-2012年8月哈尔滨理工大学材料学博士 2004年9月-2007年4月哈尔滨理工大学材料加工工程硕士 2000年9月-2004年7月哈尔滨理工大学材料成型控制工程学士

研究领域

微电子封装用互连材料开发；多场耦合条件下板级封装微焊点的损伤机制; 材料加工过程数值模拟及工艺优化

近期论文

查看导师新发文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Zhang, H., Liu, Y., Wang, J., and Sun, F., “Failure study of solder joints subjected to random vibration loading at different temperatures,” Journal of Materials Science: Materials in Electronics, 2015, 26(4): 2374-2379. Zhang, H., Liu, Y., Wang, J., and Sun, F., “Effect of elevated temperature on PCB responses and solder interconnect reliability under vibration loading,” Microelectronics Reliability, 2015, 55(11): 2391-2395. Liu, Y., Sun, F., Zhang, H., Wang, J., and Zhou, Z., “Evaluating board level solder interconnects reliability using vibration test methods,” Microelectronics Reliability, 2014, 54(9): 2053-2057. Li, X., Sun, F., Liu, Y., Zhang, H., and Xin, T., “Geometrical size effect on the interface diffusion of micro solder joint in electro-thermal coupling aging,” Journal of Materials Science: Materials in Electronics, 2014, 25(9): 3742-3746. Li, X., Sun, F., Liu, Y., Zhang, H., and Xin, T., “IMC Growth and Element Diffusion in Cu/SAC305/Cu Interconnect under Electric-thermal Coupling,” Rare Metal Materials and Engineering, 2014, 43(12): 3047-3051. 刘洋，孙凤莲，张洪武，周真，秦勇，“板级封装焊点的振动冲击加速失效方法研究,”振动与冲击，32卷, 2013年第7期 Liu,Y., Sun F., Correlating Solder Interconnects Failure with PCBs Response during Board Level Drop Impact Test, China Welding, vol.21 (2), 2012 Liu, Y., Kessels F., van Driel W., van Driel, J., Sun, F., and Zhang, G., “Comparing drop impact test method using strain gauge measurements,” Microelectronics Reliability, 2009, 49(9): 1299-1303 Liu, Y., Sun, F., Zhang, H., Zhou, Z., Qin Y., “Harmonic vibration test for accelerated reliability assessment of board level packaging,” Proc., IEEE, International Forum on Strategic Technology(IFOST), Tomsk, Siberia, Russia, Sep., 2012. Sun, F., Liu, Y., Wang, Y., and Zou, P., “The Effect of Cu Content on Performance of SnAgCuBiNi/Cu Soldering,” Proc. ASM, International Brazing and Soldering Conference (IBSC), Las Vegas, NV, USA, April, 2012 Liu, Y., Sun, F., Kessels, F., van Driel W., and Zhang, G., “The effects of response features on failure modes of board level drop impact test,” Proc. IEEE, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi’an, China, Aug., 2010 Liu, Y., Sun, F., and Liu X., “Improving Sn-0.3Ag-0.7Cu low-Ag lead-free solder performance by adding Bi element,” Proc., IEEE, International Forum on Strategic Technology(IFOST), Ulsan, South Korea, Oct., 2010. Zhang, H., Sun, F., and Liu, Y., “Effects of adding some elements on solderability of Sn-0.7Ag-0.5Cu solder,” Proc. IEEE, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Xi’an, China, Aug., 2010 Wang, L., Sun, F., Liu, Y., and Wang, L., “Effect of Ni addition on the Sn-0.3Ag-0.7Cu solder joints,” Proc. IEEE, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, Aug., 2009. Liu, Y., Sun, F., Yan, T., and Hu, W., “Effects of Bi and Ni addition on wettability and melting point of Sn-0.3Ag-0.7Cu Low-Ag Pb-free solder,” Proc. IEEE, International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Shanghai, China, Aug., 2008. Sun, F., Liu, Y., and Wang, L., “Numerical Simulation of Creep Strain of PBGA Solders under Thermal Cycling,” Proc. IEEE, Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems (Eurosime), London, UK, April, 2007.