李卓霖 - 哈尔滨工业大学（威海）

个人简介

李卓霖，博士，副教授，硕士生导师。主要从事电子器件先进封装技术，先进材料与异种材料连接；包括超声辅助钎焊连接基础理论和应用研究等。在《Scripta Materialia》、《Ultrasonics Sonochemistry》、《Surfaces and Interfaces》、《Metallurgical & Materials Transactions A》、《Ceramics International》、《Journal of the American Ceramic Society》、《Journal of Materials Science & Technology》等发表SCI论文20余篇。工作经历 2019.11-至今副教授哈尔滨工业大学（威海） 2014.09-2019.11 讲师哈尔滨工业大学（威海）教育经历 2009.09-2014.6 材料加工工程哈尔滨工业大学博士 2007.09-2009.06 材料加工工程哈尔滨工业大学硕士 2003.09-2007.06 材料加工工程吉林大学学士

研究领域

主要从事电子器件先进封装技术，先进材料与异种材料连接；包括超声辅助钎焊连接基础理论和应用研究等

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

Surface patterning of ZrO2 ceramicsnum using Sn-Al Alloy at a low temperature Jian Wang；Hongjie Dong；Zhuolin Li；Xiaoguo Song；Jicai Feng 2023-07 期刊名称《Materials Today Communications》 In-situ formation of amorphous Al2O3 interphase during ultrasonic-assisted soldering process of ZrO2 ceramic and 1060Al using Sn filler at low temperature Hongjie Dong；Shoujing Wei；Zhuolin Li；Xiaoguo Song；Wengxiong He；Jicai Feng 2022-11 期刊名称《Surfaces and Interfaces》 Room-temperature direct bonding of ZrO2 ceramic and SiCP/Al composite using ultrasonic waves Hongjie Dong；Shoujing Wei；Zhuolin Li；XIaoguo Song；Wenxiong He；Jicai Feng 2022-09 期刊名称《Ceramics International》 Bonding mechanism of ultrasonically soldered silica glasses using tin-titanium solder filler Xiaowei Wu; Zhuolin Li ; Xiaoguo Song; Hongjie Dong; Xiaoyu Yang; Yuanliang Li; Shoujing Wei; Junhong Fu 2021-12-15 期刊名称《Materials Letters》 A comparative study on the microstructure and mechanical properties of Cu6Sn5 and Cu3Sn joints formed by the TLP soldering without/with the assistance of ultrasonic waves Hongyun Zhao; Jihou Liu; Zhuolin Li*; Xiaoguo Song; Yixuan Zhao; Hongwei Niu; Hao Tian; Hongjie Dong; Jicai Feng 2018-05-10 期刊名称《Metallurgical and Materials Transactions A》 Low‐temperature ultrasound‐activated joining of ZrO2 ceramics using Sn–Al–Cu solder Hongjie Dong; Zhuolin Li;Xiaoguo Song; Xiajun Guo; Yongxu Luo; Tiansheng Bai; Shoujing Wei; Hongyun Zhao; J.C. Yan; Jicai Feng 2019-03-15 期刊名称《Journal of The American Ceramic Society》 The nucleation-controlled intermetallic grain refinement of Cu-Sn solid-liquid interdiffusion wafer bonding joints induced by addition of Ni particles Zhuolin Li; Hao Tian; Hongjie Dong; Xiajun Guo; Xiaoguo Song; Hongyun Zhao; Jicai Feng 2018-12-28 期刊名称《Scripta Materialia》 Grain morphology evolution and mechanical strength change of intermetallic joints formed in Ni/Sn/Cu system with variety of transient liquid phase soldering temperatures Hongjie Dong; Zhuolin Li; Xiaoguo Song; Hongyun Zhao; Hao Tian; Jihou Liu; Jiuchun Yan 2017-8-31 期刊名称《Materials Science & Engineering A》 Grain morphology and mechanical strength of high-meltingtemperature intermetallic joints formed in asymmetrical Ni/Sn/Cu system using transient liquid phase soldering process Hongjie Dong; Zhuolin Li; Xiaoguo Song; Hongyun Zhao; Jiuchun Yan; Hao Tian; Jihou Liu 2017-6-30 期刊名称《Journal of Alloys and Compounds》 Homogeneous (Cu, Ni)6Sn5 intermetallic compound joints rapidly formed in asymmetrical Ni/Sn/Cu system using ultrasound-induced transient liquid phase soldering process Zhuolin Li; Hongjie Dong; Xiaoguo Song; Hongyun Zhao; Hao Tian; Jihou Liu; Jicai Feng; Jiuchun Yan 2017-12-5 期刊名称《Ultrasonics Sonochemistry》 Microstructure evolution, grain morphology variation and mechanical property change of Cu-Sn intermetallic joints subjected to high-temperature aging Jihou Liu; Hongyun Zhao; Zhuolin Li; Xiaoguo Song; Yixuan Zhao; Hongwei Niu; Hao Tian; Hongjie Dong; Jicai Feng 2017-11-20 期刊名称《Materials Characterization》 Rapid formation of Ni3Sn4 joints for die attachment of SiC-based high temperature power devices using ultrasound-induced transient liquid phase bonding process Zhuolin Li; Hongjie Dong; Xiaoguo Song; Hongyun Zhao; Jicai Feng; Jihou Liu; Hao Tian; Shijie Wang 2016-12-20 期刊名称《Ultrasonics Sonochemistry》 Non-interfacial growth of Cu3Sn in Cu/Sn/Cu joints during ultrasonic-assisted transient liquid phase soldering process Hongyun Zhao; Jihou Liu; Zhuolin Li; Yixuan Zhao; Hongwei Niu; Xiaoguo Song; Hongjie Dong 2016-10-07 期刊名称《Materials Letters》 Study on the microstructure and mechanical properties of Cu-Sn intermetallic joints rapidly formed by ultrasonic-assisted transient liquid phase soldering Jihou Liu; Hongyun Zhao; Zhuolin Li; Xiaoguo Song; Hongjie Dong; Yixuan Zhao; Jicai Feng 2016-09-04 期刊名称《Journal of Alloys and Compounds》 Ultrarapid formation of homogeneous Cu6Sn5 and Cu3Sn intermetallic compound joints at room temperature using ultrasonic waves Zhuolin Li; Mingyu Li; Yong Xiao; Chunqing Wang 2013-10-17 期刊名称《Ultrasonics Sonochemistry》 Rapid formation of Cu/Cu3Sn/Cu joints using ultrasonic bonding process at ambient temperature Minyu Li; Zhuolin Li; Yong Xiao; Chunqing Wang 2013-10-14 期刊名称《Applied Physics Letters》 Cu/Sn/Cu超声-TLP接头的显微组织与力学性能刘积厚; 赵洪运; 李卓霖; 宋晓国; 董红杰; 赵一璇; 冯吉才 2017-02 期刊名称《金属学报》细晶铝合金低温超声辅助 TLP 钎焊工艺及机理王健; 杨晓雨; 李卓霖*; 王浩然; 武晓伟; 宋晓国 2021-10-12 期刊名称《航空学报》