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H. Xu, V.Vuorinen, H. Dong, M. Paulasto-Kr?ckel. Solid-State Reaction of Electroplated Thin Film Au/Sn Couple at low Temperatures. Journal of Alloy and Compounds. 2015, 619(1): 325–331.
A. Rautiainen, H. Xu; E.?sterlund, J. Li, V.Vuorinen, M.Paulasto-Kr?ckel. Mechanical characterization of wafer level SLID bonded Au-Sn and Cu-Sn seal rings for MEMS encapsulation. Journal of Electronic Materials2015,44(11):4533-4548
H. Xu, T. Suni, V. Vuorinen, J. Li, H. Heikkinen, P. Monnoyer, M. Paulasto-Kr?ckel. Wafer-level SLID bonding for MEMS encapsulation. Advances in Manufacturing (2013) 1(3):226-235.
J. Hokka, T. T. Mattila, H. Xu, M. Paulasto-Kr?ckel. Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections—Part 2: Failure Mechanisms. Journal of Electronic Materials. 2013, 42(6), 963-972.
J. Hokka, T. T. Mattila, H. Xu, M. Paulasto-Kr?ckel. Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections. Part 1: Effects of Test Parameters. Journal of Electronic Materials. 2013, 42(6), 1171-1183. J. Li, H. Xu, J. Hokka, T. T.Mattila, H. Chen, M. Paulasto-Kr?ckel. Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests. Soldering & Surface Mount Technology, 2011. 23(3), 161-167.
J. Li, H. Xu, T. T. Mattila, J. K. Kivilahti, T. Laurila, M. Paulasto-Kr?ckel. Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling. Computational Materials Science, 2010, 50(2), 690-697.
J. Li, T. T. Mattila, H. Xu, M. Paulasto-Kr?ckel. FEM simulations for reliability assessment of component boards drop tested at various temperatures. Simulation Modelling Practice and Theory, vol. 18, pp. 1355-1364, 2010.
H. Xu, M. Li, Y. Fu, L. Wang, J. Kim. Local melt process of solder bumping by induction heating reflow. Soldering and Surface Mount Technology. 2009, 21(4): 45-54. (Highly Commended Award from Emerald)
H. Xu, M. Li, H. Chen, Y. Fu, L. Wang. Lead-free Bumping Using an Alternating Electromagnetic Field. Journal of Electronic Materials. 2009, 38(5): 663-669.
H. Xu, M. Li, J. Kim, Da. Kim. Local melting and shape controlling of solder joint via induction heating. Journal of Materials Processing Technology. 2009, 209(6): pp. 2781-2787.
H. Xu, M. Li, Y. Fu, L. Wang, J. Kim. Geometry Control of Solder Interconnects via Induction Heating. Soldering and Surface Mount Technology. 2009, 21(1): 25–30.
M. Li, H. Xu, S. W. R. Lee, J. Kim, D. Kim. Eddy current induced heating for the solder reflow of area array packages. IEEE Transactions on Advanced Packaging. 2008, 31 (2): pp. 399-403.
H. Xu, M. Li, J. Kim, H. Kim, D. Kim. Study on induction spontaneous heating reflow. Materials Science Forum, 2008, 580-582: 167-172.
M. Li, H. Xu, J. Kim, D. Kim. Failure modes of lead free solder bumps formed by induction spontaneous heating reflow. Journal of Materials Science and Technology, 2007, 23(1): 61-67.
H. Xu, M. Li, J. Kim, D. Kim. Interfacial Reaction and Shear Properties of Lead-free Sn3.5Ag Solder Bumps Reflowed by Induction Self Heating, 纳米技术与精密工程, 2007, 5(3): 157-163.
国际会议
H. Xu, A. Rautiainen, V. Vuorinen, E. ?sterlund and M. Paulasto-Kr?ckel. Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS. 5th Electronics System-Integration Technology Conference (ESTC2014), Helsinki, Finland. 2014.
G. Ross, H. Xu, V. Vuorinen, M. Paulasto-Kr?ckel. Void formation in Cu-Sn SLID Bonding for MEMS. 5th Electronics System-Integration Technology Conference (ESTC2014), Helsinki, Finland. 2014.
T. Suni, H. Xu, H. Heikkinen, V. Vuorinen, A. Jaakkola, J. Dekker, P. Monnoyer, and M. Paulasto-Kr?ckel. Wafer level MEMS encapsulation using SLID bonding. Presented at Waferbond’13 conference in Stockholm on Dec. 6th. Waferbond’13, book of abstracts, 2013: 105-106.
H. Xu, M. Broas, H. Dong, V. Vuorinen, T. Suni, S. V?h?nen, H. Heikkinen, P. Monnoyer, M. Paulasto-Kr?ckel. Reliability of wafer-level SLID bonds for MEMS encapsulation. European Microelectronics and Packaging Conference 2013 (EMPC 2013), Grenoble, France. 2013.
T. Suni, H. Xu, V. Vuorinen, H. Heikkinen, S. V?h?nen, A. Jaakkola, P. Monnoyer, and M. Paulasto-Kr?ckel. Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation. European Microelectronics and Packaging Conference 2013 (EMPC 2013), Grenoble, France. 2013.
V. Vuorinen, H. Dong, H. Xu, S. V?h?nen, T. Suni, T. Laurila, M. Paulasto-Kr?ckel. Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices. ESTC 4th Electronic System-Integration Technology Conference (ESTC2012). Amsterdam, Netherlands. 2012.
T. T. Mattila, H. Xu, O. Ratia, M. Paulasto-Kr?ckel. Effects of Thermal Cycling Parameters on Lifetimes and Failure Mechanism of Solder Interconnections. The 60th Electronic Components and Technology Conference (ECTC). Las Vegas, USA. 2010: 581-590.
L. Wang, H. Xu, M. Yang, M. Li, Y. Fu. Dramatic Morphological Change of Interfacial Prism-type Cu6Sn5 in the Sn3. 5Ag/Cu Joints Reflowed by Induction Heating. International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP). Beijing, China. 2009: 843-846.
H.Xu, M. Li. Lead-Free Soldering Technique by Using Medium-Frequency Electromagnetic Field. 10th Electronics Packaging Technology Conference, Singapore, 2008: 1351-1357.
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