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[1]李晓娜.Cuboidal γ'phase coherent precipitation-strengthened Cu–Ni–Al alloys with high softening tempe...[J],Acta Materialia,2021,203:116458-
[2]李晓娜.Performance and local structure evolution of NbMoTaWV entropy-stabilized oxide thin films with va...[J],Surface and Coatings Technology,2021,402:126326-
[3]李晓娜.Synergistic reinforcement of Cu–Ni–Al films with dual nanostructure[J],Surface Engineering,2021
[4]Li, Z. M.,Dong, C.,Li, X. N.,Wang, C. Y.,Zheng, Y. H.,Yu, Q. X.,Cheng, X. T.,Li, N. J.,Bi, L. X.,Wang, Q..Comparative studies on microstructures and properties of Cu-Ni-M alloys controlled by strong in...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2019,805:404-414
[5]Xiaona Li,Bing Hu,Chuang Dong,Xin Jiang.Structural evolution upon annealing of multi-layer Si/Fe thin films prepared by magnetron sputt...[A],2007,561-565(PART 2):1161-1164
[6]Li, Hongming,Dong, Chuang,Zhao, Yajun,Li, Xiaona,Zhou, Dayu.Quantitative Correlation between Electrical Resistivity and Microhardness of Cu-Ni-Mo Alloys vi...[J],JOURNAL OF ELECTRONIC MATERIALS,2019,48(1):312-320
[7]Li, X. N.,Li, Z. M.,Cheng, X. T.,Sun, W.,Zheng, Y. H.,Yu, Q. X.,Wang, C. Y.,Wang, Q.,Dong, C..Precipitation evolution in Cu-x[Ni3Cr1] spinodal alloys under mismatch control[J],MATERIALS CHEMISTRY AND PHYSICS,2019,223:486-493
[8]Yu, Q. X.,Dong, C.,Li, X. N.,Wei, K. R.,Li, Z. M.,Zheng, Y. H.,Li, N. J.,Cheng, X. T.,Wang, C. Y.,Wang, Q..Cu-Ni-Sn-Si alloys designed by cluster-plus-glue-atom model[J],MATERIALS & DESIGN,2019,167
[9]Cheng, Xiaotian,Zhang, Yuanyuan,Li, Xiaona,Li, Zhumin,Yu, Qingxiao,Zheng, Yuehong,Wang, Chenyu,Dong, Chuang.Microstructure evolution and strengthening mechanism of Cu-x[Ni3Mo] alloys[J],MATERIALS SCIENCE AND TECHNOLOGY,2019,35(1):98-106
[10]Zheng, Yuehong,Li, Xiaona,Cheng, Xiaotian,Li, Zhuming,Liu, Yubo,Dong, Chuang.Enhanced thermal stability of Cu alloy films by strong interaction between Ni and Zr (or Fe)[J],JOURNAL OF PHYSICS D-APPLIED PHYSICS,2018,51(13)
[11]Zheng, Y. H.,Liu, M.,Liu, Y. B.,Wang, M.,Dong, C.,Li, X. N.,Cheng, X. T.,Sun, W..Ni-V(or Cr) Co-addition Cu alloy films with high stability and low resistivity[J],MATERIALS CHEMISTRY AND PHYSICS,2018,205:253-260
[12]Li, X. N.,Zheng, Y. H.,Liu, Y. B.,Wang, C. Y.,Li, Z. M.,Yu, Q. X.,Dong, C..Effects of adding elements M (M = C, B, Mn, Al and Al plus Co) on stability of amorphous semico...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(12):10550-10560
[13]李晓娜,董闯.Enhanced thermal stability of Cu alloy films by strong in teraction between Ni an d Zr (or Fe)[J],JOURNAL OF PHYSICS D-APPLIED PHYSICS,2018,51(13):135304-
[14]邓德伟,刘倩倩,李晓娜,于涛,张林,王罡,张洪潮.脉冲电流对再制造毛坯裂纹尖端组织及性能的影响[J],稀有金属材料与工程,2017,46(08):2208-2213
[15]Li, X. N.,Liu, M.,Zheng, Y. H.,Sun, W.,Dong, C..Addition of strong interaction element Fe(or Sn) to improve the stability of solid solution Cu(...[J],SURFACE & COATINGS TECHNOLOGY,2017,321:328-335
[16]Li, Xiaona,Jin, Lujie,Zheng, Yuehong,Wang, Qing,Dong, Chuang.Composition range of semiconducting amorphous Fe-Si thin films interpreted using a cluster-base...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,706:495-501
[17]Zheng, Yuehong,Li, Xiaona,Liu, Yubo,Sun, Wei,Dong, Chuang.Preparation and characterization of CuN-based ternary alloy films using Cr or Zr for stabilizin...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(7):1333-1342
[18]Li, Hongming,Zhao, Yajun,Li, Xiaona,Zhou, Dayu,Dong, Chuang.Electrical resistivity interpretation of ternary Cu-Ni-Mo alloys using a cluster-based short-ra...[J],JOURNAL OF PHYSICS D-APPLIED PHYSICS,2016,49(3)
[19]Deng, Dewei,Chen, Rui,Sun, Qi,Li, Xiaona.Microstructural Study of 17-4PH Stainless Steel after Plasma-Transferred Arc Welding[J],MATERIALS,2015,8(2):424-434
[20]李晓娜,董闯.Effects of distribution and growth orientation of precipitates on oxidation resistance of Cu–Cu1...[J],J. Mater. Res.,,2015,30(21)
[21]Li, Xiaona,Ding, Jianxin,Wang, Miao,Chu, Jinn P.,Dong, Chuang.Application of cluster-plus-glue-atom model to barrierless Cu-Ni-Ti and Cu-Ni-Ta films[J],JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A,2014,32(6)
[22]Li, X. N.,Ding, J. X.,Xu, L. Y.,Bao, C. M.,Chu, J. P.,Dong, C..Carbon-doped Cu films with self-forming passivation layer[J],SURFACE & COATINGS TECHNOLOGY,2014,244:9-14
[23]Li, X. N.,Zhao, L. R.,Bao, C. M.,Chu, J. P.,Dong, C.,Wang, M..Thermal stability of barrierless Cu-Ni-Sn films[J],APPLIED SURFACE SCIENCE,2014,297:89-94
[24]李晓娜,董闯.Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films[J],Advanced Materials Research,2014,52(10):163-168
[25]李晓娜,李震,董闯.基于团簇模型设计的Cu-Cu12-[Mx/(12+x)Ni12/(12+x)]5 (M = Si, Cr,Cr+Fe) 合金抗高温氧化研究[J],物理学报,2014,63(2)
[26]Li, Xiao Na,Zhao, Li Rong,Li, Zhen,Liu, Li Jun,Bao, Cui Min,Chu, Jinn P.,Dong, Chuang.Barrierless Cu-Ni-Nb thin films on silicon with high thermal stability and low electrical resis...[J],JOURNAL OF MATERIALS RESEARCH,2013,28(24):3367-3373
[27]李晓娜,赵丽荣,李震,刘立筠,包翠敏,朱瑾,董闯.Barrierless Cu–Ni–Nb thin films on silicon with high thermal[J],J. Mater. Res.,2013,28(24):3367-3373
[28]Li, X. N.,Dong, C.,Wang, Q.,Chu, J. P.,Zhang, X. Y.,Liu, L. J..Barrierless Cu-Ni-Mo Interconnect Films with High Thermal Stability Against Silicide Formation[J],JOURNAL OF ELECTRONIC MATERIALS,2012,41(12):3447-3452
[29]李晓娜,刘立筠,张心怡,朱瑾,王清,董闯.Barrierless Cu-Ni-Mo Interconnect Films with High Thermal[J],Journal of ELECTRONIC MATERIALS,2012,41(12):3447-3452
[30]Li Xiao-Na,Zheng Yue-Hong,Li Sheng-Bin,Dong Chuang.beta-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering[J],ACTA PHYSICA SINICA,2012,61(24)
[31]Li X.-N.,Zheng Y.-H.,Li S.-B.,Dong C..-Fe3Si8M ternary alloy thin films prepared by magnetron sputtering[J],Wuli Xuebao/Acta Physica Sinica,2012,61(24)
[32]Zhang, X. Y.,Li, X. N.,Nie, L. F.,Chu, J. P.,Wang, Q.,Lin, C. H.,Dong, C..Highly stable carbon-doped Cu films on barrierless Si[J],APPLIED SURFACE SCIENCE,2011,257(8):3636-3640
[33]Li, X. N.,Li, S. B.,Nie, L. F.,Li, H.,Dong, C.,Jiang, X..Preparation of amorphous FexSi(1-x) film using unbalanced magnetron sputtering[J],THIN SOLID FILMS,2010,518(24,SI):7390-7393
[34]Nie, L. F.,Li, X. N.,Chu, J. P.,Wang, Q.,Lin, C. H.,Dong, C..High thermal stability and low electrical resistivity carbon-containing Cu film on barrierless ...[J],APPLIED PHYSICS LETTERS,2010,96(18)
[35]李晓娜.The Preparation for Cu(Sn) Films of Barrierless Interconnection[J],Materials Science Forum,2010,654(6):1744-1747
[36]Fang, Yuanyuan,Li, Xiaona,Qi, Lin,Li, Dongming,Zhao, Jie.The effect of thermal aging on tensile property of HR3C steel[A],2009,343-346
[37]Li X.-N.,Nie D.,Dong C.,Ma T.-C.,Jin X.,Zhang Z..Microstructure of -FeSi2 film synthesized by ion implantation[J],Wuli Xuebao/Acta Physica Sinica,2002,51(1):123-124
[38]Yuehong Zheng, Chuang Dong, Kun Zhang, Lujie Jin, Xiaona Li,Yuehong Zheng.Effects of distribution and growth orientation of precipitates on oxidation resistance of Cu-Cu12...[J],Journal of Materials Research,2015,30(2)
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