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个人简介

黄明亮,教授/博导,第三批国家(国家高层次人才特殊支持计划)领军人才;科技部创新人才推进计划—中青年科技创新领军人才;德国洪堡学者。现任大连理工大学电子封装材料研究所所长,先进连接技术辽宁省重点实验室副主任。 长期从事电子制造微互连技术研究。1992年、1995年、2001年毕业于大连理工大学,分别获学士、硕士、博士学位。从博士论文起开展电子封装中绿色环保无铅钎料与先进互连技术的研究,曾在德国弗劳恩霍夫可靠性与微系统集成研究院(Fraunhofer IZM)芯片互连与先进封装部、韩国科学技术院(KAIST)电子封装材料中心、香港城市大学(CityU)电子封装与组装中心进行合作研究工作。原创性建立了电子制造微互连技术中无铅界面反应尺寸效应的CGC理论模型,解决了微互连制造中尺寸效应带来的技术难题并在航天、军工关键工程项目上成功获得应用;技术也服务于华为等民族企业。 中国电子学会电子制造与封装分会(电子封装专委会)理事、无铅电子制造战略联盟理事、中国机械工程学会失效分析专家、美国TMS(矿物金属材料)学会会员、美国IEEE(电气和电子工程师协会)会员。作为第一完成人荣获中国材料研究学会科学技术一等奖1项、国家教育部自然科学二等奖1项、辽宁省自然科学二等奖1项、辽宁省技术发明二等奖1项。

研究领域

电子制造微互连技术 航天电子产品可靠性评估 LED倒装芯片封装技术 功能材料 绿色环保无铅钎料合金

近期论文

查看导师新发文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

[1]Zhang, Shuye,Huang, Mingliang,Wu, Yang,Yang, Ming,Lin, Tiesong,He, Peng,Paik, Kyung-Wook.A Study on the Oxygen Plasma Treatment on the Peel Adhesion Strength and Solder Wettability of SnB[A],2019,2019-May:2022-2028 [2]M.L. Huang,J.M. Kuang,H.Y. Sun.Electromigration-induced β-Sn grain rotation in lead-free flip chip solder bumps[A],2019,2036-2041 [3]Chunyan Lu,Feifei Huang.Effects of Electroplating Process Parameters on Properties of Co-electroplated Au-Sn alloy[A],2019,1-5 [4]Zhijie Zhang.Abnormal migration behavior and segration mechanism of Bi atoms undergoing liquid-solid electromigra[J],Journal Materials Science,2019,54:7975-7986 [5]Kunwar, Anil,Ma, Haoran,Ma, Haitao,Sun, Junhao,Zhao, Ning,Huang, Mingliang.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg solde[J],MATERIALS LETTERS,2018,230:76-76 [6]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Wang, Yunpeng,Zhao, Ning,Huang, Mingliang,Ma, Haitao.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972 [7]黄明亮,孙洪羽.倒装芯片无铅凸点β-Sn晶粒取向与电迁移交互作用[J],金属学报,2018,54(07):1077-1086 [8]Lv, Qipeng,Huang, Mingliang,Zhang, Shaoqian,Deng, Songwen,Gong, Faquan,Wang, Feng,Pan, Yanwei,Li, Gang,Jin, Yuqi.Effects of Annealing on Residual Stress in Ta2O5 Films Deposited by Dual Ion Beam Sputtering[J],COATINGS,2018,8(4) [9]Ma, Haoran,Kunwar, Anil,Liu, Zhiyuan,Chen, Jun,Wang, Yunpeng,Huang, Mingliang,Zhao, Ning,Ma, Haitao.Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and cooling d[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390 [10]Zhang, Shuye,Yang, Ming,Wu, Yang,Du, Jikun,Lin, Tiesong,He, Peng,Huang, Mingliang,Paik, Kyung-Wook.A Study on the Optimization of Anisotropic Conductive Films for Sn-3Ag-0.5Cu-Based Flex-on-Board A[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(3):383-391 [11]Zhang, Yahong,Duan, Yuping,Liu, Jia,Ma, Guojia,Huang, Mingliang.Wormlike Acid-Doped Polyaniline: Controllable Electrical Properties and Theoretical Investigation[J],JOURNAL OF PHYSICAL CHEMISTRY C,2018,122(4):2032-2040 [12]Ren, Jing,Huang, Mingliang,Yang, Xudong.Effect of Ag element on microstructure and mechanical properties of Sn-Bi-xAg solders designed by [A],2018,265-269 [13]Huang, M. L.,Zou, L.,Yin, S. Q..Electromigration Behavior and Mechanical Properties of the Whole Preferred Orientation Intermetall[A],2018,2018-May:2041-2048 [14]Guo, Bingfeng,Kunwar, Anil,Jiang, Chengrong,Zhao, Ning,Sun, Junhao,Chen, Jun,Wang, Yunpeng,Ma, Haitao,Huang, Mingliang.Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni subst[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601 [15]A. Nylander,Y.F. Fu,M.L. Huang,J. Liu.Covalent anchoring of carbon nanotube based thermal interface materials using epoxy silane monolayer[J],IEEE Transaction on Components,2018,6(1):1-8 [16]Mingliang Huang,Lin Zou,SiQi Yin.Electromigration behavior and mechanical properties of the whole preferred orientation intermetallic[A],2018,2035-2042 [17]Lv, Qipeng,Huang, Mingliang,Deng, Songwen,Zhang, Shaoqian,Li, Gang.Effects of oxygen flows on optical properties, micro-structure and residual stress of Ta2O5 films [J],OPTIK,2018,166:278-284 [18]Yin, Siqi,Huang, Mingliang,Chen, Yu.Effect of In addition on the properties of Sn-Au-Cu lead-free solder[A],2018,1363-1367 [19]Kuang, Jiameng,Huang, Mingliang.Effect of Soldering Sequences on Cu-Ni interaction in flip-chip interconnects[A],2018,1368-1371 [20]Ma, Haitao,Ma, Haoran,Kunwar, Anil,Shang, Shengyan,Wang, Yunpeng,Chen, Jun,Huang, Mingliang,Zhao, Ning.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders during[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613

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