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黄自德,许富民,郭素墨,董伟.2219铝合金再结晶行为研究[J],热加工工艺,2019,47(24):211-214
董伟,李文畅,许富民,韩阳,张伟.单分散铁基Fe60Ni7.5Mo7.5P10C10B5金属玻璃球形粒子的制备及评价[J],材料工程,2018,46(10):30-36
Hu, Ying-yan,Yue, Wen,Li, Jian-qiang,Dong, Wei,Li, Can,Ma, Bing-qian,Liu, Chao,Han, Jian-jun.Preparation and characterization of monosized Cu-Sn spherical alloy particles by pulsated orifi...[J],JOURNAL OF MATERIALS RESEARCH,2018,33(18):2835-2843
Zhong, Y.,Zhao, N.,Dong, W.,Wang, Y. P.,Ma, H. T..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
董伟,李文畅,康世薇,许富民,韩阳,白兆丰.脉冲微孔喷射法单分散球形微粒子的制备及其应用[J],材料工程,2018,46(2):142-151
Zhong, Yi,Zhao, Ning,Dong, Wei,Wang, Yunpeng,Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
Zhong, Y.,Zhao, N.,Liu, C. Y.,Dong, W.,Qiao, Y. Y.,Wang, Y. P.,Ma, H. T..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
Zhong, Yi,Zhao, Ning,Dong, Wei,Ma, Haitao,Huang, Mingliang,Yin, Luqiao,Wong, Chingping.Coupling effect of thermomigration and cross-interaction on evolution of intermetallic compound...[J],JOURNAL OF MATERIALS RESEARCH,2017,32(16):3128-3136
Zhao, N.,Zhong, Y.,Dong, W.,Huang, M. L.,Ma, H. T.,Wong, C. P..Formation of highly preferred orientation of beta-Sn grains in solidified Cu/SnAgCu/Cu micro in...[J],APPLIED PHYSICS LETTERS,2017,110(9)
Zhong, Y.,Zhao, N.,Ma, H. T.,Dong, W.,Huang, M. L..Retardation of thermomigration-induced Cu substrate consumption in Pb-free solder joints by Zn ...[J],JOURNAL OF ALLOYS AND COMPOUNDS,2017,695:1436-1443
Zhong, Y.,Zhao, N.,Ma, H. T.,Dong, W.,Huang, M. L.,Wong, C. P..Low temperature Ni/Sn/Ni transient liquid phase bonding for high temperature packaging applicat...[A],2017,0:411-416
Zhong, Yi,Zhao, Ning,Dong, Wei,Ma, Haitao,Wang, Yunpeng,Wong, Ching-Ping.Formation of preferred orientation of Cu6Sn5 grains in Cu/Sn/Cu interconnects by soldering unde...[A],2017,1438-1441
赵宁,黄明亮,马海涛,董伟.Formation of highly preferred orientation of β-Sn grains in solidified Cu/SnAgCu/Cu micro interc...[J],Applied Physics Letters,2017,110(9):93504-
Zhao, N.,Zhong, Y.,Huang, M. L.,Ma, H. T.,Dong, W..Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects...[J],INTERMETALLICS,2016,79:28-34
董伟,魏宇婷,康世薇,盖如坤,许富民,鲁栋.基于脉冲微孔喷射的液滴沉积成型[J],材料工程,2016,44(10):1-7
Zhao, N.,Dong, W.,Ma, H. T.,Wang, Y. P.,Zhong, Y.,Huang, M. L..In situ study on interfacial reactions of Cu/Sn-9Zn/Cu solder joints under temperature gradient[J],JOURNAL OF ALLOYS AND COMPOUNDS,2016,682:1-6
Zhao, Ning,Zhong, Yi,Huang, Mingliang,Ma, Haitao,Dong, Wei.Synchrotron radiation in situ study on the solidification of Cu/Sn-58Bi/Cu solder joint under t...[A],2016,264-267
董伟,康世薇,魏宇婷,许富民,李鹏廷.脉冲微孔喷射技术及其在增材制造方面的应用[J],航空制造技术,2016,12:16-22
Zhong, Yi,Huang, Mingliang,Ma, Haitao,Dong, Wei,Wang, Yunpeng,Zhao, Ning.In situ study on Cu-Ni cross-interaction in Cu/Sn/Ni solder joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2016,31(5):609-617
Zhong, Yi,Huang, Mingliang,Deng, Jianfeng,Ma, Haitao,Dong, Wei,Zhao, Ning.STUDY ON PRECIPITATION AND DISSOLUTION OF INTERFACIAL CU6SN5 DURING THERMOMIGRATION[A],2016
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