个人简介
1994.9-1998.6 昆明理工大学,金属压力加工,工学学士
1998.7-2000.8 洛阳铜加工集团,助理工程师
2000.9-2003.4 昆明理工大学,材料学,工学硕士
2003.5-至今 常州大学材料学院,副教授
研究领域
1、纳米结构–功能金属材料
2、金属材料表面改性
3、材料成形加工技术及计算机模拟
近期论文
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1) Kun Xia Wei, Wei Wei, Fei Wang, Qing Bo Du, Igor V. Alexandrov, Jing Hu. Microstructure, mechanical properties and electrical conductivity of industrial Cu-0.5%Cr alloy processed by severe plastic deformation. Materials Science and Engineering, 2011, A528: 1478-1484(SCI/EI收录)
2) Kun Xia Wei, Wei Wei, Qing Bo Du, Jing Hu. Microstructure and tensile properties of Al-Mn alloy processed by Accumulative Roll-Bonding. Materials Science and Engineering, 2009, A525: 55-59(SCI/EI收录)
3) Kun Xia Wei, Wei Wei, Igor V. Alexandrov, Qing Bo Du, Jing Hu. Microstructure and Properties of Ultrafine Grained Cu-0.73%Cr Alloy after High Pressure Torsion. Advanced Materials Research, 2012, 391-392: 385-389(EI收录)
4) Wei Wei, Kun Xia Wei, Guo Jiang Fan. A new constitutive equation for strain hardening and softening of FCC metals during severe plastic deformation. Acta Mater., 2008, 56: 4771- 4779 (SCI/EI收录)
5) Wei Wei, Kun Xia Wei, Qing Bo Du. Corrosion and tensile behaviors of ultra-fine grained Al-Mn alloy produced by accumulative roll bonding. Materials Science and Engineering, 2007, A454-455: 536-541(SCI/EI收录)
6) Wei Wei, Kun Xia Wei, Qing Nan Shi. Grain refinement of copper sheets through accumulative roll-bonding process at room temperature. The 2006 TMS Annual Meeting, San Antonio, TX, USA. pp. 209-214(EI收录)
7) Wei Wei, Ren Yu Mao, Kun Xia Wei, Igor V. Alexandrov, Jing Hu. Effect of equal channel angular pressing on microstructure and grain refining performance of Al-5%Ti master alloy. Materials Science and Engineering A, 2013, 564: 92-96 (SCI/EI收录)
8) Wei Wei, Wei Zhang, Kun Xia Wei, Yi Zhong, Gang Cheng, Jing Hu. Finite element analysis of deformation behavior in continuous ECAP process. Materials Science and Engineering, 2009, A516: 111-118(SCI/EI收录)
9) 魏坤霞, 魏伟, 王乃策. 超细晶铝合金化学镀镍研究. 表面技术, 2007, 36(1): 48-50
10)魏坤霞, 赵昆渝, 魏伟, 朱心昆. 低温燃烧合成制备非晶氧化铝及其晶型转变. 兵器材料科学与工程, 2005, 28(2): 41-44