当前位置: X-MOL首页全球导师 海外导师 › Huang, Yonggang

个人简介

Education Ph.D. Engineering Science Harvard University, Cambridge, MA M.S. Engineering Science Harvard University, Cambridge, MA B.S. Mechanics Peking University, Beijing, China Significant Recognition Member, National Academy of Engineering Foreign Member, Academia Europaea Foreign Member, Chinese Academy of Sciences Member, European Academy of Arts and Sciences von Karman Medal, American Society of Civil Engineers, 2019 Bazant Medal, American Society of Civil Engineers, 2018 Prager Medal, Society of Engineering Sciences, 2017 Nadai Medal, American Society of Mechanical Engineers, 2016 Drucker Medal, American Society of Mechanical Engineers, 2013 Richards Award, American Society of Mechanical Engineers and Pi Tau Sigma (National Mechanical Engineering Honor Society), 2010 Guggenheim Fellowship, John Simon Guggenheim Memorial Foundation, 2008 Significant Professional Service Technical Editor, Journal of Applied Mechanics (ASME Transactions), 2012- Editor in Chief, Theoretical and Applied Mechanics Letters, 2011-

研究领域

Yonggang Huang is the Walter P. Murphy Professor of Mechanical Engineering, Civil and Environmental Engineering, and Materials Science and Engineering at Northwestern University. He is interested in mechanics of stretchable and flexible electronics, and deterministic 3D assembly. He has published 2 books and more than 500 journal papers, including 10 in Science and 5 in Nature. He is a member of US National Academy of Engineering, a foreign member of Academia Europaea, and a foreign member of Chinese Academy of Sciences. His recent research awards since 2008 include the Guggenheim Fellowship from the John Simon Guggenheim Foundation in 2008; Richards Award in 2010, Drucker Medal in 2013, Nadai Medal in 2016 and Thurston Lecture Award in 2019 from the American Society of Mechanical Engineers (ASME); Prager Medal in 2017 from the Society of Engineering Sciences; Bazant Medal in 2018 and von Karman Medal in 2019 from American Society of Civil Engineers. He is a Highly Cited Researcher in Engineering (2009) and, in Materials Science (2014-), and in Physics (2018-). His recognitions for undergraduate teaching and advising since 2016 include the Cole-Higgins Award for Excellence in Teaching, McCormick School of Engineering, Northwestern University in 2016; and Associated Student Government Faculty and Administrator Honor Roll, Northwestern University, 2018-2019. He is the Editor of Journal of Applied Mechanics (Transactions of ASME), a member of the Executive Committee of the ASME Applied Mechanics Division (Chair, 2019-2020).

近期论文

查看导师新发文章 (温馨提示:请注意重名现象,建议点开原文通过作者单位确认)

Chung et al., “Binodal, wireless epidermal electronic systems with in-sensor analytics for neonatal intensive care,” Science, v 363, article eaau0780, 2019. Mickle et al., "A wireless closed-loop system for optogenetic peripheral neuromodulation," Nature, v 565, pp 361-365, 2019. Kang et al., “Bioresorbable silicon sensors for the brain,” Nature, v 530, pp 71-76, 2016. Kang S-K, Murphy RKJ, Hwang S-W, Lee SM, Harburg DV, Krueger NA, Shin JH, Gamble P, Cheng HY, Yu SY, Liu ZJ, McCall JG, Stephen M, Ying HZ, Kim JH, Park G, Webb RC, Lee CH, Chung SJ, Wie DS, Gujar AD, Vemulapalli B, Kim AH, Lee K-M, Cheng JJ, Huang Y, Lee SH, Braun PV, Ray WZ, and Rogers JA, “Bioresorbable silicon sensors for the brain,” Nature, v 530, pp 71-76, 2016. Xu S, Yan Z, Jang KI, Huang W, Fu HR, Kim JH, Wei ZJ, Flavin M, McCracken J, Wang RH, Badea A, Liu Y, Xiao DQ, Zhou GY, Lee JW, Chung HU, Cheng HY, Ren W, Banks A, Li XL, Paik U, Nuzzo RG, Huang Y, Zhang YH, and Rogers JA, “Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling,” Science, v 347, pp 154-159, 2015. (cover feature article) Xu et al., “Assembly of micro/nanomaterials into complex, three-dimensional architectures by compressive buckling,” Science, v 347, pp 154-159, 2015. (cover feature article) Xu et al., “Soft microfluidic assemblies of sensors, circuits and radios for the skin,” Science, v 344, pp 70-74, 2014. Xu S, Zhang YH, Jia L, Mathewson KE, Jang K-I, Kim JH, Fu HR, Huang X, Chava P, Wang RH, Bhole S, Wang LZ, Na YJ, Guan Y, Flavin M, Han ZS, Huang Y, and Rogers JA, “Soft microfluidic assemblies of sensors, circuits and radios for the skin,” Science, v 344, pp 70-74, 2014. Kim T-I, McCall JG, Jung YH, Huang X, Siuda ER, Li YH, Song JZ, Song YM, Pao HA, Kim R-H, Lu CF, Lee SD, Song I-S, Shin GC, Al-Hasani R, Kim S, Tan MP, Huang Y, Omenetto FG, Rogers JA, and Bruchas MR, “Injectable, cellular-scale optoelectronics with applications for wireless optogenetics,” Science, v 340, pp 211-216, 2013. Song YM, Xie YZ, Malyarchuk V, Xiao JL, Jung IH, Choi K-J, Liu ZJ, Park HS, Lu CF, Kim R-H, Li R, Crozier KB, Huang Y, and Rogers JA, “Digital cameras with designs inspired by the arthropod eye,” Nature, v 497, pp 95-99, 2013 (cover feature article). Kim et al., “Injectable, cellular-scale optoelectronics with applications for wireless optogenetics,” Science, v 340, pp 211-216, 2013. Song et al., “Digital cameras with designs inspired by the arthropod eye,” Nature, v 497, pp 95-99, 2013 (cover feature article). Hwang et al., “A physically transient form of silicon electronics,” Science, v 337, pp 1640-1644, 2012 (cover feature article). Kim et al., "Epidermal electronics," Science, v 333, pp 838-843, 2011. Rogers JA, Someya T, and Huang Y, "Materials and mechanics for stretchable electronics," Science, v 327, pp 1603-1607, 2010 (review article). Park et al., "Printed assemblies of inorganic light-emitting diodes for deformable and semitransparent displays," Science, v 325, pp 977-981, 2009. Kim et al., "Stretchable and foldable silicon integrated circuits," Science, v 320, pp 507-511, 2008 (Inner cover feature article). Ko et al., "A hemispherical electronic eye camera based on compressible silicon optoelectronics," Nature, v 454, pp 748-753, 2008 (cover feature article). Khang et al., “A stretchable form of single crystal silicon for high performance electronics on rubber substrates,” Science, v 311, pp 208-212, 2006.

推荐链接
down
wechat
bug